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Ann Arbor, MI, US
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Patents Grants
last 30 patents
Information
Patent Grant
MEMS isolation platform with three-dimensional vibration and stress...
Patent number
10,611,628
Issue date
Apr 7, 2020
EPACK, INC.
Sangwoo Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
System with oven control and compensation for detecting motion and/...
Patent number
10,386,385
Issue date
Aug 20, 2019
EPACK, INC.
Jay Mitchell
B81 - MICRO-STRUCTURAL TECHNOLOGY
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Patents Applications
last 30 patents
Information
Patent Application
SYSTEM WITH OVEN CONTROL AND COMPENSATION FOR DETECTING MOTION AND/...
Publication number
20200025795
Publication date
Jan 23, 2020
EPACK, INC.
Jay MITCHELL
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
VIBRATION ISOLATOR PLATFORM WITH ELECTRONIC ACCELERATION COMPENSATION
Publication number
20190256348
Publication date
Aug 22, 2019
EPACK, INC.
Jay MITCHELL
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SPACE-EFFICIENT PLANAR INTERPOSER FOR ENVIRONMENT-RESISTANT PACKAGING
Publication number
20190241428
Publication date
Aug 8, 2019
EPACK, INC.
Jay MITCHELL
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
MEMS ISOLATION PLATFORM WITH THREE-DIMENSIONAL VIBRATION AND STRESS...
Publication number
20180230005
Publication date
Aug 16, 2018
EPACK, INC.
Sangwoo LEE
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
SYSTEM WITH OVEN CONTROL AND COMPENSATION FOR DETECTING MOTION AND/...
Publication number
20170122976
Publication date
May 4, 2017
EPACK, INC.
Jay MITCHELL
G01 - MEASURING TESTING
NSF Awards
last 12 months
processing...
Count: 4
NSF Awards
Information
NSF Award
SBIR Phase II: A High Performance Environment Resistant Inertial Me...
Award Id
1431016
Effective date
Aug 1, 2014
Information
NSF Award
SBIR Phase I: A MEMS Environment Resistant Resonant Sensor (ERRS) P...
Award Id
1248433
Effective date
Jan 1, 2013
Information
NSF Award
Small-Business ERC Collaborative Opportunity Package Prototyping of...
Award Id
1246145
Effective date
Oct 1, 2012
Information
NSF Award
SBIR Phase I: A Universal Wafer-Level Capping Process for MEMS and...
Award Id
0945795
Effective date
Jan 1, 2010