ESEC, TRADING SA

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CH-6630 CHAM, CH

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus for mounting semiconductor chips
- Patent number 7,284,318
- Issue date Oct 23, 2007
- ESEC, Trading SA
- Dominik Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder
- Patent number 7,159,751
- Issue date Jan 9, 2007
- ESEC Trading SA
- Dieter Vischer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting semiconductors
- Patent number 7,146,718
- Issue date Dec 12, 2006
- ESEC Trading SA
- Silvan Thuerlemann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for mounting semiconductors
- Patent number 7,120,995
- Issue date Oct 17, 2006
- ESEC Trading SA
- Dieter Vischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonder with a device for determining the vectorial distance be...
- Patent number 7,108,167
- Issue date Sep 19, 2006
- ESEC Trading SA
- Roland Adorni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for checking the quality of a wedge bond
- Patent number 7,080,771
- Issue date Jul 25, 2006
- ESEC Trading SA
- Jonathan Medding
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for placing a semiconductor chip as a flipchip on a subst...
- Patent number 7,020,954
- Issue date Apr 4, 2006
- ESEC Trading SA
- Dominik Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for determining optimum bond parameters when bonding with a...
- Patent number 7,004,372
- Issue date Feb 28, 2006
- ESEC Trading SA
- Michael Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Clamping element with an integrated force sensor
- Patent number 6,993,986
- Issue date Feb 7, 2006
- ESEC Trading SA
- Peter Hess
- G01 - MEASURING TESTING
Information Patent Grant
Device for the metered delivery of a viscous liquid
- Patent number 6,935,539
- Issue date Aug 30, 2005
- ESEC Trading SA
- Matthias Krieger
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Device for measuring the amplitude of the tip of an oscillating cap...
- Patent number 6,931,932
- Issue date Aug 23, 2005
- ESEC Trading SA
- Martin Melzer
- G01 - MEASURING TESTING
Information Patent Grant
Method for determining optimum bonding parameters for bonding with...
- Patent number 6,929,168
- Issue date Aug 16, 2005
- ESEC Trading SA
- Michael Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting semiconductor chips
- Patent number 6,898,481
- Issue date May 24, 2005
- ESEC Trading SA
- Eugen Mannhart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for determining the vectorial distance between th...
- Patent number 6,857,554
- Issue date Feb 22, 2005
- ESEC Trading SA
- Peter Hess
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for mounting semiconductor chips
- Patent number 6,839,958
- Issue date Jan 11, 2005
- ESEC Trading SA
- Eugen Mannhart
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method and apparatus for mounting semiconductor chips onto a flexib...
- Patent number 6,821,375
- Issue date Nov 23, 2004
- ESEC Trading SA
- René Josef Ulrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for the transport and equipping of substrates with semico...
- Patent number 6,820,793
- Issue date Nov 23, 2004
- ESEC Trading SA
- Daniel Kellenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for dispensing solder on a substrate
- Patent number 6,811,074
- Issue date Nov 2, 2004
- ESEC Trading SA
- Guido Suter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the calibration of a wire bonder
- Patent number 6,739,496
- Issue date May 25, 2004
- ESEC Trading SA
- Michael Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device with an electrode for the formation of a ball at the end of...
- Patent number 6,739,493
- Issue date May 25, 2004
- ESEC Trading SA
- Silvan Thuerlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device with electrodes for the formation of a ball at the end of a...
- Patent number 6,739,494
- Issue date May 25, 2004
- ESEC Trading SA
- Armin Felber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the metered delivery of a viscous liquid
- Patent number 6,705,845
- Issue date Mar 16, 2004
- ESEC Trading SA
- Matthias Krieger
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Method and device for measuring the amplitude of a freely oscillati...
- Patent number 6,691,574
- Issue date Feb 17, 2004
- ESEC Trading SA
- Peter Hess
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Grant
Pressure transducer
- Patent number 6,681,797
- Issue date Jan 27, 2004
- ESEC Trading SA
- Eugen Mannhart
- G05 - CONTROLLING REGULATING
Information Patent Grant
Pick-up tool
- Patent number 6,675,465
- Issue date Jan 13, 2004
- ESEC Trading SA
- René Josef Ulrich
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for the calibration of a wire bonder
- Patent number 6,648,205
- Issue date Nov 18, 2003
- ESEC Trading SA
- Michael Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for mounting semiconductor chips
- Patent number 6,648,215
- Issue date Nov 18, 2003
- ESEC Trading SA
- Felix Leu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die bonder and/or wire bonder with a device for holding down a subs...
- Patent number 6,585,145
- Issue date Jul 1, 2003
- ESEC Trading SA
- Stefan Behler
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pressure sensor with means for re-calibration
- Patent number 6,581,436
- Issue date Jun 24, 2003
- ESEC Trading SA
- Eugen Mannhart
- G01 - MEASURING TESTING
Information Patent Grant
Linear guide with an air bearing having provision for heating a sup...
- Patent number 6,571,461
- Issue date Jun 3, 2003
- ESEC Trading SA
- Urs Probst
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
Method for checking the quality of a wedge bond
- Publication number 20050029328
- Publication date Feb 10, 2005
- ESEC Trading SA
- Jonathan Medding
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for checking the quality of a wedge bond
- Publication number 20040256438
- Publication date Dec 23, 2004
- ESEC Trading SA
- Jonathan Medding
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonder
- Publication number 20040245314
- Publication date Dec 9, 2004
- ESEC Trading SA
- Dieter Vischer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonder with a device for determining the vectorial distance be...
- Publication number 20040200884
- Publication date Oct 14, 2004
- ESEC Trading SA
- Roland Adorni
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonder
- Publication number 20040182912
- Publication date Sep 23, 2004
- ESEC Trading SA
- Michael Leu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device for measuring the amplitude of the tip of an oscillating cap...
- Publication number 20040149038
- Publication date Aug 5, 2004
- ESEC Trading SA
- Martin Melzer
- G01 - MEASURING TESTING
Information Patent Application
Device for the metered delivery of a viscous liquid
- Publication number 20040104252
- Publication date Jun 3, 2004
- ESEC Trading SA, a Swiss Corporation
- Matthias Krieger
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Method for picking semiconductor chips from a foil
- Publication number 20040105750
- Publication date Jun 3, 2004
- ESEC Trading SA, a Swiss Corporation
- Daniel Bolliger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for determining optimum bond parameters when bonding with a...
- Publication number 20040079790
- Publication date Apr 29, 2004
- ESEC Trading SA
- Michael Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Clamping element with an integrated force sensor
- Publication number 20040025605
- Publication date Feb 12, 2004
- ESEC Trading SA, a Swiss Corporation
- Peter Hess
- G01 - MEASURING TESTING
Information Patent Application
Device with an electrode for the formation of a ball at the end of...
- Publication number 20040011849
- Publication date Jan 22, 2004
- ESEC Trading SA
- Silvan Thuerlemann
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device with electrodes for the formation of a ball at the end of a...
- Publication number 20030234271
- Publication date Dec 25, 2003
- ESEC Trading SA
- Armin Felber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for determining the vectorial distance between th...
- Publication number 20030178469
- Publication date Sep 25, 2003
- ESEC Trading SA
- Peter Hess
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and apparatus for dispensing solder on a substrate
- Publication number 20030168498
- Publication date Sep 11, 2003
- ESEC Trading SA, a Swiss Corporation
- Guido Suter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method and device for measuring the amplitude of a freely oscillati...
- Publication number 20030159514
- Publication date Aug 28, 2003
- ESEC Trading SA
- Peter Hess
- B06 - GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
Information Patent Application
Method for determining optimum bonding parameters for bonding with...
- Publication number 20030146265
- Publication date Aug 7, 2003
- ESEC Trading SA
- Michael Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for the calibration of a Wire Bonder
- Publication number 20030146267
- Publication date Aug 7, 2003
- ESEC Trading SA
- Michael Mayer
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Clamping element for flat work pieces
- Publication number 20030127872
- Publication date Jul 10, 2003
- ESEC Trading SA, a Swiss Corporation
- Eugen Mannhart
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
Pick-up tool for mounting semiconductor chips
- Publication number 20030115747
- Publication date Jun 26, 2003
- ESEC Trading SA, a Swiss Corporation
- Daniel Schnetzler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for mounting semiconductor chips
- Publication number 20030101576
- Publication date Jun 5, 2003
- ESEC Trading SA, a Swiss Corporation
- Dominik Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for the transport and equipping of substrates with semico...
- Publication number 20030022416
- Publication date Jan 30, 2003
- ESEC Trading SA, a Swiss Corporation
- Daniel Kellenberger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for the metered delivery of a viscous liquid
- Publication number 20030003005
- Publication date Jan 2, 2003
- ESEC Trading SA, a Swiss Corporation
- Matthias Krieger
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Application
Pressure sensor
- Publication number 20020178826
- Publication date Dec 5, 2002
- ESEC Trading SA, a Swiss Corporation
- Eugen Mannhart
- G01 - MEASURING TESTING
Information Patent Application
Pressure transducer
- Publication number 20020170600
- Publication date Nov 21, 2002
- ESEC Trading SA, a Swiss Corporation
- Eugen Mannhart
- G05 - CONTROLLING REGULATING
Information Patent Application
Apparatus for placing a semiconductor chip as a flipchip on a subst...
- Publication number 20020162217
- Publication date Nov 7, 2002
- ESEC Trading SA, a Swiss Corporation
- Dominik Hartmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for mounting semiconductor chips onto a flexib...
- Publication number 20020000294
- Publication date Jan 3, 2002
- ESEC Trading SA
- Rene Josef Ulrich
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
78229556 - TYPHOON
- Serial number 78229556
- Filing date Mar 25, 2003
- ESEC Trading SA
- 7 - Machines and machine tools
Information Trademark
78159072 - TSUNAMI
- Serial number 78159072
- Filing date Aug 29, 2002
- ESEC Trading SA
- 7 - Machines and machine tools

ESEC, TRADING SA

Organization

Patents Grantslast 30 patents

Apparatus for mounting semiconductor chips

Wire bonder

Apparatus for mounting semiconductors

Apparatus for mounting semiconductors

Wire bonder with a device for determining the vectorial distance be...

Method for checking the quality of a wedge bond

Apparatus for placing a semiconductor chip as a flipchip on a subst...

Method for determining optimum bond parameters when bonding with a...

Clamping element with an integrated force sensor

Device for the metered delivery of a viscous liquid

Device for measuring the amplitude of the tip of an oscillating cap...

Method for determining optimum bonding parameters for bonding with...

Apparatus for mounting semiconductor chips

Method and device for determining the vectorial distance between th...

Apparatus for mounting semiconductor chips

Method and apparatus for mounting semiconductor chips onto a flexib...

Apparatus for the transport and equipping of substrates with semico...

Method and apparatus for dispensing solder on a substrate

Method for the calibration of a wire bonder

Device with an electrode for the formation of a ball at the end of...

Device with electrodes for the formation of a ball at the end of a...

Device for the metered delivery of a viscous liquid

Method and device for measuring the amplitude of a freely oscillati...

Pressure transducer

Pick-up tool

Method for the calibration of a wire bonder

Method and apparatus for mounting semiconductor chips

Die bonder and/or wire bonder with a device for holding down a subs...

Pressure sensor with means for re-calibration

Linear guide with an air bearing having provision for heating a sup...

Patents Applicationslast 30 patents

Method for checking the quality of a wedge bond

Method for checking the quality of a wedge bond

Wire bonder

Wire bonder with a device for determining the vectorial distance be...

Wire bonder

Device for measuring the amplitude of the tip of an oscillating cap...

Device for the metered delivery of a viscous liquid

Method for picking semiconductor chips from a foil

Method for determining optimum bond parameters when bonding with a...

Clamping element with an integrated force sensor

Device with an electrode for the formation of a ball at the end of...

Device with electrodes for the formation of a ball at the end of a...

Method and device for determining the vectorial distance between th...

Method and apparatus for dispensing solder on a substrate

Method and device for measuring the amplitude of a freely oscillati...

Method for determining optimum bonding parameters for bonding with...

Method for the calibration of a Wire Bonder

Clamping element for flat work pieces

Pick-up tool for mounting semiconductor chips

Apparatus for mounting semiconductor chips

Apparatus for the transport and equipping of substrates with semico...

Device for the metered delivery of a viscous liquid

Pressure sensor

Pressure transducer

Apparatus for placing a semiconductor chip as a flipchip on a subst...

Method and apparatus for mounting semiconductor chips onto a flexib...

Trademarklast 30 trademarks

78229556 - TYPHOON

78159072 - TSUNAMI