FLIPCHIP INTERNATIONAL LLC

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PHOENIX, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Electroplating using dielectric bridges
- Patent number 9,070,747
- Issue date Jun 30, 2015
- FlipChip International LLC
- Eugene A. Stout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film structure for high density inductors and redistribution i...
- Patent number 9,018,750
- Issue date Apr 28, 2015
- FlipChip International, LLC
- Robert Forcier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for applying a final metal layer for wafer level packaging a...
- Patent number 8,980,743
- Issue date Mar 17, 2015
- FlipChip International LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level interconnect for high mechanical reliability applications
- Patent number 8,754,524
- Issue date Jun 17, 2014
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer level applied thermal heat sink
- Patent number 8,686,556
- Issue date Apr 1, 2014
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect
- Patent number 8,446,019
- Issue date May 21, 2013
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect
- Patent number 8,188,606
- Issue date May 29, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level interconnect for high mechanical reliability applications
- Patent number 8,143,722
- Issue date Mar 27, 2012
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced reliability for semiconductor devices using dielectric enc...
- Patent number 8,058,163
- Issue date Nov 15, 2011
- FlipChip International, LLC
- John J. H. Reche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump interconnect for improved mechanical and thermo-mechani...
- Patent number 7,973,418
- Issue date Jul 5, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level moat structures
- Patent number 7,126,164
- Issue date Oct 24, 2006
- FlipChip International LLC
- Michael E. Johnson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming partial-depth features in polymer film
- Patent number 7,118,833
- Issue date Oct 10, 2006
- FlipChip International, LLC
- Peter Elenius
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Solder bar for high power flip chips
- Patent number 7,057,292
- Issue date Jun 6, 2006
- FlipChip International, LLC
- Peter Elenius
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Build-up structures with multi-angle vias for Chip to Chip intercon...
- Patent number 7,011,988
- Issue date Mar 14, 2006
- FlipChip International, LLC
- Robert Forcier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Build-up structures with multi-angle vias for chip to chip intercon...
- Patent number 6,919,508
- Issue date Jul 19, 2005
- FlipChip International, LLC
- Robert Forcier
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS
- Publication number 20160268223
- Publication date Sep 15, 2016
- Flipchip International LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING USING DIELECTRIC BRIDGES
- Publication number 20150001684
- Publication date Jan 1, 2015
- FlipChip International, LLC
- Eugene A. Stout
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING A...
- Publication number 20130328203
- Publication date Dec 12, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRECISION SELF ALIGNING DIE FOR EMBEDDED DIE PACKAGING
- Publication number 20130244382
- Publication date Sep 19, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT
- Publication number 20130196499
- Publication date Aug 1, 2013
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED RF SHIELDS
- Publication number 20130093067
- Publication date Apr 18, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED THERMAL HEAT SINK
- Publication number 20130087904
- Publication date Apr 11, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM STRUCTURE FOR HIGH DENSITY INDUCTORS AND REDISTRIBUTION I...
- Publication number 20130037956
- Publication date Feb 14, 2013
- FlipChip International, LLC
- Robert Forcier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20120228765
- Publication date Sep 13, 2012
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS
- Publication number 20120146219
- Publication date Jun 14, 2012
- FlipChip International, LLC
- Anthony Curtis
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SOLDER BUMP INTERCONNECT
- Publication number 20110186995
- Publication date Aug 4, 2011
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT
- Publication number 20110003470
- Publication date Jan 6, 2011
- FlipChip International, LLC
- Guy F. Burgess
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED RELIABILITY FOR SEMICONDUCTOR DEVICES USING DIELECTRIC ENC...
- Publication number 20100032836
- Publication date Feb 11, 2010
- FlipChip International, LLC
- John J.H. Reche
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROL...
- Publication number 20090057909
- Publication date Mar 5, 2009
- FlipChip International, LLC
- Thomas Strothmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANI...
- Publication number 20080308934
- Publication date Dec 18, 2008
- FlipChip International, LLC
- Reynante Alvarado
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
78865082 - FLIPCHIP INTERNATIONAL VENTURES
- Serial number 78865082
- Filing date Apr 19, 2006
- FlipChip International LLC
- 40 - Treatment of materials
Information Trademark
78843235 - ELITECSP
- Serial number 78843235
- Registration number 3332305
- Filing date Mar 22, 2006
- FlipChip International, LLC
- 40 - Treatment of materials
Information Trademark
78841899 - ELITEFC
- Serial number 78841899
- Registration number 3332289
- Filing date Mar 21, 2006
- FlipChip International, LLC
- 40 - Treatment of materials
Information Trademark
78439264 - FOC FLEX-ON-CAP
- Serial number 78439264
- Filing date Jun 22, 2004
- FlipChip International LLC
- 40 - Treatment of materials
Information Trademark
78428930 - FLIPCHIP INTERNATIONAL
- Serial number 78428930
- Registration number 2980315
- Filing date Jun 2, 2004
- FlipChip International, LLC
- 40 - Treatment of materials
Information Trademark
78428935 - LIFESTYLE
- Serial number 78428935
- Filing date Jun 2, 2004
- FlipChip International, LLC
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
78168486 - SPHERON
- Serial number 78168486
- Registration number 2929612
- Filing date Sep 27, 2002
- Kulicke & Soffa Investments Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

FLIPCHIP INTERNATIONAL LLC

Organization

Patents Grantslast 30 patents

Electroplating using dielectric bridges

Thin film structure for high density inductors and redistribution i...

Method for applying a final metal layer for wafer level packaging a...

Wafer-level interconnect for high mechanical reliability applications

Wafer level applied thermal heat sink

Solder bump interconnect

Solder bump interconnect

Wafer-level interconnect for high mechanical reliability applications

Enhanced reliability for semiconductor devices using dielectric enc...

Solder bump interconnect for improved mechanical and thermo-mechani...

Wafer-level moat structures

Forming partial-depth features in polymer film

Solder bar for high power flip chips

Build-up structures with multi-angle vias for Chip to Chip intercon...

Build-up structures with multi-angle vias for chip to chip intercon...

Patents Applicationslast 30 patents

METHODS FOR FORMING PILLAR BUMPS ON SEMICONDUCTOR WAFERS

ELECTROPLATING USING DIELECTRIC BRIDGES

METHOD FOR APPLYING A FINAL METAL LAYER FOR WAFER LEVEL PACKAGING A...

HIGH PRECISION SELF ALIGNING DIE FOR EMBEDDED DIE PACKAGING

METHOD FOR BUILDING VERTICAL PILLAR INTERCONNECT

WAFER LEVEL APPLIED RF SHIELDS

WAFER LEVEL APPLIED THERMAL HEAT SINK

THIN FILM STRUCTURE FOR HIGH DENSITY INDUCTORS AND REDISTRIBUTION I...

SOLDER BUMP INTERCONNECT

WAFER-LEVEL INTERCONNECT FOR HIGH MECHANICAL RELIABILITY APPLICATIONS

SOLDER BUMP INTERCONNECT

METHODS AND STRUCTURES FOR A VERTICAL PILLAR INTERCONNECT

ENHANCED RELIABILITY FOR SEMICONDUCTOR DEVICES USING DIELECTRIC ENC...

UNDER BUMP METALLIZATION STRUCTURE HAVING A SEED LAYER FOR ELECTROL...

SOLDER BUMP INTERCONNECT FOR IMPROVED MECHANICAL AND THERMO-MECHANI...

Trademarklast 30 trademarks

78865082 - FLIPCHIP INTERNATIONAL VENTURES

78843235 - ELITECSP

78841899 - ELITEFC

78439264 - FOC FLEX-ON-CAP

78428930 - FLIPCHIP INTERNATIONAL

78428935 - LIFESTYLE

78168486 - SPHERON