FORMOSA MICROSEMI CO., LTD.

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TAIPEI HSIEN, TW

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Patents Grantslast 30 patents

Information Patent Grant
Flip-chip LED component built therein with a zener chip
- Patent number 9,064,856
- Issue date Jun 23, 2015
- Formosa Microsemi Co., Ltd
- Wen-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Well-through type diode element/component and manufacturing method...
- Patent number 8,791,551
- Issue date Jul 29, 2014
- Formosa Microsemi Co., Ltd
- Wen-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Constant current semiconductor device having a schottky barrier
- Patent number 8,742,533
- Issue date Jun 3, 2014
- Formosa Microsemi Co., Ltd
- Sheau-Feng Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and structure of a surface-mounting type diode...
- Patent number 8,404,565
- Issue date Mar 26, 2013
- Formosa Microsemi Co., Ltd.
- Wen-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP-CHIP PACKAGING DIODE WITH A MULTICHIP STRUCTURE
- Publication number 20180166367
- Publication date Jun 14, 2018
- FORMOSA MICROSEMI CO., Ltd.
- Wen-Hu WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WELL-THROUGH TYPE DIODE ELEMENT/COMPONENT AND MANUFACTURING METHOD...
- Publication number 20130241056
- Publication date Sep 19, 2013
- FORMOSA MICROSEMI CO., Ltd.
- Wen-Ping HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP TYPE FULL WAVE RECTIFICATION SEMICONDUCTOR DEVICE AND ITS...
- Publication number 20130075891
- Publication date Mar 28, 2013
- FORMOSA MICROSEMI CO., Ltd.
- Wen-Ping HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONSTANT CURRENT SEMICONDUCTOR DEVICE HAVING A SCHOTTKY BARRIER
- Publication number 20130049160
- Publication date Feb 28, 2013
- FORMOSA MICROSEMI CO., Ltd.
- Sheau-Feng TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method and structure of a surface-mounting type diode...
- Publication number 20110272777
- Publication date Nov 10, 2011
- FORMOSA MICROSEMI CO., Ltd.
- Wen-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat sinking structure of power semiconductor
- Publication number 20050259400
- Publication date Nov 24, 2005
- FORMOSA MICROSEMI CO., LTD.
- Wen-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks