GLOBAL CIRCUIT INNOVATIONS INCORPORATED

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Colorado Springs, CO, US

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Patents Grantslast 30 patents

Information Patent Grant
Solder ball application for singular die
- Patent number 11,978,711
- Issue date May 7, 2024
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical evaporation control system
- Patent number 11,618,951
- Issue date Apr 4, 2023
- Global Circuit Innovations Incorporated
- Timothy Mark Barry
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Solder ball application for singular die
- Patent number 11,508,680
- Issue date Nov 22, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile integrated circuit
- Patent number 11,257,726
- Issue date Feb 22, 2022
- Global Circuit Innovations Incorporated
- Timothy Mark Barry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive diamond application system
- Patent number 11,077,654
- Issue date Aug 3, 2021
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive diamond application method
- Patent number 10,654,259
- Issue date May 19, 2020
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Counterfeit integrated circuit detection by comparing integrated ci...
- Patent number 10,460,326
- Issue date Oct 29, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Hermetic lid seal printing method
- Patent number 10,431,510
- Issue date Oct 1, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged integrated circuit assembly method
- Patent number 10,177,056
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for remapping a packaged extracted die
- Patent number 10,177,054
- Issue date Jan 8, 2019
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die with 3D printed bond connections
- Patent number 10,147,660
- Issue date Dec 4, 2018
- Global Circuits Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D printed hermetic package assembly and method
- Patent number 10,128,161
- Issue date Nov 13, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged reconditioned die method and assembly
- Patent number 10,115,645
- Issue date Oct 30, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remapped packaged extracted die
- Patent number 10,109,606
- Issue date Oct 23, 2018
- Global Circuit Innovations, Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for remapping a packaged extracted die with 3D printed bond...
- Patent number 10,002,846
- Issue date Jun 19, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Environmental hardening integrated circuit method and apparatus
- Patent number 9,966,319
- Issue date May 8, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for printing integrated circuit bond connections
- Patent number 9,935,028
- Issue date Apr 3, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repackaged integrated circuit and assembly method
- Patent number 9,870,968
- Issue date Jan 16, 2018
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with printed bond connections
- Patent number 9,824,948
- Issue date Nov 21, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Environmental hardened packaged integrated circuit
- Patent number 9,711,480
- Issue date Jul 18, 2017
- Global Circuit Innovations Incorporated
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20230055518
- Publication date Feb 23, 2023
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Solder Ball Application for Singular Die
- Publication number 20220157749
- Publication date May 19, 2022
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile Integrated Circuit
- Publication number 20220005741
- Publication date Jan 6, 2022
- Global Circuit Innovations Inc.
- Timothy Mark Barry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chemical evaporation Control System
- Publication number 20210371984
- Publication date Dec 2, 2021
- Global Circuit Innovations Inc.
- Timothy Mark Barry
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Conductive Diamond Application System
- Publication number 20200230940
- Publication date Jul 23, 2020
- Global Circuit Innovations Inc.
- Erick Merle Spory
- C01 - INORGANIC CHEMISTRY
Information Patent Application
Conductive Diamond Application Method and System
- Publication number 20190118346
- Publication date Apr 25, 2019
- Global Circuit Innovations Inc.
- Erick Merle Spory
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Low Profile Electronic System Method and Apparatus
- Publication number 20190122897
- Publication date Apr 25, 2019
- Global Circuit Innovations Inc.
- Timothy Mark Barry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IDD Signature
- Publication number 20190122227
- Publication date Apr 25, 2019
- Global Circuit Innovations Inc.
- Erick Merle Spory
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method for Remapping a Packaged Extracted Die
- Publication number 20180061724
- Publication date Mar 1, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D Printed Hermetic Package Assembly and Method
- Publication number 20180053702
- Publication date Feb 22, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Remapping a Packaged Extracted Die with 3D Printed Bond...
- Publication number 20180047700
- Publication date Feb 15, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Remapped Packaged Extracted Die
- Publication number 20180047685
- Publication date Feb 15, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Remapped Packaged Extracted Die with 3D Printed Bond Connections
- Publication number 20180040529
- Publication date Feb 8, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Repackaged integrated circuit assembly method
- Publication number 20180005910
- Publication date Jan 4, 2018
- Global Circuit Innovations Inc.
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Environmental hardened packaged integrated circuit
- Publication number 20160181168
- Publication date Jun 23, 2016
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with printed bond connections
- Publication number 20160181171
- Publication date Jun 23, 2016
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for printing integrated circuit bond connections
- Publication number 20140252584
- Publication date Sep 11, 2014
- GLOBAL CIRCUIT INNOVATIONS INCORPORATED
- Erick Merle Spory
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
87432180 - DEER
- Serial number 87432180
- Registration number 5400012
- Filing date May 1, 2017
- Global Circuit Innovations, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
87366952 - DER
- Serial number 87366952
- Registration number 5278571
- Filing date Mar 10, 2017
- Global Circuit Innovations
- 37 - Building construction
Information Trademark
87238869 - DER
- Serial number 87238869
- Registration number 5215549
- Filing date Nov 16, 2016
- Global Circuit Innovations
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

GLOBAL CIRCUIT INNOVATIONS INCORPORATED

Organization

Patents Grantslast 30 patents

Solder ball application for singular die

Chemical evaporation control system

Solder ball application for singular die

Low profile integrated circuit

Conductive diamond application system

Conductive diamond application method

Counterfeit integrated circuit detection by comparing integrated ci...

Hermetic lid seal printing method

Repackaged integrated circuit assembly method

Method for remapping a packaged extracted die

Remapped packaged extracted die with 3D printed bond connections

3D printed hermetic package assembly and method

Repackaged reconditioned die method and assembly

Remapped packaged extracted die

Method for remapping a packaged extracted die with 3D printed bond...

Environmental hardening integrated circuit method and apparatus

Method and apparatus for printing integrated circuit bond connections

Repackaged integrated circuit and assembly method

Integrated circuit with printed bond connections

Environmental hardened packaged integrated circuit

Patents Applicationslast 30 patents

Solder Ball Application for Singular Die

Solder Ball Application for Singular Die

Low Profile Integrated Circuit

Chemical evaporation Control System

Conductive Diamond Application System

Conductive Diamond Application Method and System

Low Profile Electronic System Method and Apparatus

IDD Signature

Method for Remapping a Packaged Extracted Die

3D Printed Hermetic Package Assembly and Method

Method for Remapping a Packaged Extracted Die with 3D Printed Bond...

Remapped Packaged Extracted Die

Remapped Packaged Extracted Die with 3D Printed Bond Connections

Repackaged integrated circuit assembly method

Environmental hardened packaged integrated circuit

Integrated circuit with printed bond connections

Method and apparatus for printing integrated circuit bond connections

Trademarklast 30 trademarks

87432180 - DEER

87366952 - DER

87238869 - DER