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TORTOLA, VG
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Patents Grants
last 30 patents
Information
Patent Grant
Field-effect transistor structure for preventing from shorting
Patent number
9,520,343
Issue date
Dec 13, 2016
Great Team Backend Foundry Inc.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High heat-dissipation chip package structure
Patent number
9,472,493
Issue date
Oct 18, 2016
Great Team Backend Foundry Inc.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wire bonding structure and manufacturing method thereof
Patent number
7,859,123
Issue date
Dec 28, 2010
Great Team Backend Foundry Inc.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Molded can package
Publication number
20130070424
Publication date
Mar 21, 2013
Great Team Backend Foundry, Inc.
Chung Hsing TZU
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
Pre molded can package
Publication number
20130070427
Publication date
Mar 21, 2013
Great Team Backend Foundry, Inc.
Chung Hsing TZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip Package
Publication number
20120103668
Publication date
May 3, 2012
Great Team Backend Foundry, Inc.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Muti Thickness Lead Frame
Publication number
20110127658
Publication date
Jun 2, 2011
Great Team Backend Foundry, Inc.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME
Publication number
20110049692
Publication date
Mar 3, 2011
Great Team Backend Foundry, Inc.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...
Publication number
20110031302
Publication date
Feb 10, 2011
GREAT TEAM BACKEND FOUNDRY INC.
CHUNG HSING TZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20100295180
Publication date
Nov 25, 2010
GREAT TEAM BACKEND FOUNDRY INC.
CHING HSING TZU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE
Publication number
20100123243
Publication date
May 20, 2010
GREAT TEAM BACKEND FOUNDRY, INC.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...
Publication number
20100102429
Publication date
Apr 29, 2010
GREAT TEAM BACKEND FOUNDRY, INC.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20100072619
Publication date
Mar 25, 2010
GREAT TEAM BACKEND FOUNDRY, INC.
Chung Hsing Tzu
H01 - BASIC ELECTRIC ELEMENTS
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