GREAT TEAM BACKEND FOUNDRY INC.

Organization

TORTOLA, VG

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Field-effect transistor structure for preventing from shorting
- Patent number 9,520,343
- Issue date Dec 13, 2016
- Great Team Backend Foundry Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High heat-dissipation chip package structure
- Patent number 9,472,493
- Issue date Oct 18, 2016
- Great Team Backend Foundry Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding structure and manufacturing method thereof
- Patent number 7,859,123
- Issue date Dec 28, 2010
- Great Team Backend Foundry Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
Molded can package
- Publication number 20130070424
- Publication date Mar 21, 2013
- Great Team Backend Foundry, Inc.
- Chung Hsing TZU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Pre molded can package
- Publication number 20130070427
- Publication date Mar 21, 2013
- Great Team Backend Foundry, Inc.
- Chung Hsing TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Package
- Publication number 20120103668
- Publication date May 3, 2012
- Great Team Backend Foundry, Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Muti Thickness Lead Frame
- Publication number 20110127658
- Publication date Jun 2, 2011
- Great Team Backend Foundry, Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME
- Publication number 20110049692
- Publication date Mar 3, 2011
- Great Team Backend Foundry, Inc.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...
- Publication number 20110031302
- Publication date Feb 10, 2011
- GREAT TEAM BACKEND FOUNDRY INC.
- CHUNG HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100295180
- Publication date Nov 25, 2010
- GREAT TEAM BACKEND FOUNDRY INC.
- CHING HSING TZU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE
- Publication number 20100123243
- Publication date May 20, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...
- Publication number 20100102429
- Publication date Apr 29, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20100072619
- Publication date Mar 25, 2010
- GREAT TEAM BACKEND FOUNDRY, INC.
- Chung Hsing Tzu
- H01 - BASIC ELECTRIC ELEMENTS

GREAT TEAM BACKEND FOUNDRY INC.

Organization

Patents Grantslast 30 patents

Field-effect transistor structure for preventing from shorting

High heat-dissipation chip package structure

Wire bonding structure and manufacturing method thereof

Patents Applicationslast 30 patents

Molded can package

Pre molded can package

Chip Package

Muti Thickness Lead Frame

CONNECTION DEVICE BEWTEEN TRANSISTOR AND LEAD FRAME

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF

FLIP-CHIP CHIP-SCALE PACKAGE STRUCTURE

FLIP-CHIP PACKAGE STRUCTURE WITH BLOCK BUMPS AND THE WEDGE BONDING...

WIRE BONDING STRUCTURE AND MANUFACTURING METHOD THEREOF