HOJIN PLATECH CO., LTD.

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Ansan-Si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Electroplating solution for indium-bismuth alloy for low-temperatur...
- Patent number 12,071,703
- Issue date Aug 27, 2024
- HOJIN PLATECH CO., LTD.
- Woon Suk Jung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating solution of tin or tin alloy with improved thickness...
- Patent number 11,879,181
- Issue date Jan 23, 2024
- HOJIN PLATECH CO., LTD.
- Woon Suk Jung
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Plating equipment for solar cell wafer using electroplating and lig...
- Patent number 9,525,096
- Issue date Dec 20, 2016
- HOJIN PLATECH CO., LTD.
- Pan Soo Kim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Substrate carrier device for double-sided electroplating of solar cell
- Patent number 9,194,053
- Issue date Nov 24, 2015
- HOJIN PLATECH CO., LTD.
- Pan Soo Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper plating solution
- Patent number 9,150,977
- Issue date Oct 6, 2015
- HOJIN PLATECH CO., LTD.
- Pan Soo Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

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Patents Applicationslast 30 patents

Information Patent Application
ELECTROPLATING SOLUTION FOR INDIUM-BISMUTH ALLOY FOR LOW-TEMPERATUR...
- Publication number 20240167183
- Publication date May 23, 2024
- HOJIN PLATECH CO., LTD.
- Woon Suk JUNG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING SOLUTION OF TIN OR TIN ALLOY WITH IMPROVED THICKNESS...
- Publication number 20230151504
- Publication date May 18, 2023
- HOJIN PLATECH CO., LTD.
- Woon Suk JUNG
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUBSTRATE PLATING APPARATUS INCLUDING HYBRID PADDLE THAT SIMULTANEO...
- Publication number 20220170161
- Publication date Jun 2, 2022
- HOJIN PLATECH CO., LTD.
- Jin Gyu IM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE CARRIER DEVICE FOR DOUBLE-SIDED ELECTROPLATING OF SOLAR CELL
- Publication number 20150176148
- Publication date Jun 25, 2015
- HOJIN PLATECH CO., LTD.
- Pan Soo Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER PLATING SOLUTION
- Publication number 20140151238
- Publication date Jun 5, 2014
- HOJIN PLATECH CO.,LTD.
- Pan Soo Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PLATING EQUIPMENT FOR SOLAR CELL WAFER USING ELECTROPLATING AND LIG...
- Publication number 20140154836
- Publication date Jun 5, 2014
- HOJIN PLATECH CO., LTD.
- Pan Soo Kim
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

HOJIN PLATECH CO., LTD.

Organization

Patents Grantslast 30 patents

Electroplating solution for indium-bismuth alloy for low-temperatur...

Electroplating solution of tin or tin alloy with improved thickness...

Plating equipment for solar cell wafer using electroplating and lig...

Substrate carrier device for double-sided electroplating of solar cell

Copper plating solution

Patents Applicationslast 30 patents

ELECTROPLATING SOLUTION FOR INDIUM-BISMUTH ALLOY FOR LOW-TEMPERATUR...

ELECTROPLATING SOLUTION OF TIN OR TIN ALLOY WITH IMPROVED THICKNESS...

SUBSTRATE PLATING APPARATUS INCLUDING HYBRID PADDLE THAT SIMULTANEO...

SUBSTRATE CARRIER DEVICE FOR DOUBLE-SIDED ELECTROPLATING OF SOLAR CELL

COPPER PLATING SOLUTION

PLATING EQUIPMENT FOR SOLAR CELL WAFER USING ELECTROPLATING AND LIG...