Hymite A/S

Organization

Kgs. Lyngby, DK

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Optoelectronic device submount
- Patent number 7,732,829
- Issue date Jun 8, 2010
- Hymite A/S
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication process for package with light emitting device on a sub...
- Patent number 7,732,234
- Issue date Jun 8, 2010
- Hymite A/S
- Christoffer Graae Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of through-wafer electrical interconnections and other st...
- Patent number 7,732,240
- Issue date Jun 8, 2010
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming an assembly to house one or more micro components
- Patent number 7,681,306
- Issue date Mar 23, 2010
- Hymite A/S
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Formation of through-wafer electrical interconnections and other st...
- Patent number 7,662,710
- Issue date Feb 16, 2010
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a package for a micro component
- Patent number 7,553,695
- Issue date Jun 30, 2009
- Hymite A/S
- Lior Shiv
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical module hermetically packaged in micro-machined structures
- Patent number 7,543,999
- Issue date Jun 9, 2009
- Hymite A/S
- Marcus Winter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of through-wafer electrical interconnections and other st...
- Patent number 7,531,445
- Issue date May 12, 2009
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for a light emitting element with integrated electrostatic...
- Patent number 7,528,422
- Issue date May 5, 2009
- Hymite A/S
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication and use of polished silicon micro-mirrors
- Patent number 7,470,622
- Issue date Dec 30, 2008
- Hymite A/S
- Lior Shiv
- G02 - OPTICS
Information Patent Grant
Light transmitting modules with optical power monitoring
- Patent number 7,467,897
- Issue date Dec 23, 2008
- Hymite A/S
- Ralf Hauffe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabrication for chip scale package for a micro component
- Patent number 7,419,853
- Issue date Sep 2, 2008
- Hymite A/S
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Accurate positioning of components of an optical assembly
- Patent number 7,415,180
- Issue date Aug 19, 2008
- Hymite A/S
- Kristian Blidegn
- G02 - OPTICS
Information Patent Grant
Hermetically sealed package for optical, electronic, opto-electroni...
- Patent number 7,388,285
- Issue date Jun 17, 2008
- Hymite A/S
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Assembly with self-alignment features to position a cover on a subs...
- Patent number 7,253,388
- Issue date Aug 7, 2007
- Hymite A/S
- Jochen Kuhmann
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical device receiving substrate and optical device holding carrier
- Patent number 7,213,978
- Issue date May 8, 2007
- Hymite A/S
- Jochen Friedrich Kuhmann
- G02 - OPTICS
Information Patent Grant
Accurate positioning of components of a optical assembly
- Patent number 7,209,235
- Issue date Apr 24, 2007
- Hymite A/S
- Kristian Blidegn
- G02 - OPTICS
Information Patent Grant
Light transmitting modules with optical power monitoring
- Patent number 7,165,896
- Issue date Jan 23, 2007
- Hymite A/S
- Ralf Hauffe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetically sealed package for optical, electronic, opto-electroni...
- Patent number 7,109,580
- Issue date Sep 19, 2006
- Hymite A/S
- Matthias Heschel
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Double-sided etching technique for semiconductor structure with thr...
- Patent number 7,081,412
- Issue date Jul 25, 2006
- Hymite A/S
- Matthias Heschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures having through-holes sealed with feed-thro...
- Patent number 7,057,274
- Issue date Jun 6, 2006
- Hymite A/S
- Matthias Heschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package with an integrated lens and optical assemblies inco...
- Patent number 6,969,204
- Issue date Nov 29, 2005
- Hymite A/S
- Arnd Kilian
- G02 - OPTICS
Information Patent Grant
Package with a light emitting device
- Patent number 6,856,717
- Issue date Feb 15, 2005
- Hymite A/S
- Arnd Kilian
- G02 - OPTICS
Information Patent Grant
Hybrid integration of active and passive optical components on an S...
- Patent number 6,832,013
- Issue date Dec 14, 2004
- Hymite A/S
- Jochen Friedrich Kuhmann
- G02 - OPTICS
Information Patent Grant
Double-sided etching technique for providing a semiconductor struct...
- Patent number 6,818,464
- Issue date Nov 16, 2004
- Hymite A/S
- Matthias Heschel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated optical fiber end-coupled device
- Patent number 6,786,654
- Issue date Sep 7, 2004
- Hymite A/S
- Arnd Kilian
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR-BASED SUB-MOUNTS FOR OPTOELECTRONIC DEVICES WITH COND...
- Publication number 20100244055
- Publication date Sep 30, 2010
- Hymite A/S
- Christoffer G. Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTO-ELECTRONIC DEVICE PACKAGE WITH A SEMICONDUCTOR-BASED SUB-MOUNT...
- Publication number 20100210045
- Publication date Aug 19, 2010
- Hymite A/S
- Jochen F. Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-Based Sub-Mount for an Opto-Electronic Device
- Publication number 20100200888
- Publication date Aug 12, 2010
- Hymite A/S
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THRO...
- Publication number 20100176507
- Publication date Jul 15, 2010
- Hymite A/S
- Lior Shiv
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Formation of Through-Wafer Electrical Interconnections and Other St...
- Publication number 20100015734
- Publication date Jan 21, 2010
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES
- Publication number 20090321760
- Publication date Dec 31, 2009
- Hymite A/S
- Jochen Kuhmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTOELECTRONIC DEVICE SUBMOUNT
- Publication number 20090194777
- Publication date Aug 6, 2009
- HYMITE A/S
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Formation of Through-Wafer Electrical Interconnections and Other St...
- Publication number 20090191704
- Publication date Jul 30, 2009
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR A LIGHT EMITTING ELEMENT
- Publication number 20090101897
- Publication date Apr 23, 2009
- HYMITE A/S
- Thomas Murphy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication Process for Package With Light Emitting Device On A Sub...
- Publication number 20080199982
- Publication date Aug 21, 2008
- Hymite A/S
- Christoffer Graae Greisen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER ST...
- Publication number 20080076195
- Publication date Mar 27, 2008
- Hymite A/S
- Lior Shiv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACCURATE POSITIONING OF COMPONENTS OF AN OPTICAL ASSEMBLY
- Publication number 20070153276
- Publication date Jul 5, 2007
- Hymite A/S
- Kristian Blidegn
- G02 - OPTICS
Information Patent Application
Light Transmitting Modules With Optical Power Monitoring
- Publication number 20070091608
- Publication date Apr 26, 2007
- Hymite A/S
- Ralf Hauffe
- G02 - OPTICS
Information Patent Application
Semiconductor structure with one or more through-holes
- Publication number 20030071283
- Publication date Apr 17, 2003
- Hymite A/S
- Matthias Heschel
- G02 - OPTICS

Organization

Patents Grantslast 30 patents

Optoelectronic device submount

Fabrication process for package with light emitting device on a sub...

Formation of through-wafer electrical interconnections and other st...

Method of forming an assembly to house one or more micro components

Formation of through-wafer electrical interconnections and other st...

Method of fabricating a package for a micro component

Optical module hermetically packaged in micro-machined structures

Formation of through-wafer electrical interconnections and other st...

Package for a light emitting element with integrated electrostatic...

Fabrication and use of polished silicon micro-mirrors

Light transmitting modules with optical power monitoring

Method of fabrication for chip scale package for a micro component

Accurate positioning of components of an optical assembly

Hermetically sealed package for optical, electronic, opto-electroni...

Assembly with self-alignment features to position a cover on a subs...

Optical device receiving substrate and optical device holding carrier

Accurate positioning of components of a optical assembly

Light transmitting modules with optical power monitoring

Hermetically sealed package for optical, electronic, opto-electroni...

Double-sided etching technique for semiconductor structure with thr...

Semiconductor structures having through-holes sealed with feed-thro...

Optical package with an integrated lens and optical assemblies inco...

Package with a light emitting device

Hybrid integration of active and passive optical components on an S...

Double-sided etching technique for providing a semiconductor struct...

Encapsulated optical fiber end-coupled device

Patents Applicationslast 30 patents

SEMICONDUCTOR-BASED SUB-MOUNTS FOR OPTOELECTRONIC DEVICES WITH COND...

OPTO-ELECTRONIC DEVICE PACKAGE WITH A SEMICONDUCTOR-BASED SUB-MOUNT...

Silicon-Based Sub-Mount for an Opto-Electronic Device

SEMICONDUCTOR-BASED SUBMOUNT WITH ELECTRICALLY CONDUCTIVE FEED-THRO...

Formation of Through-Wafer Electrical Interconnections and Other St...

FABRICATION OF COMPACT OPTO-ELECTRONIC COMPONENT PACKAGES

OPTOELECTRONIC DEVICE SUBMOUNT

Formation of Through-Wafer Electrical Interconnections and Other St...

PACKAGE FOR A LIGHT EMITTING ELEMENT

Fabrication Process for Package With Light Emitting Device On A Sub...

FORMATION OF THROUGH-WAFER ELECTRICAL INTERCONNECTIONS AND OTHER ST...

ACCURATE POSITIONING OF COMPONENTS OF AN OPTICAL ASSEMBLY

Light Transmitting Modules With Optical Power Monitoring

Semiconductor structure with one or more through-holes

Trademarklast 30 trademarks