Invensas Corporation

Organization

San Jose, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Connecting multiple chips using an interconnect device
- Patent number 12,154,858
- Issue date Nov 26, 2024
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D-interconnect with electromagnetic interference (“EMI”) shield an...
- Patent number 12,040,284
- Issue date Jul 16, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Region shielding within a package of a microelectronic device
- Patent number 12,021,041
- Issue date Jun 25, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple plated via arrays of different wire heights on a same subs...
- Patent number RE49987
- Issue date May 28, 2024
- Invensas LLC
- Cyprian Emeka Uzoh
Information Patent Grant
3D-interconnect
- Patent number 11,929,337
- Issue date Mar 12, 2024
- Invensas LLC
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Over and under interconnects
- Patent number 11,830,804
- Issue date Nov 28, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 11,824,046
- Issue date Nov 21, 2023
- Invensas LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,810,867
- Issue date Nov 7, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Active bridging apparatus
- Patent number 11,804,469
- Issue date Oct 31, 2023
- Invensas LLC
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,735,563
- Issue date Aug 22, 2023
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Correction die for wafer/die stack
- Patent number 11,605,614
- Issue date Mar 14, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D memory circuit
- Patent number 11,599,299
- Issue date Mar 7, 2023
- Invensas LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 11,495,579
- Issue date Nov 8, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond wires for interference shielding
- Patent number 11,462,483
- Issue date Oct 4, 2022
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fine pitch bva using reconstituted wafer with area array accessible...
- Patent number 11,404,338
- Issue date Aug 2, 2022
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die module with low power operation
- Patent number 11,398,258
- Issue date Jul 26, 2022
- Invensas LLC
- David Edward Fisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip modules formed using wafer-level processing of a reconst...
- Patent number 11,387,214
- Issue date Jul 12, 2022
- Invensas LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 11,387,202
- Issue date Jul 12, 2022
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked transmission line
- Patent number 11,369,020
- Issue date Jun 21, 2022
- Invensas LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielets on flexible and stretchable packaging for microelectronics
- Patent number 11,355,443
- Issue date Jun 7, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding method and apparatus for electromagnetic interference...
- Patent number 11,335,647
- Issue date May 17, 2022
- Invensas LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded LED structure contacts and substrate contacts
- Patent number 11,329,034
- Issue date May 10, 2022
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated interposer solutions for 2D and 3D IC packaging
- Patent number 11,302,616
- Issue date Apr 12, 2022
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 11,270,979
- Issue date Mar 8, 2022
- Invensas Corporation
- Javier A. Delacruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Mixed exposure for large die
- Patent number 11,264,357
- Issue date Mar 1, 2022
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Network on layer enabled architectures
- Patent number 11,264,361
- Issue date Mar 1, 2022
- Invensas Corporation
- Javier A. Delacruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated circuits protected by substrates with cavities, and meth...
- Patent number 11,205,600
- Issue date Dec 21, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures and methods for forming same
- Patent number 11,195,748
- Issue date Dec 7, 2021
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-on-package assembly with wire bond vias
- Patent number 11,189,595
- Issue date Nov 30, 2021
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for providing 3D wafer assembly with known-good-dies
- Patent number 11,114,408
- Issue date Sep 7, 2021
- Invensas Corporation
- Hong Shen
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
3D-INTERCONNECT WITH ELECTROMAGNETIC INTERFERENCE ("EMI") SHIELD AN...
- Publication number 20240339418
- Publication date Oct 10, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE
- Publication number 20240312928
- Publication date Sep 19, 2024
- Invensas LLC
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20240055393
- Publication date Feb 15, 2024
- Invensas LLC
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D MEMORY CIRCUIT
- Publication number 20230376234
- Publication date Nov 23, 2023
- Invensas LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CORRECTION DIE FOR WAFER/DIE STACK
- Publication number 20230268320
- Publication date Aug 24, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D-Interconnect with Electromagnetic Interference ("EMI") Shield an...
- Publication number 20230154862
- Publication date May 18, 2023
- Invensas Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RADIO FREQUENCY DEVICE PACKAGES
- Publication number 20230130259
- Publication date Apr 27, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES
- Publication number 20230122531
- Publication date Apr 20, 2023
- Invensas LLC
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20230105341
- Publication date Apr 6, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED STRUCTURE WITH INTERPOSER
- Publication number 20230069183
- Publication date Mar 2, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND WIRES FOR INTERFERENCE SHIELDING
- Publication number 20230059375
- Publication date Feb 23, 2023
- Invensas LLC
- Abiola Awujoola
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...
- Publication number 20230040454
- Publication date Feb 9, 2023
- Invensas LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fine Pitch BVA Using Reconstituted Wafer With Area Array Accessible...
- Publication number 20230005804
- Publication date Jan 5, 2023
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...
- Publication number 20220375864
- Publication date Nov 24, 2022
- Invensas LLC
- Liang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...
- Publication number 20220320006
- Publication date Oct 6, 2022
- Invensas LLC
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS
- Publication number 20220278048
- Publication date Sep 1, 2022
- Invensas Corporation
- Shaowu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIXED EXPOSURE FOR LARGE DIE
- Publication number 20220216180
- Publication date Jul 7, 2022
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS
- Publication number 20220165703
- Publication date May 26, 2022
- Invensas Corporation
- Ellis Chau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Symbiotic Network On Layers
- Publication number 20220150184
- Publication date May 12, 2022
- Invensas Corporation
- Javier A. Delacruz
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Network On Layer Enabled Architectures
- Publication number 20220139883
- Publication date May 5, 2022
- Invensas Corporation
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE
- Publication number 20220139846
- Publication date May 5, 2022
- Invensas Corporation
- Patrick Variot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME
- Publication number 20220130714
- Publication date Apr 28, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced Device Assembly Structures And Methods
- Publication number 20220097166
- Publication date Mar 31, 2022
- Invensas Corporation
- Cyprian Emeka Uzoh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TECHNIQUES FOR MANUFACTURING SPLIT-CELL 3D-NAND MEMORY DEVICES
- Publication number 20220005827
- Publication date Jan 6, 2022
- Invensas Corporation
- Xu Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3d-Interconnect
- Publication number 20210366857
- Publication date Nov 25, 2021
- Invensas Corporation
- Chok J. Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR DEVICE
- Publication number 20210366970
- Publication date Nov 25, 2021
- Invensas Corporation
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE BRIDGING APPARATUS
- Publication number 20210351159
- Publication date Nov 11, 2021
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED ORGANIC INTERPOSER FOR HIGH BANDWIDTH
- Publication number 20210327851
- Publication date Oct 21, 2021
- Invensas Corporation
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LED ARRAYS AND APPLICATIONS
- Publication number 20210288037
- Publication date Sep 16, 2021
- Invensas Corporation
- Min Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR FLASH STACKING
- Publication number 20210225811
- Publication date Jul 22, 2021
- Invensas Corporation
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
86100497 - TFD
- Serial number 86100497
- Registration number 4543369
- Filing date Oct 24, 2013
- INVENSAS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
86100434 - XFD
- Serial number 86100434
- Registration number 4543363
- Filing date Oct 24, 2013
- INVENSAS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
86100478 - QFD
- Serial number 86100478
- Registration number 4543368
- Filing date Oct 24, 2013
- INVENSAS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
86100452 - DFD
- Serial number 86100452
- Registration number 4543365
- Filing date Oct 24, 2013
- INVENSAS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
85660290 - QFD
- Serial number 85660290
- Filing date Jun 25, 2012
- INVENSAS CORPORATION
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
85660298 - BVA
- Serial number 85660298
- Registration number 4344106
- Filing date Jun 25, 2012
- INVENSAS CORPORATION
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
85528648 - TFD
- Serial number 85528648
- Filing date Jan 30, 2012
- INVENSAS CORPORATION
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
85528633 - FD
- Serial number 85528633
- Filing date Jan 30, 2012
- INVENSAS CORPORATION
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
85528657 - XFD
- Serial number 85528657
- Filing date Jan 30, 2012
- INVENSAS CORPORATION
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
85528641 - DFD
- Serial number 85528641
- Registration number 4400919
- Filing date Jan 30, 2012
- INVENSAS CORPORATION
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
85303927 - INVENSAS
- Serial number 85303927
- Registration number 4786034
- Filing date Apr 25, 2011
- Tessera Intellectual Properties, Inc.
- 45 - Legal services
Information Trademark
75844393 - INTENSYS
- Serial number 75844393
- Filing date Nov 9, 1999
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75844391 - I-CACHED SIMD
- Serial number 75844391
- Filing date Nov 9, 1999
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75844394 - P-FLY
- Serial number 75844394
- Filing date Nov 9, 1999
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75844365
- Serial number 75844365
- Filing date Nov 9, 1999
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75844395 - PIXEL-ON-THE-FLY
- Serial number 75844395
- Filing date Nov 9, 1999
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75813259 - CLEARMAGIC
- Serial number 75813259
- Filing date Oct 1, 1999
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75611781 - INTENSYS
- Serial number 75611781
- Filing date Dec 23, 1998
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75611266 - I N T E N S Y S
- Serial number 75611266
- Filing date Dec 23, 1998
- INTENSYS CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Invensas Corporation

Organization

Patents Grantslast 30 patents

Connecting multiple chips using an interconnect device

3D-interconnect with electromagnetic interference (“EMI”) shield an...

Region shielding within a package of a microelectronic device

Multiple plated via arrays of different wire heights on a same subs...

3D-interconnect

Over and under interconnects

Symbiotic network on layers

Wire bond wires for interference shielding

Active bridging apparatus

Package-on-package assembly with wire bond vias

Correction die for wafer/die stack

3D memory circuit

Capacitive coupling in a direct-bonded interface for microelectroni...

Wire bond wires for interference shielding

Fine pitch bva using reconstituted wafer with area array accessible...

Multi-die module with low power operation

Multi-chip modules formed using wafer-level processing of a reconst...

Nanowire bonding interconnect for fine-pitch microelectronics

Stacked transmission line

Dielets on flexible and stretchable packaging for microelectronics

Wire bonding method and apparatus for electromagnetic interference...

Direct-bonded LED structure contacts and substrate contacts

Integrated interposer solutions for 2D and 3D IC packaging

Symbiotic network on layers

Mixed exposure for large die

Network on layer enabled architectures

Integrated circuits protected by substrates with cavities, and meth...

Interconnect structures and methods for forming same

Package-on-package assembly with wire bond vias

System and method for providing 3D wafer assembly with known-good-dies

Patents Applicationslast 30 patents

3D-INTERCONNECT WITH ELECTROMAGNETIC INTERFERENCE ("EMI") SHIELD AN...

REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

3D MEMORY CIRCUIT

CORRECTION DIE FOR WAFER/DIE STACK

3D-Interconnect with Electromagnetic Interference ("EMI") Shield an...

RADIO FREQUENCY DEVICE PACKAGES

REDUCED PARASITIC CAPACITANCE IN BONDED STRUCTURES

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

STACKED STRUCTURE WITH INTERPOSER

WIRE BOND WIRES FOR INTERFERENCE SHIELDING

CAPACITIVE COUPLING IN A DIRECT-BONDED INTERFACE FOR MICROELECTRONI...

Fine Pitch BVA Using Reconstituted Wafer With Area Array Accessible...

MULTI-CHIP MODULES FORMED USING WAFER-LEVEL PROCESSING OF A RECONST...

WIRE BONDING METHOD AND APPARATUS FOR ELECTROMAGNETIC INTERFERENCE...

DIELETS ON FLEXIBLE AND STRETCHABLE PACKAGING FOR MICROELECTRONICS

MIXED EXPOSURE FOR LARGE DIE

PACKAGE-ON-PACKAGE ASSEMBLY WITH WIRE BOND VIAS

Symbiotic Network On Layers

Network On Layer Enabled Architectures

REGION SHIELDING WITHIN A PACKAGE OF A MICROELECTRONIC DEVICE

INTERCONNECT STRUCTURES AND METHODS FOR FORMING SAME

Advanced Device Assembly Structures And Methods

TECHNIQUES FOR MANUFACTURING SPLIT-CELL 3D-NAND MEMORY DEVICES

3d-Interconnect

IMAGE SENSOR DEVICE

ACTIVE BRIDGING APPARATUS

EMBEDDED ORGANIC INTERPOSER FOR HIGH BANDWIDTH

DIRECT-BONDED LED ARRAYS AND APPLICATIONS

SYSTEMS AND METHODS FOR FLASH STACKING

Trademarklast 30 trademarks

86100497 - TFD

86100434 - XFD

86100478 - QFD

86100452 - DFD

85660290 - QFD

85660298 - BVA

85528648 - TFD

85528633 - FD

85528657 - XFD

85528641 - DFD

85303927 - INVENSAS

75844393 - INTENSYS

75844391 - I-CACHED SIMD

75844394 - P-FLY

75844365