ISHIHARA CHEMICAL COMPANY, LTD

Organization

HYOGO-KU, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Structure including copper plating layer or copper alloy plating layer
- Patent number 11,993,862
- Issue date May 28, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Copper or copper alloy electroplating bath
- Patent number 11,946,153
- Issue date Apr 2, 2024
- Ishihara Chemical Co., LTD
- Masaru Hatabe
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tin or tin alloy electroplating bath, and electronic component havi...
- Patent number 11,939,691
- Issue date Mar 26, 2024
- Ishihara Chemical Co., LTD
- Syohei Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure containing Sn layer or Sn alloy layer
- Patent number 11,052,637
- Issue date Jul 6, 2021
- Ishihara Chemical Co., LTD
- Shoya Iuchi
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Ta—Nb alloy powder and anode element for solid electrolytic capacitor
- Patent number 10,329,644
- Issue date Jun 25, 2019
- Ishihara Chemical Co., Ltd.
- Takayuki Maeshima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metallic ink
- Patent number 10,231,344
- Issue date Mar 12, 2019
- Applied Nanotech Holdings, Inc.
- Yunjun Li
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for manufacturing alloy bump
- Patent number 10,062,657
- Issue date Aug 28, 2018
- Ishihara Chemical Co., Ltd.
- Shoya Iuchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive film forming method and sintering promoter
- Patent number 9,905,339
- Issue date Feb 27, 2018
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Photo-curing process for metallic inks
- Patent number 9,730,333
- Issue date Aug 8, 2017
- Applied Nanotech Holdings, Inc.
- Yunjun Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper particulate dispersion, conductive film forming method and c...
- Patent number 9,615,455
- Issue date Apr 4, 2017
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Buffer layer for sintering
- Patent number 9,131,610
- Issue date Sep 8, 2015
- PEN Inc.
- Zvi Yaniv
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper particulate dispersion, conductive film forming method and c...
- Patent number 9,120,944
- Issue date Sep 1, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Buffer layer to enhance photo and/or laser sintering
- Patent number 8,647,979
- Issue date Feb 11, 2014
- Applied Nanotech Holdings, Inc.
- Zvi Yaniv
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Additives and modifiers for solvent- and water-based metallic condu...
- Patent number 8,506,849
- Issue date Aug 13, 2013
- Applied Nanotech Holdings, Inc.
- Xueping Li
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Metallic ink
- Patent number 8,404,160
- Issue date Mar 26, 2013
- Applied Nanotech Holdings, Inc.
- Yunjun Li
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Silver and silver alloy plating bath
- Patent number 7,938,948
- Issue date May 10, 2011
- Ishihara Chemical Co., LTD
- Kiyotaka Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Production method of pure metal/alloy super-micro powder
- Patent number 7,799,112
- Issue date Sep 21, 2010
- Ishihara Chemical Co., Ltd.
- Yasunori Yonehana
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Silver and silver alloy plating bath
- Patent number 7,628,903
- Issue date Dec 8, 2009
- Ishihara Chemical Co., LTD
- Kiyotaka Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Colored, transparent film-forming composition, its coating method a...
- Patent number 6,730,240
- Issue date May 4, 2004
- Ishihara Chemical Co., LTD
- Kunio Arimoto
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Plating bath and process for depositing alloy containing tin and co...
- Patent number 6,607,653
- Issue date Aug 19, 2003
- Daiwa Fine Chemicals Co., Ltd.
- Kiyotaka Tsuji
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Non-cyanide-type gold-tin alloy plating bath
- Patent number 6,544,398
- Issue date Apr 8, 2003
- Ishihara Chemical Co., LTD
- Ei Uchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Tire polishing and protective composition
- Patent number 5,378,271
- Issue date Jan 3, 1995
- Ishihara Chemical Co., Ltd.
- Kunio Arimoto
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Composites made of carbon-based and metallic materials
- Patent number 5,340,658
- Issue date Aug 23, 1994
- Ishihara Chemical Co., Ltd.
- Tadao Komatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Composition for preventing formation of scales in welding
- Patent number 5,120,917
- Issue date Jun 9, 1992
- Ishihara Chemical Co., Ltd.
- Tadao Komatsu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Palladium-base electroless plating solution
- Patent number 4,804,410
- Issue date Feb 14, 1989
- Ishihara Chemical Co., Ltd.
- Masaki Haga
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin, lead, or tin-lead alloy plating bath
- Patent number 4,673,470
- Issue date Jun 16, 1987
- Obata; Keigo
- Keigo Obata
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...
- Publication number 20240258255
- Publication date Aug 1, 2024
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY
- Publication number 20240052501
- Publication date Feb 15, 2024
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER
- Publication number 20230072996
- Publication date Mar 9, 2023
- ISHIHARA CHEMICAL CO., LTD.
- Takahiro TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER
- Publication number 20220316085
- Publication date Oct 6, 2022
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
COPPER OR COPPER ALLOY ELECTROPLATING BATH
- Publication number 20220127741
- Publication date Apr 28, 2022
- ISHIHARA CHEMICAL CO., LTD.
- Masaru HATABE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
STRUCTURE CONTAINING SN LAYER OR SN ALLOY LAYER
- Publication number 20200376808
- Publication date Dec 3, 2020
- ISHIHARA CHEMICAL CO., LTD.
- Shoya IUCHI
- B32 - LAYERED PRODUCTS
Information Patent Application
ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT...
- Publication number 20190368063
- Publication date Dec 5, 2019
- ISHIHARA CHEMICAL CO., LTD.
- Syohei YAMAGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING ALLOY BUMP
- Publication number 20170330850
- Publication date Nov 16, 2017
- Ishihara Chemical Co., Ltd.
- Shoya IUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ta-Nb ALLOY POWDER AND ANODE ELEMENT FOR SOLID ELECTROLYTIC CAPACITOR
- Publication number 20170283916
- Publication date Oct 5, 2017
- ISHIHARA CHEMICAL CO., LTD.
- Takayuki MAESHIMA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
TA POWDER, PRODUCTION METHOD THEREFOR, AND TA GRANULATED POWDER
- Publication number 20160104580
- Publication date Apr 14, 2016
- ISHIHARA CHEMICAL CO., LTD.
- Takayuki MAESHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...
- Publication number 20160029483
- Publication date Jan 28, 2016
- Ishihara Chemical Co., Ltd.
- Yuichi KAWATO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...
- Publication number 20160007455
- Publication date Jan 7, 2016
- Ishihara Chemical Co., Ltd.
- Yuichi KAWATO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER
- Publication number 20150118413
- Publication date Apr 30, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER
- Publication number 20150030784
- Publication date Jan 29, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPR...
- Publication number 20150021071
- Publication date Jan 22, 2015
- Ishihara Chemical Co., Ltd.
- Yuichi Kawato
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...
- Publication number 20140370310
- Publication date Dec 18, 2014
- Applied Nanotech Holdings, Inc.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND C...
- Publication number 20140216799
- Publication date Aug 7, 2014
- APPLIED NANOTECH HOLDINGS, INC.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...
- Publication number 20140216798
- Publication date Aug 7, 2014
- APPLIED NANOTECH HOLDINGS, INC.
- Yuichi Kawato
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND...
- Publication number 20110139626
- Publication date Jun 16, 2011
- FURUKAWA ELECTRIC CO., LTD.
- Takahiro Saito
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SILVER AND SILVER ALLOY PLATING BATH
- Publication number 20090321269
- Publication date Dec 31, 2009
- ISHIHARA CHEMICAL CO., LTD.
- Kiyotaka TSUJI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METALLIC INK
- Publication number 20090274833
- Publication date Nov 5, 2009
- Ishihara Chemical Co., Ltd.
- Yunjun Li
- B22 - CASTING POWDER METALLURGY
Information Patent Application
ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDU...
- Publication number 20090242854
- Publication date Oct 1, 2009
- Applied Nanotech Holdings, Inc.
- Xueping Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Production method of pure metal/alloy super-micro powder
- Publication number 20090139372
- Publication date Jun 4, 2009
- ISHIHARA CHEMICAL CO, LTD
- Yasunori Yonehana
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Non-cyanide-type gold-tin alloy plating bath
- Publication number 20020063063
- Publication date May 30, 2002
- Ishihara Chemical Co., Ltd.
- Ei Uchida
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Trademarklast 30 trademarks

Information Trademark
79260171 - ISHIHARA CHEMICAL
- Serial number 79260171
- Registration number 5940894
- Filing date Mar 11, 2019
- ISHIHARA CHEMICAL CO., LTD.
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
85549292 - ISHIHARA CHEMICAL
- Serial number 85549292
- Registration number 4413006
- Filing date Feb 22, 2012
- Ishihara Chemical Co., Ltd.
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
78167975 - UNICON
- Serial number 78167975
- Registration number 3319323
- Filing date Sep 25, 2002
- Ishihara Chemical Co., Ltd.
- 1 - Chemicals used in industry, science and photography, as well as in agriculture, horticulture and forestry
Information Trademark
75329622 - UNICON
- Serial number 75329622
- Registration number 2386750
- Filing date Jul 23, 1997
- Ishihara Chemical Co., Ltd.
- 2 - Paints, varnishes, lacquers

ISHIHARA CHEMICAL COMPANY, LTD

Organization

Patents Grantslast 30 patents

Structure including copper plating layer or copper alloy plating layer

Copper or copper alloy electroplating bath

Tin or tin alloy electroplating bath, and electronic component havi...

Structure containing Sn layer or Sn alloy layer

Ta—Nb alloy powder and anode element for solid electrolytic capacitor

Metallic ink

Method for manufacturing alloy bump

Conductive film forming method and sintering promoter

Photo-curing process for metallic inks

Copper particulate dispersion, conductive film forming method and c...

Buffer layer for sintering

Copper particulate dispersion, conductive film forming method and c...

Buffer layer to enhance photo and/or laser sintering

Additives and modifiers for solvent- and water-based metallic condu...

Metallic ink

Silver and silver alloy plating bath

Production method of pure metal/alloy super-micro powder

Silver and silver alloy plating bath

Colored, transparent film-forming composition, its coating method a...

Plating bath and process for depositing alloy containing tin and co...

Non-cyanide-type gold-tin alloy plating bath

Tire polishing and protective composition

Composites made of carbon-based and metallic materials

Composition for preventing formation of scales in welding

Palladium-base electroless plating solution

Tin, lead, or tin-lead alloy plating bath

Patents Applicationslast 30 patents

STRUCTURE COMPRISING UNDER BARRIER METAL AND SOLDER LAYER, AND METH...

TREATMENT METHOD AFTER PLATING WITH Sn OR Sn ALLOY

STRUCTURE CONTAINING Sn LAYER OR Sn ALLOY LAYER

STRUCTURE INCLUDING COPPER PLATING LAYER OR COPPER ALLOY PLATING LAYER

COPPER OR COPPER ALLOY ELECTROPLATING BATH

STRUCTURE CONTAINING SN LAYER OR SN ALLOY LAYER

ELECTROLYTIC TIN OR TIN ALLOY PLATING BATH AND ELECTRONIC COMPONENT...

METHOD FOR MANUFACTURING ALLOY BUMP

Ta-Nb ALLOY POWDER AND ANODE ELEMENT FOR SOLID ELECTROLYTIC CAPACITOR

TA POWDER, PRODUCTION METHOD THEREFOR, AND TA GRANULATED POWDER

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD, AND...

CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER

CONDUCTIVE FILM FORMING METHOD AND SINTERING PROMOTER

CIRCUIT BOARD, CONDUCTIVE FILM FORMING METHOD AND ADHESIVENESS IMPR...

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...

CONDUCTIVE FILM FORMING METHOD, COPPER PARTICULATE DISPERSION AND C...

COPPER PARTICULATE DISPERSION, CONDUCTIVE FILM FORMING METHOD AND C...

ELECTROLYTIC COPPER COATING, METHOD OF MANUFACTURING THE SAME, AND...

SILVER AND SILVER ALLOY PLATING BATH

METALLIC INK

ADDITIVES AND MODIFIERS FOR SOLVENT- AND WATER-BASED METALLIC CONDU...

Production method of pure metal/alloy super-micro powder

Non-cyanide-type gold-tin alloy plating bath

Trademarklast 30 trademarks

79260171 - ISHIHARA CHEMICAL

85549292 - ISHIHARA CHEMICAL

78167975 - UNICON

75329622 - UNICON