Jiangsu Changjiang Electronics Technology Co., Ltd

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Jiangyin, CN

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Patents Grantslast 30 patents

Information Patent Grant
Process of package-then-etch three-dimensional package structure el...
- Patent number 11,823,911
- Issue date Nov 21, 2023
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging method and packaging device for selectively encapsulating...
- Patent number 11,784,063
- Issue date Oct 10, 2023
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Jie Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package-before-etch three-dimensional package structure electricall...
- Patent number 11,217,459
- Issue date Jan 4, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of surface-mounting three-dimensional package structure ele...
- Patent number 10,763,128
- Issue date Sep 1, 2020
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO, LTD.
- Haishen Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching-before-packaging horizontal chip 3D system-level metal circ...
- Patent number 9,640,413
- Issue date May 2, 2017
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Steve Xin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
First-etched and later-packaged three-dimensional system-in-package...
- Patent number 9,633,985
- Issue date Apr 25, 2017
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Chih-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etching-before-packaging three-dimensional system-level metal circu...
- Patent number 9,627,303
- Issue date Apr 18, 2017
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Youhai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pre-encapsulated etching-then-plating lead frame structure with isl...
- Patent number 9,362,214
- Issue date Jun 7, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-exposed-pad ball grid array (BGA) packaging structures and metho...
- Patent number 9,252,113
- Issue date Feb 2, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) packaging structure and method for manufact...
- Patent number 9,209,115
- Issue date Dec 8, 2015
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
No-exposed-pad quad flat no-lead (QFN) packaging structure and meth...
- Patent number 9,209,117
- Issue date Dec 8, 2015
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Barrel-plating quad flat no-lead (QFN) packaging structures and met...
- Patent number 9,105,622
- Issue date Aug 11, 2015
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao Wang
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...
- Publication number 20220084841
- Publication date Mar 17, 2022
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE-BEFORE-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE ELECTRICALL...
- Publication number 20190385865
- Publication date Dec 19, 2019
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Haishen KONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING-BEFORE-PACKAGING HORIZONTAL CHIP 3D SYSTEM-LEVEL METAL CIRC...
- Publication number 20160372338
- Publication date Dec 22, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Steve Xin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHING-BEFORE-PACKAGING THREE-DIMENSIONAL SYSTEM-LEVEL METAL CIRCU...
- Publication number 20160351482
- Publication date Dec 1, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Youhai Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BO...
- Publication number 20160163622
- Publication date Jun 9, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Steve Xin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST-PACKAGED AND LATER-ETCHED THREE-DIMENSIONAL FLIP-CHIP SYSTEM-...
- Publication number 20160148861
- Publication date May 26, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Chih-Chung Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-...
- Publication number 20160141233
- Publication date May 19, 2016
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD
- Steve Xin Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BARREL-PLATING QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURES AND MET...
- Publication number 20140332943
- Publication date Nov 13, 2014
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURE AND METHOD FOR MANUFACT...
- Publication number 20140319664
- Publication date Oct 30, 2014
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-EXPOSED-PAD BALL GRID ARRAY (BGA) PACKAGING STRUCTURES AND METHO...
- Publication number 20140312476
- Publication date Oct 23, 2014
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NO-EXPOSED-PAD QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURE AND METH...
- Publication number 20140264795
- Publication date Sep 18, 2014
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ENCAPSULATED ETCHING-THEN-PLATING LEAD FRAME STRUCTURE WITH ISL...
- Publication number 20140191384
- Publication date Jul 10, 2014
- JIANGSU CHANGJIANG ELECTRONICS TECHNOLOGY CO., LTD.
- Xinchao WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure with Flat Bumps for Integrate Circuit or Discrete...
- Publication number 20080315412
- Publication date Dec 25, 2008
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Jerry Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure With Flat Bumps For Electronic Device and Method...
- Publication number 20080258273
- Publication date Oct 23, 2008
- Jiangsu Changjiang Electronics Technology Co., Ltd
- Jerry Liang
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
79321628 - XDFOI
- Serial number 79321628
- Registration number 6920229
- Filing date Aug 31, 2021
- JCET Group Co.,Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
79281297 - JCET
- Serial number 79281297
- Registration number 6160941
- Filing date Dec 26, 2019
- JCET Group Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
79281616
- Serial number 79281616
- Registration number 6166477
- Filing date Dec 26, 2019
- JCET Group Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Jiangsu Changjiang Electronics Technology Co., Ltd

Organization

Patents Grantslast 30 patents

Process of package-then-etch three-dimensional package structure el...

Packaging method and packaging device for selectively encapsulating...

Package-before-etch three-dimensional package structure electricall...

Process of surface-mounting three-dimensional package structure ele...

Etching-before-packaging horizontal chip 3D system-level metal circ...

First-etched and later-packaged three-dimensional system-in-package...

Etching-before-packaging three-dimensional system-level metal circu...

Pre-encapsulated etching-then-plating lead frame structure with isl...

No-exposed-pad ball grid array (BGA) packaging structures and metho...

Quad flat no-lead (QFN) packaging structure and method for manufact...

No-exposed-pad quad flat no-lead (QFN) packaging structure and meth...

Barrel-plating quad flat no-lead (QFN) packaging structures and met...

Patents Applicationslast 30 patents

PROCESS OF PACKAGE-THEN-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE EL...

PACKAGE-BEFORE-ETCH THREE-DIMENSIONAL PACKAGE STRUCTURE ELECTRICALL...

ETCHING-BEFORE-PACKAGING HORIZONTAL CHIP 3D SYSTEM-LEVEL METAL CIRC...

ETCHING-BEFORE-PACKAGING THREE-DIMENSIONAL SYSTEM-LEVEL METAL CIRCU...

PACKAGING-BEFORE-ETCHING FLIP CHIP 3D SYSTEM-LEVEL METAL CIRCUIT BO...

FIRST-PACKAGED AND LATER-ETCHED THREE-DIMENSIONAL FLIP-CHIP SYSTEM-...

FIRST-PACKAGED AND LATER-ETCHED NORMAL CHIP THREE DIMENSION SYSTEM-...

BARREL-PLATING QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURES AND MET...

QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURE AND METHOD FOR MANUFACT...

NO-EXPOSED-PAD BALL GRID ARRAY (BGA) PACKAGING STRUCTURES AND METHO...

NO-EXPOSED-PAD QUAD FLAT NO-LEAD (QFN) PACKAGING STRUCTURE AND METH...

PRE-ENCAPSULATED ETCHING-THEN-PLATING LEAD FRAME STRUCTURE WITH ISL...

Package Structure with Flat Bumps for Integrate Circuit or Discrete...

Package Structure With Flat Bumps For Electronic Device and Method...

Trademarklast 30 trademarks

79321628 - XDFOI

79281297 - JCET

79281616