JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD

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Jiangyin, Jiangsu, CN

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Patents Grantslast 30 patents

Information Patent Grant
Chip packaging structure, and packaging method thereof
- Patent number 10,777,477
- Issue date Sep 15, 2020
- JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
- Li Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for packaging low-K chip
- Patent number 8,987,055
- Issue date Mar 24, 2015
- Jiangyin Changdian Advanced Packaging Co., Ltd
- Li Zhang
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGING STRUCTURE, AND PACKAGING METHOD THEREOF
- Publication number 20190214324
- Publication date Jul 11, 2019
- JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
- Li ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LED PACKAGING STRUCTURE
- Publication number 20160322539
- Publication date Nov 3, 2016
- JIANGYIN CHANGDIAN ADVANCED PACKAGING CO.,LTD
- Li ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW-K CHIP PACKAGING STRUCTURE
- Publication number 20140191379
- Publication date Jul 10, 2014
- JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
- Li Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PACKAGING LOW-K CHIP
- Publication number 20140162404
- Publication date Jun 12, 2014
- JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
- Li Zhang
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
86517627 - JCAP
- Serial number 86517627
- Registration number 4807793
- Filing date Jan 29, 2015
- JIANGYIN CHANGDIAN ADVANCED PACKAGING CO., LTD
- 40 - Treatment of materials