Meiko Electronics, Co., Ltd.

Organization

Kanagawa, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Memory device and memory device module
- Patent number 12,009,282
- Issue date Jun 11, 2024
- MEIKO ELECTRONICS CO., LTD.
- Shuzo Akejima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Rotary machine coil using a winding electric wire
- Patent number 11,128,190
- Issue date Sep 21, 2021
- Meiko Electronics Co., Ltd.
- Kimiaki Iwaya
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Encapsulated circuit module, and production method therefor
- Patent number 10,665,568
- Issue date May 26, 2020
- Meiko Electronics Co., Ltd.
- Satoru Miwa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,537,021
- Issue date Jan 14, 2020
- Meiko Electronics Co., Ltd.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treatment agent and novel compound
- Patent number 10,385,076
- Issue date Aug 20, 2019
- Sulfur Chemical Laboratory, Inc.
- Kunio Mori
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Three-dimensional wiring board production method, three-dimensional...
- Patent number 10,244,624
- Issue date Mar 26, 2019
- MEIKO ELECTRONICS CO., LTD.
- Shigeru Michiwaki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface treatment method, surface treatment agent, and novel compound
- Patent number 9,790,242
- Issue date Oct 17, 2017
- Sulfur Chemical Laboratory, Inc.
- Kunio Mori
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Method for manufacturing device embedded substrate, and device embe...
- Patent number 9,793,218
- Issue date Oct 17, 2017
- MEIKO ELECTRONICS CO., LTD.
- Mitsuaki Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device embedded substrate and manufacturing method of device embedd...
- Patent number 9,756,732
- Issue date Sep 5, 2017
- MEIKO ELECTRONICS CO., LTD.
- Yasuaki Seki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,622,352
- Issue date Apr 11, 2017
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming metal film, and product equipped with metal film
- Patent number 9,593,423
- Issue date Mar 14, 2017
- Sulfur Chemical Laboratory Incorporated
- Kunio Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Manufacturing method for component incorporated substrate and compo...
- Patent number 9,596,765
- Issue date Mar 14, 2017
- MEIKO ELECTRONICS CO., LTD.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Component-embedded substrate manufacturing method
- Patent number 9,526,182
- Issue date Dec 20, 2016
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate manufacturing method
- Patent number 9,380,711
- Issue date Jun 28, 2016
- MEIKO ELECTRONICS CO., LTD.
- Shukichi Takii
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating heat dissipating board
- Patent number 9,363,885
- Issue date Jun 7, 2016
- Meiko Electronics Co., Ltd.
- Noriaki Taneko
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of device embedded substrate and device embedd...
- Patent number 9,355,990
- Issue date May 31, 2016
- MEIKO ELECTRONICS CO., LTD.
- Tohru Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Printed wiring board
- Patent number 9,326,376
- Issue date Apr 26, 2016
- MEIKO ELECTRONICS CO., LTD.
- Akihiro Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing a component-embedded substrate
- Patent number 9,320,185
- Issue date Apr 19, 2016
- MEIKO ELECTRONICS CO., LTD.
- Yoshio Imamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing printed circuit board, and printed board produc...
- Patent number 9,185,811
- Issue date Nov 10, 2015
- MEIKO ELECTRONICS CO., LTD.
- Yoichi Saito
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Component-embedded substrate, and method of manufacturing the compo...
- Patent number 8,921,706
- Issue date Dec 30, 2014
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming metal film, and product equipped with metal film
- Patent number 8,753,748
- Issue date Jun 17, 2014
- Sulfur Chemical Laboratory Incorporated
- Kunio Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Printed wiring board
- Patent number 7,800,917
- Issue date Sep 21, 2010
- Meiko Electronics Co., Ltd.
- Hiroshi Shimada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board
- Patent number 7,609,526
- Issue date Oct 27, 2009
- Meiko Electronics Co., Ltd.
- Shunsuke Eiki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, manufacturing method therefor, and bump-type contact...
- Patent number 6,350,957
- Issue date Feb 26, 2002
- Meiko Electronics, Co., Ltd.
- Noboru Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, manufacturing method therefor, and bump-type contact...
- Patent number 6,239,983
- Issue date May 29, 2001
- Meiko Electronics Co., Ltd.
- Noboru Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board, manufacturing method therefor, and bump-type contact...
- Patent number 5,886,877
- Issue date Mar 23, 1999
- Meiko Electronics Co., Ltd.
- Noboru Shingai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for producing copper-clad laminate
- Patent number 5,096,522
- Issue date Mar 17, 1992
- Meiko Electronics Co., Ltd.
- Norio Kawachi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for producing a copper-clad laminate
- Patent number 5,049,221
- Issue date Sep 17, 1991
- Meiko Electronics Co., Ltd.
- Tatsuo Wada
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of producing conductor circuit boards
- Patent number 4,889,584
- Issue date Dec 26, 1989
- Meiko Electronics Co., Ltd.
- Tatsuo Wada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Connector for optical fiber
- Patent number 4,850,664
- Issue date Jul 25, 1989
- Dainichi-Nippon Cables, Ltd.
- Eiji Iri
- G02 - OPTICS

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Patents Applicationslast 30 patents

Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240237189
- Publication date Jul 11, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME
- Publication number 20240138053
- Publication date Apr 25, 2024
- Meiko Electronics Co., Ltd.
- Tohru MATSUMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MEMORY DEVICE AND MEMORY DEVICE MODULE
- Publication number 20230411237
- Publication date Dec 21, 2023
- MEIKO ELECTRONICS CO., LTD.
- Shuzo AKEJIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANAR ANTENNA BOARD
- Publication number 20230143088
- Publication date May 11, 2023
- MEIKO ELECTRONICS CO., LTD.
- Mitsuaki TODA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...
- Publication number 20190124763
- Publication date Apr 25, 2019
- MEIKO ELECTRONICS CO., LTD.
- Shigeru MICHIWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...
- Publication number 20180160528
- Publication date Jun 7, 2018
- Meiko Electronics Co., Ltd.
- Shigeru MICHIWAKI
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Encapsulated Circuit Module, And Production Method Therefor
- Publication number 20170354039
- Publication date Dec 7, 2017
- Meiko Electronics Co., Ltd.
- Satoru MIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Encapsulated Circuit Module, And Production Method Therefor
- Publication number 20170345789
- Publication date Nov 30, 2017
- Meiko Electronics Co., Ltd.
- Satoru MIWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Encapsulated Circuit Module, And Production Method Therefor
- Publication number 20170347462
- Publication date Nov 30, 2017
- Meiko Electronics Co., Ltd.
- Satoru MIWA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SURFACE TREATMENT AGENT AND NOVEL COMPOUND
- Publication number 20170334933
- Publication date Nov 23, 2017
- Sulfur Chemical Laboratory, Inc.
- Kunio MORI
- C07 - ORGANIC CHEMISTRY
Information Patent Application
METHOD OF FABRICATING HEAT DISSIPATING BOARD
- Publication number 20160143126
- Publication date May 19, 2016
- Meiko Electronics Co., Ltd.
- Noriaki TANEKO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20160118346
- Publication date Apr 28, 2016
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING DEVICE EMBEDDED SUBSTRATE, AND DEVICE EMBE...
- Publication number 20160099215
- Publication date Apr 7, 2016
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUCTION DEVICE
- Publication number 20160016318
- Publication date Jan 21, 2016
- Meiko Electronics Co., Ltd.
- Shigeru Kawata
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF DEVICE EMBEDD...
- Publication number 20150382478
- Publication date Dec 31, 2015
- Meiko Electronics Co., Ltd.
- Hiroshi SHIMADA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PRINTED WIRING BOARD
- Publication number 20150373829
- Publication date Dec 24, 2015
- Meiko Electronics Co., Ltd.
- Akihiro Ishikawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Device Embedded Substrate and Manufacturing Method of Device Embedd...
- Publication number 20150327369
- Publication date Nov 12, 2015
- Meiko Electronics Co., Ltd.
- Yasuaki Seki
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE POR...
- Publication number 20150257284
- Publication date Sep 10, 2015
- Meiko Electronics Co., Ltd.
- Mitsuaki Toda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Manufacturing Method of Device Embedded Substrate and Device Embedd...
- Publication number 20150243628
- Publication date Aug 27, 2015
- Meiko Electronics Co., Ltd.
- Tohru Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20150245475
- Publication date Aug 27, 2015
- Meiko Electronics Co., Ltd.
- Tohru Matsumoto
- B32 - LAYERED PRODUCTS
Information Patent Application
MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...
- Publication number 20150237734
- Publication date Aug 20, 2015
- MEIKO ELECTRONICS CO., LTD.
- Ryoichi Shimizu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...
- Publication number 20150223343
- Publication date Aug 6, 2015
- Meiko Electronics Co., Ltd.
- Akira Yamaki
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND NOVEL COMPOUND
- Publication number 20150152124
- Publication date Jun 4, 2015
- Sulfur Chemical Laboratory, Inc.
- Kunio Mori
- C07 - ORGANIC CHEMISTRY
Information Patent Application
COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...
- Publication number 20140347835
- Publication date Nov 27, 2014
- Meiko Electronics Co., Ltd.
- Ryoichi Shimizu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Component-Embedded Substrate Manufacturing Method and Component-Emb...
- Publication number 20140299367
- Publication date Oct 9, 2014
- Meiko Electronics Co., Ltd.
- Yoshio Imamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM
- Publication number 20140227539
- Publication date Aug 14, 2014
- Kunio Mori
- Kunio MORI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Substrate Manufacturing Method
- Publication number 20140224762
- Publication date Aug 14, 2014
- Meiko Electronics Co., Ltd.
- Shukichi Takii
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-...
- Publication number 20140216801
- Publication date Aug 7, 2014
- Meiko Electronics Co., Ltd.
- Tohru Matsumoto
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SPIRAL PROBE AND METHOD OF MANUFACTURING THE SPIRAL PROBE
- Publication number 20140111238
- Publication date Apr 24, 2014
- Meiko Electronics Co., Ltd.
- Noboru Shingai
- G01 - MEASURING TESTING
Information Patent Application
Method of Manufacturing Component-Embedded Substrate, and Component...
- Publication number 20130242516
- Publication date Sep 19, 2013
- MEIKO ELECTRONICS CO., LTD.
- Yoshio Imamura
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
79145726 - M-VIA FLEX
- Serial number 79145726
- Registration number 4677056
- Filing date Feb 14, 2014
- MEIKO ELECTRONICS CO., LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
79145820 - M-VIA EMBEDDED
- Serial number 79145820
- Registration number 4677058
- Filing date Feb 14, 2014
- MEIKO ELECTRONICS CO., LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
79079517 - MEIKO
- Serial number 79079517
- Registration number 3867628
- Filing date Nov 11, 2009
- MEIKO ELECTRONICS CO., LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Meiko Electronics, Co., Ltd.

Organization

Patents Grantslast 30 patents

Memory device and memory device module

Rotary machine coil using a winding electric wire

Encapsulated circuit module, and production method therefor

Three-dimensional wiring board production method, three-dimensional...

Surface treatment agent and novel compound

Three-dimensional wiring board production method, three-dimensional...

Surface treatment method, surface treatment agent, and novel compound

Method for manufacturing device embedded substrate, and device embe...

Device embedded substrate and manufacturing method of device embedd...

Manufacturing method for component incorporated substrate and compo...

Process for forming metal film, and product equipped with metal film

Manufacturing method for component incorporated substrate and compo...

Component-embedded substrate manufacturing method

Substrate manufacturing method

Method of fabricating heat dissipating board

Manufacturing method of device embedded substrate and device embedd...

Printed wiring board

Method of manufacturing a component-embedded substrate

Method of producing printed circuit board, and printed board produc...

Component-embedded substrate, and method of manufacturing the compo...

Process for forming metal film, and product equipped with metal film

Printed wiring board

Circuit board

Circuit board, manufacturing method therefor, and bump-type contact...

Circuit board, manufacturing method therefor, and bump-type contact...

Circuit board, manufacturing method therefor, and bump-type contact...

Process for producing copper-clad laminate

Process for producing a copper-clad laminate

Method of producing conductor circuit boards

Connector for optical fiber

Patents Applicationslast 30 patents

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF SAME

MEMORY DEVICE AND MEMORY DEVICE MODULE

PLANAR ANTENNA BOARD

THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...

THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL...

Encapsulated Circuit Module, And Production Method Therefor

Encapsulated Circuit Module, And Production Method Therefor

Encapsulated Circuit Module, And Production Method Therefor

SURFACE TREATMENT AGENT AND NOVEL COMPOUND

METHOD OF FABRICATING HEAT DISSIPATING BOARD

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING DEVICE EMBEDDED SUBSTRATE, AND DEVICE EMBE...

SUCTION DEVICE

DEVICE EMBEDDED SUBSTRATE AND MANUFACTURING METHOD OF DEVICE EMBEDD...

PRINTED WIRING BOARD

Device Embedded Substrate and Manufacturing Method of Device Embedd...

METHOD OF BENDING BACK RIGID PRINTED WIRING BOARD WITH FLEXIBLE POR...

Manufacturing Method of Device Embedded Substrate and Device Embedd...

COMPONENT-EMBEDDED SUBSTRATE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...

MANUFACTURING METHOD FOR COMPONENT INCORPORATED SUBSTRATE AND COMPO...

SURFACE TREATMENT METHOD, SURFACE TREATMENT AGENT, AND NOVEL COMPOUND

COMPONENT-EMBEDDED SUBSTRATE MANUFACTURING METHOD AND COMPONENT-EMB...

Component-Embedded Substrate Manufacturing Method and Component-Emb...

PROCESS FOR FORMING METAL FILM, AND PRODUCT EQUIPPED WITH METAL FILM

Substrate Manufacturing Method

METHOD OF MANUFACTURING COMPONENT-EMBEDDED SUBSTRATE AND COMPONENT-...

SPIRAL PROBE AND METHOD OF MANUFACTURING THE SPIRAL PROBE

Method of Manufacturing Component-Embedded Substrate, and Component...

Trademarklast 30 trademarks

79145726 - M-VIA FLEX

79145820 - M-VIA EMBEDDED

79079517 - MEIKO