MICROASSEMBLY TECHNOLOGIES, INC.

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Richmond, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
MEMS device with integral packaging
- Patent number 8,295,027
- Issue date Oct 23, 2012
- Microassembly Technologies, Inc.
- Michael Bennett Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with integral packaging
- Patent number 8,179,215
- Issue date May 15, 2012
- Microassembly Technologies, Inc.
- Michael Bennett Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 7,750,462
- Issue date Jul 6, 2010
- Microassembly Technologies, Inc.
- Michael Bennett Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
High force MEMS device
- Patent number 7,692,521
- Issue date Apr 6, 2010
- Microassembly Technologies, Inc.
- Michael B. Cohn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 7,276,789
- Issue date Oct 2, 2007
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS device with integral packaging
- Patent number 6,872,902
- Issue date Mar 29, 2005
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems using thermocompression bonding
- Patent number 6,853,067
- Issue date Feb 8, 2005
- Microassembly Technologies, Inc.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
MEMS DEVICE WITH INTEGRAL PACKAGING
- Publication number 20120193754
- Publication date Aug 2, 2012
- MICROASSEMBLY TECHNOLOGIES, INC.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS DEVICE WITH INTEGRAL PACKAGING
- Publication number 20080272867
- Publication date Nov 6, 2008
- MICROASSEMBLY TECHNOLOGIES, INC.
- Michael B. Cohn
- B81 - MICRO-STRUCTURAL TECHNOLOGY

MICROASSEMBLY TECHNOLOGIES, INC.

Organization

Patents Grantslast 30 patents

MEMS device with integral packaging

MEMS device with integral packaging

Microelectromechanical systems using thermocompression bonding

High force MEMS device

Microelectromechanical systems using thermocompression bonding

MEMS device with integral packaging

Microelectromechanical systems using thermocompression bonding

Patents Applicationslast 30 patents

MEMS DEVICE WITH INTEGRAL PACKAGING

MEMS DEVICE WITH INTEGRAL PACKAGING

Trademarklast 30 trademarks