MK ELECTRON CO. LTD.

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Yongin-city, KR

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Patents Grantslast 30 patents

Information Patent Grant
Lead-free solder alloy and method of manufacturing electronic devic...
- Patent number 12,030,140
- Issue date Jul 9, 2024
- MK Electron Co., Ltd.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package using core material for reverse reflow
- Patent number 11,646,285
- Issue date May 9, 2023
- MK Electron Co., Ltd.
- Jae Yeol Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Negative electrode active material and method of preparing the same
- Patent number 10,651,463
- Issue date May 12, 2020
- Samsung SDI Co., Ltd.
- Soonsung Suh
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Negative electrode active material for lithium secondary battery, a...
- Patent number 10,490,811
- Issue date Nov 26, 2019
- Samsung SDI Co., Ltd.
- Hana Yoo
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Negative active material for secondary battery, negative electrode...
- Patent number 10,276,865
- Issue date Apr 30, 2019
- Samsung SDI Co., Ltd.
- Soonsung Suh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder balls and semiconductor device employing the same
- Patent number 9,391,039
- Issue date Jul 12, 2016
- MK Electron Co., Ltd.
- Jeong Tak Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead free solder bumps
- Patent number 9,156,111
- Issue date Oct 13, 2015
- MK Electron Co., Ltd.
- Sung Jae Hong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-based solder ball and semiconductor package including the same
- Patent number 8,716,860
- Issue date May 6, 2014
- MK Electron Co., Ltd.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Au-Ag based alloy wire for semiconductor package
- Patent number 8,022,541
- Issue date Sep 20, 2011
- MK Electron Co., Ltd.
- Jong Soo Cho
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Lead free solder containing Sn, Ag and Bi
- Patent number 7,670,548
- Issue date Mar 2, 2010
- MK Electron Co., Ltd.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Pb-free solder alloy
- Patent number 7,250,135
- Issue date Jul 31, 2007
- MK Electron Co., Ltd.
- Suk Joon Lim
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold alloy bonding wire for semiconductor device
- Patent number 6,991,854
- Issue date Jan 31, 2006
- MK Electron Co., Ltd.
- Jong Soo Cho
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Gold-silver bonding wire for semiconductor device
- Patent number 6,700,199
- Issue date Mar 2, 2004
- MK Electron Co., Ltd.
- Jeong-Tak Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing solder balls
- Patent number 6,569,378
- Issue date May 27, 2003
- MK Electron Co., Ltd.
- Jin-Hyung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing solder balls
- Patent number 6,312,498
- Issue date Nov 6, 2001
- MK Electron Co., Ltd.
- Jin-Hyung Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LEAD-FREE SOLDER ALLOY AND METHOD OF MANUFACTURING ELECTRONIC DEVIC...
- Publication number 20230111798
- Publication date Apr 13, 2023
- MK ELECTRON CO., LTD.
- Young Woo LEE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD-FREE SOLDER ALLOY, SOLDER PASTE COMPRISING THE SAME, AND SEMIC...
- Publication number 20220212293
- Publication date Jul 7, 2022
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PIN-GRID-ARRAY-TYPE SEMICONDUCTOR PACKAGE
- Publication number 20210375811
- Publication date Dec 2, 2021
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE USING CORE MATERIAL FOR REVERSE REFLOW
- Publication number 20210366858
- Publication date Nov 25, 2021
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY, A...
- Publication number 20180090756
- Publication date Mar 29, 2018
- MK ELECTRON CO., LTD.
- Hana YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEGATIVE ELECTRODE ACTIVE MATERIAL AND METHOD OF PREPARING THE SAME
- Publication number 20170346085
- Publication date Nov 30, 2017
- Samsung SDI Co., Ltd.
- Soonsung SUH
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...
- Publication number 20160315040
- Publication date Oct 27, 2016
- MK Electron Co., Ltd.
- Jae Yeol SON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER HAVING LOW MELTING POINT
- Publication number 20160256962
- Publication date Sep 8, 2016
- MK ELECTRON CO., LTD.
- Hui Joong KIM
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SOLDER BALL FOR FLUXLESS BONDING, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20160244891
- Publication date Aug 25, 2016
- MK ELECTRON CO., LTD.
- Jae Yeol SON
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SOLDER BALLS AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME
- Publication number 20150380373
- Publication date Dec 31, 2015
- MK ELECTRON CO., LTD.
- Jeong Tak MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD-FREE SOLDER, SOLDER PASTE AND SEMICONDUCTOR DEVICE
- Publication number 20150151386
- Publication date Jun 4, 2015
- MK ELECTRON CO., LTD.
- Sung Jae HONG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWDER MANUFACTURING APPARATUS AND ANODE ACTIVE MATERIAL FOR...
- Publication number 20150072235
- Publication date Mar 12, 2015
- MK ELECTRON CO., LTD.
- Soon Ho HONG
- B02 - CRUSHING, PULVERISING, OR DISINTEGRATING PREPARATORY TREATMENT OF GRAIN...
Information Patent Application
METAL BALL FABRICATING APPARATUS
- Publication number 20150064293
- Publication date Mar 5, 2015
- MK ELECTRON CO., LTD.
- Jeong Tak MOON
- B22 - CASTING POWDER METALLURGY
Information Patent Application
NEGATIVE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF...
- Publication number 20150041707
- Publication date Feb 12, 2015
- MK ELECTRON CO., LTD.
- Sung Min JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20140284794
- Publication date Sep 25, 2014
- MK ELECTRON CO., LTD.
- Jae Hong Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF MANUFACTU...
- Publication number 20140203207
- Publication date Jul 24, 2014
- MK ELECTRON CO., LTD.
- Hee Sang Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF MANUFACTU...
- Publication number 20140199594
- Publication date Jul 17, 2014
- MK ELECTRON CO., LTD.
- Soon Ho HONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND SECONDARY BATTERY I...
- Publication number 20140023928
- Publication date Jan 23, 2014
- MK ELECTRON CO., LTD.
- Sung Min JEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME
- Publication number 20130175688
- Publication date Jul 11, 2013
- MK ELECTRON CO., LTD.
- Young Woo LEE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
LEAD FREE SOLDER CONTAINING Sn, Ag AND Bi
- Publication number 20080308189
- Publication date Dec 18, 2008
- MK ELECTRON CO., LTD.
- Young Woo Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE
- Publication number 20080240975
- Publication date Oct 2, 2008
- MK ELECTRON CO. LTD.
- Jong Soo Cho
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY
- Publication number 20080230915
- Publication date Sep 25, 2008
- MK ELECTRON CO. LTD.
- Jong Soo CHO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AU-AG BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE
- Publication number 20070278634
- Publication date Dec 6, 2007
- MK ELECTRON CO., LTD.
- Jong Soo Cho
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Au alloy bonding wire
- Publication number 20060251538
- Publication date Nov 9, 2006
- MK ELECTRON CO., LTD.
- Gyung Sik Yun
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Copper bonding wire for semiconductor packaging
- Publication number 20060186544
- Publication date Aug 24, 2006
- MK ELECTRON CO., LTD.
- Sung-Joon Won
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pb-free solder alloy
- Publication number 20060088440
- Publication date Apr 27, 2006
- MK ELECTRON CO., LTD.
- Suk Joon Lim
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Gold alloy bonding wire for semiconductor device
- Publication number 20040202568
- Publication date Oct 14, 2004
- MK ELECTRON CO., LTD.
- Jong Soo Cho
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Apparatus for manufacturing solder balls
- Publication number 20020005606
- Publication date Jan 17, 2002
- MK Electron Co., Ltd
- Jin-Hyung Lee
- B22 - CASTING POWDER METALLURGY

Trademarklast 30 trademarks

Information Trademark
79058075 - MKE M K ELECTRON
- Serial number 79058075
- Registration number 3580871
- Filing date Jul 15, 2008
- MK ELECTRON CO., LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

MK ELECTRON CO. LTD.

Organization

Patents Grantslast 30 patents

Lead-free solder alloy and method of manufacturing electronic devic...

Semiconductor package using core material for reverse reflow

Negative electrode active material and method of preparing the same

Negative electrode active material for lithium secondary battery, a...

Negative active material for secondary battery, negative electrode...

Solder balls and semiconductor device employing the same

Lead free solder bumps

Tin-based solder ball and semiconductor package including the same

Au-Ag based alloy wire for semiconductor package

Lead free solder containing Sn, Ag and Bi

Pb-free solder alloy

Gold alloy bonding wire for semiconductor device

Gold-silver bonding wire for semiconductor device

Apparatus for manufacturing solder balls

Method of manufacturing solder balls

Patents Applicationslast 30 patents

LEAD-FREE SOLDER ALLOY AND METHOD OF MANUFACTURING ELECTRONIC DEVIC...

LEAD-FREE SOLDER ALLOY, SOLDER PASTE COMPRISING THE SAME, AND SEMIC...

PIN-GRID-ARRAY-TYPE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE USING CORE MATERIAL FOR REVERSE REFLOW

NEGATIVE ELECTRODE ACTIVE MATERIAL FOR LITHIUM SECONDARY BATTERY, A...

NEGATIVE ELECTRODE ACTIVE MATERIAL AND METHOD OF PREPARING THE SAME

CORE FOR REVERSE REFLOW, SEMICONDUCTOR PACKAGE, AND METHOD OF FABRI...

LEAD-FREE SOLDER HAVING LOW MELTING POINT

SOLDER BALL FOR FLUXLESS BONDING, METHOD OF MANUFACTURING THE SAME,...

SOLDER BALLS AND SEMICONDUCTOR DEVICE EMPLOYING THE SAME

LEAD-FREE SOLDER, SOLDER PASTE AND SEMICONDUCTOR DEVICE

POWDER MANUFACTURING APPARATUS AND ANODE ACTIVE MATERIAL FOR...

METAL BALL FABRICATING APPARATUS

NEGATIVE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF...

TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF MANUFACTU...

ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND METHOD OF MANUFACTU...

ANODE ACTIVE MATERIAL FOR SECONDARY BATTERY AND SECONDARY BATTERY I...

TIN-BASED SOLDER BALL AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME

LEAD FREE SOLDER CONTAINING Sn, Ag AND Bi

AG-BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE USING WIRES CONSISTING OF Ag OR Ag ALLOY

AU-AG BASED ALLOY WIRE FOR SEMICONDUCTOR PACKAGE

Au alloy bonding wire

Copper bonding wire for semiconductor packaging

Pb-free solder alloy

Gold alloy bonding wire for semiconductor device

Apparatus for manufacturing solder balls

Trademarklast 30 trademarks

79058075 - MKE M K ELECTRON