Claims
- 1. An apparatus for manufacturing solder balls, comprising:
a tundish having one or more orifices at its bottom and containing molten metal controllable in its level; a vibrator being immersed in the molten metal of the tundish and generating vibrations; a cooling liquid tank being situated under the tundish and being provided with a cooling liquid heater at its upper and middle outer surface, a cooling liquid cooler at its lower outer surface and a cooling liquid discharge conduit at its top; an inactive atmospheric chamber being interposed between a bottom of the tundish and a top surface of the molten metal; a molten metal receiving tray being seated on a portion of the inactive atmospheric chamber and being horizontally movable; a ball collecting barrel being positioned under the cooling liquid tank and being provided with a cut-off valve at its top, a ball removing valve at its bottom and a cooling liquid supply conduit at its upper portion; and, a cooling liquid reservoir being situated under the ball collecting barrel, being provided with a ball collecting sieve at its inlet and being connected with the cooling liquid discharge conduit and the cooling liquid supply conduit.
- 2. The apparatus according to claim 1, wherein said orifice is configured to be diminished from its top to its bottom so as to transmit vibrations generated by said vibrator to the stream flowing through the orifice.
CROSS REFERENCE TO RELATED APPLICATION
[0001] The present application is a divisional of U.S. patent application Ser. No. 09/460,573, filed Dec. 19, 1999.
Divisions (1)
|
Number |
Date |
Country |
Parent |
09460573 |
Dec 1999 |
US |
Child |
09964305 |
Sep 2001 |
US |