MRSI Systems, LLC

Organization

North Billerica, MA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Die bonding system with wafer lift and level assembly
- Patent number 11,791,197
- Issue date Oct 17, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and system to passively align and attach fiber array to lase...
- Patent number 10,598,861
- Issue date Mar 24, 2020
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- G02 - OPTICS
Information Patent Grant
Die placement head with turret
- Patent number 10,588,981
- Issue date Mar 17, 2020
- MRSI Systems LLC
- Nicholas Samuel Celia
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Method and system to passively align and attach fiber array to lase...
- Patent number 10,409,004
- Issue date Sep 10, 2019
- Indiana Integrated Circuits, LLC
- Jason M. Kulick
- G02 - OPTICS
Information Patent Grant
Thermo-compression bonding system, subsystems, and methods of use
- Patent number 9,911,710
- Issue date Mar 6, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
INERT GAS CHAMBER
- Publication number 20240047412
- Publication date Feb 8, 2024
- MRSI Systems LLC
- Dennis Carew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-ALIGNING TIP
- Publication number 20230223289
- Publication date Jul 13, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DIE BONDING SYSTEM WITH WAFER LIFT AND LEVEL ASSEMBLY
- Publication number 20230148356
- Publication date May 11, 2023
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE BONDING SYSTEM WITH HEATED AUTOMATIC COLLET CHANGER
- Publication number 20220102187
- Publication date Mar 31, 2022
- MRSI Systems LLC
- Nicholas Samuel Celia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System to Passively Align and Attach Fiber Array to Lase...
- Publication number 20200003955
- Publication date Jan 2, 2020
- Indiana Integrated Circuits, LLC
- Jason M. KULICK
- G02 - OPTICS
Information Patent Application
Method and System to Passively Align and Attach Fiber Array to Lase...
- Publication number 20190250335
- Publication date Aug 15, 2019
- Indiana Integrated Circuits, LLC
- Jason M. KULICK
- G02 - OPTICS
Information Patent Application
DIE PLACEMENT HEAD WITH TURRET
- Publication number 20180323088
- Publication date Nov 8, 2018
- MRSI Systems, LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
THERMO-COMPRESSION BONDING SYSTEM, SUBSYSTEMS, AND METHODS OF USE
- Publication number 20160126213
- Publication date May 5, 2016
- MRSI SYSTEMS LLC
- Nicholas Samuel Celia
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT...
- Publication number 20150380379
- Publication date Dec 31, 2015
- MRSI Systems, LLC
- Cyriac Devasia
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
86236530 - YOUR STANDARD IN PRECISION AUTOMATION
- Serial number 86236530
- Registration number 4597323
- Filing date Mar 30, 2014
- MRSI SYSTEMS, LLC
- 7 - Machines and machine tools
Information Trademark
86185667 - MRSI
- Serial number 86185667
- Registration number 4597126
- Filing date Feb 5, 2014
- MRSI SYSTEMS, LLC
- 7 - Machines and machine tools

MRSI Systems, LLC

Organization

Patents Grantslast 30 patents

Die bonding system with wafer lift and level assembly

Method and system to passively align and attach fiber array to lase...

Die placement head with turret

Method and system to passively align and attach fiber array to lase...

Thermo-compression bonding system, subsystems, and methods of use

Patents Applicationslast 30 patents

INERT GAS CHAMBER

SELF-ALIGNING TIP

DIE BONDING SYSTEM WITH WAFER LIFT AND LEVEL ASSEMBLY

DIE BONDING SYSTEM WITH HEATED AUTOMATIC COLLET CHANGER

Method and System to Passively Align and Attach Fiber Array to Lase...

Method and System to Passively Align and Attach Fiber Array to Lase...

DIE PLACEMENT HEAD WITH TURRET

THERMO-COMPRESSION BONDING SYSTEM, SUBSYSTEMS, AND METHODS OF USE

SYSTEM AND METHOD FOR THERMO-COMPRESSION BONDING OF HIGH BUMP COUNT...

Trademarklast 30 trademarks

86236530 - YOUR STANDARD IN PRECISION AUTOMATION

86185667 - MRSI