NAPRA CO., LTD.

Organization

Tokyo, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Terminal
- Patent number 12,113,321
- Issue date Oct 8, 2024
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particle
- Patent number 11,534,870
- Issue date Dec 27, 2022
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding structure
- Patent number 11,453,089
- Issue date Sep 27, 2022
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particle
- Patent number 11,364,575
- Issue date Jun 21, 2022
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joint structure
- Patent number 10,906,136
- Issue date Feb 2, 2021
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Preform for semiconductor encapsulation
- Patent number 10,629,506
- Issue date Apr 21, 2020
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal particle and articles formed therefrom
- Patent number 10,507,551
- Issue date Dec 17, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal particle and electroconductive paste formed therefrom
- Patent number 10,478,924
- Issue date Nov 19, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 10,468,376
- Issue date Nov 5, 2019
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal particles having intermetallic compound nano-composite struct...
- Patent number 10,016,848
- Issue date Jul 10, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Multi-layer preform sheet
- Patent number 9,950,496
- Issue date Apr 24, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming functional part in minute space
- Patent number 9,950,925
- Issue date Apr 24, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Three-dimensional laminated circuit board, electronic device, infor...
- Patent number 9,924,592
- Issue date Mar 20, 2018
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,735,074
- Issue date Aug 15, 2017
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate with built-in passive element
- Patent number 9,730,325
- Issue date Aug 8, 2017
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for electronic device and electronic device
- Patent number 9,704,793
- Issue date Jul 11, 2017
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Insulating paste, electronic device and method for forming insulator
- Patent number 9,691,519
- Issue date Jun 27, 2017
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and manufacturing method therefor
- Patent number 9,685,394
- Issue date Jun 20, 2017
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device, method of manufacturing the same, metal particle...
- Patent number 9,515,044
- Issue date Dec 6, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor substrate, eletronic device and method for manufactur...
- Patent number 9,460,965
- Issue date Oct 4, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit device
- Patent number 9,349,720
- Issue date May 24, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing spherical particles, having nanometer size, cr...
- Patent number 9,339,871
- Issue date May 17, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Functional material
- Patent number 9,293,416
- Issue date Mar 22, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Semiconductor substrate, electronic device and method for manufactu...
- Patent number 9,230,860
- Issue date Jan 5, 2016
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Junction and electrical connection
- Patent number 9,142,518
- Issue date Sep 22, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and manufacturing method therefor
- Patent number 9,076,786
- Issue date Jul 7, 2015
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Light-emitting device comprising vertical conductors and through el...
- Patent number 8,766,312
- Issue date Jul 1, 2014
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Spherical particles having nanometer size, crystalline structure, a...
- Patent number 8,758,900
- Issue date Jun 24, 2014
- Napra Co., Ltd
- Shigenobu Sekine
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Electronic device, conductive composition, metal filling apparatus,...
- Patent number 8,759,211
- Issue date Jun 24, 2014
- Napra Co., Ltd.
- Shigenobu Sekine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board, electronic device and method for manufacturing the same
- Patent number 8,609,999
- Issue date Dec 17, 2013
- Napra Co., Ltd
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TERMINAL
- Publication number 20240339769
- Publication date Oct 10, 2024
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL PARTICLE FOR JOINT MATERIAL
- Publication number 20240109156
- Publication date Apr 4, 2024
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PARTICLE
- Publication number 20220219265
- Publication date Jul 14, 2022
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE
- Publication number 20210283725
- Publication date Sep 16, 2021
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METAL PARTICLE
- Publication number 20210078111
- Publication date Mar 18, 2021
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BONDING STRUCTURE
- Publication number 20210078112
- Publication date Mar 18, 2021
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM
- Publication number 20180311771
- Publication date Nov 1, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL PARTICLE AND ARTICLES FORMED THEREFROM
- Publication number 20180290243
- Publication date Oct 11, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20180269179
- Publication date Sep 20, 2018
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PREFORM FOR SEMICONDUCTOR ENCAPSULATION
- Publication number 20180218954
- Publication date Aug 2, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-Dimensional Laminated Circuit Board, Electronic Device, Infor...
- Publication number 20180054887
- Publication date Feb 22, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER PREFORM SHEET
- Publication number 20180009194
- Publication date Jan 11, 2018
- NAPRA CO., LTD.
- Shigenobu SEKINE
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE
- Publication number 20170305743
- Publication date Oct 26, 2017
- NAPRA CO., LTD.
- Shigenobu Sekine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE
- Publication number 20170282302
- Publication date Oct 5, 2017
- NAPRA CO., LTD.
- Shigenobu SEKINE
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20170236762
- Publication date Aug 17, 2017
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND ELECTRONIC DEVICE
- Publication number 20170117353
- Publication date Apr 27, 2017
- NAPRA CO., LTD.
- Shigenobu SEKINE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20150357273
- Publication date Dec 10, 2015
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING CONDUCTOR IN MINUTE SPACE
- Publication number 20150228382
- Publication date Aug 13, 2015
- NAPRA CO., LTD.
- Shigenobu Sekine
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
JUNCTION AND ELECTRICAL CONNECTION
- Publication number 20150097300
- Publication date Apr 9, 2015
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FUNCTIONAL MATERIAL
- Publication number 20150054158
- Publication date Feb 26, 2015
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20150041990
- Publication date Feb 12, 2015
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE
- Publication number 20150035114
- Publication date Feb 5, 2015
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPHERICAL PARTICLES HAVING NANOMETER SIZE, CRYSTALLINE STRUCTURE, A...
- Publication number 20140290435
- Publication date Oct 2, 2014
- NAPRA CO., LTD.
- Shigenobu SEKINE
- C01 - INORGANIC CHEMISTRY
Information Patent Application
SUBSTRATE WITH BUILT-IN PASSIVE ELEMENT
- Publication number 20140204548
- Publication date Jul 24, 2014
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INSULATING PASTE, ELECTRONIC DEVICE AND METHOD FOR FORMING INSULATOR
- Publication number 20140147578
- Publication date May 29, 2014
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUG...
- Publication number 20140023777
- Publication date Jan 23, 2014
- NAPRA CO., LTD.
- Shigenobu Sekine
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC DEVICE
- Publication number 20130277850
- Publication date Oct 24, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT
- Publication number 20130250481
- Publication date Sep 26, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE
- Publication number 20130136645
- Publication date May 30, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20130075930
- Publication date Mar 28, 2013
- NAPRA CO., LTD.
- Shigenobu Sekine
- H01 - BASIC ELECTRIC ELEMENTS

NAPRA CO., LTD.

Organization

Patents Grantslast 30 patents

Terminal

Metal particle

Bonding structure

Metal particle

Joint structure

Preform for semiconductor encapsulation

Metal particle and articles formed therefrom

Metal particle and electroconductive paste formed therefrom

Semiconductor device and method for manufacturing the same

Metal particles having intermetallic compound nano-composite struct...

Multi-layer preform sheet

Method for forming functional part in minute space

Three-dimensional laminated circuit board, electronic device, infor...

Semiconductor device

Substrate with built-in passive element

Substrate for electronic device and electronic device

Insulating paste, electronic device and method for forming insulator

Electronic device and manufacturing method therefor

Electronic device, method of manufacturing the same, metal particle...

Semiconductor substrate, eletronic device and method for manufactur...

Integrated circuit device

Method for producing spherical particles, having nanometer size, cr...

Functional material

Semiconductor substrate, electronic device and method for manufactu...

Junction and electrical connection

Wiring substrate and manufacturing method therefor

Light-emitting device comprising vertical conductors and through el...

Spherical particles having nanometer size, crystalline structure, a...

Electronic device, conductive composition, metal filling apparatus,...

Circuit board, electronic device and method for manufacturing the same

Patents Applicationslast 30 patents

TERMINAL

METAL PARTICLE FOR JOINT MATERIAL

METAL PARTICLE

METAL PARTICLE

METAL PARTICLE

BONDING STRUCTURE

METAL PARTICLE AND ELECTROCONDUCTIVE PASTE FORMED THEREFROM

METAL PARTICLE AND ARTICLES FORMED THEREFROM

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME

PREFORM FOR SEMICONDUCTOR ENCAPSULATION

Three-Dimensional Laminated Circuit Board, Electronic Device, Infor...

MULTI-LAYER PREFORM SHEET

METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE

METAL PARTICLE, PASTE, FORMED ARTICLE, AND LAMINATED ARTICLE

SEMICONDUCTOR DEVICE

CIRCUIT BOARD AND ELECTRONIC DEVICE

SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTUR...

METHOD FOR FORMING CONDUCTOR IN MINUTE SPACE

JUNCTION AND ELECTRICAL CONNECTION

FUNCTIONAL MATERIAL

WIRING SUBSTRATE AND MANUFACTURING METHOD THEREFOR

INTEGRATED CIRCUIT DEVICE

SPHERICAL PARTICLES HAVING NANOMETER SIZE, CRYSTALLINE STRUCTURE, A...

SUBSTRATE WITH BUILT-IN PASSIVE ELEMENT

INSULATING PASTE, ELECTRONIC DEVICE AND METHOD FOR FORMING INSULATOR

METHOD FOR PRODUCING WIRING BOARD HAVING THROUGH HOLE OR NON-THROUG...

ELECTRONIC DEVICE

CONDUCTIVE FINE POWDER, CONDUCTIVE PASTE AND ELECTRONIC COMPONENT

METHOD FOR FORMING FUNCTIONAL PART IN MINUTE SPACE

SEMICONDUCTOR SUBSTRATE, ELETRONIC DEVICE AND METHOD FOR MANUFACTUR...

Trademarklast 30 trademarks