OCCAM PORTFOLIO LLC

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Cupertino, CA, US

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Patents Grantslast 30 patents

Information Patent Grant
Electronic assemblies without solder and methods for their manufacture
- Patent number 8,482,110
- Issue date Jul 9, 2013
- Occam Portfolio LLC
- Joseph C Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit assembly without solder
- Patent number 8,404,977
- Issue date Mar 26, 2013
- Occam Portfolio LLC
- Joseph C Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic assemblies without solder having overlapping components
- Patent number 8,300,425
- Issue date Oct 30, 2012
- Occam Portfolio LLC
- Nader Gamini
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flexible circuit assemblies without solder and methods for their ma...
- Patent number 8,193,042
- Issue date Jun 5, 2012
- Occam Portfolio LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolithic molded flexible electronic assemblies without solder and...
- Patent number 8,093,712
- Issue date Jan 10, 2012
- Occam Portfolio LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Light emitting diode package assembly
- Patent number 8,067,777
- Issue date Nov 29, 2011
- Occam Portfolio LLC
- Joseph C. Fjelstad
- F21 - LIGHTING
Information Patent Grant
Electronic assemblies without solder and methods for their manufacture
- Patent number 7,981,703
- Issue date Jul 19, 2011
- Occam Portfolio LLC
- Joseph Charles Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Monolithic molded flexible electronic assemblies without solder and...
- Patent number 7,943,434
- Issue date May 17, 2011
- Occam Portfolio LLC
- Joseph Charles Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making a circuit assembly
- Patent number 7,926,173
- Issue date Apr 19, 2011
- Occam Portfolio LLC
- Joseph C. Fjelstad
- B32 - LAYERED PRODUCTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE CIRCUIT ASSEMBLY WITHOUT SOLDER
- Publication number 20120211265
- Publication date Aug 23, 2012
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Light-Emitting Diode Package Assembly
- Publication number 20120077293
- Publication date Mar 29, 2012
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- F21 - LIGHTING
Information Patent Application
Electronic Assemblies Without Solder and Methods for their Manufacture
- Publication number 20120006589
- Publication date Jan 12, 2012
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Occam Process for Components Having Variations in Part Dimensions
- Publication number 20110315302
- Publication date Dec 29, 2011
- OCCAM PORTFOLIO LLC
- Joseph Charles Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
Monolithic Molded Flexible Electronic Assemblies Without Solder and...
- Publication number 20110199740
- Publication date Aug 18, 2011
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assemblies without Solder and Methods for their Manufacture
- Publication number 20110182042
- Publication date Jul 28, 2011
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic Assemblies without Solder and Methods for their Manufacture
- Publication number 20110127080
- Publication date Jun 2, 2011
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Flexible Circuit Assemblies without Solder and Methods for their Ma...
- Publication number 20100096166
- Publication date Apr 22, 2010
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE PACKAGE ASSEMBLY
- Publication number 20090278139
- Publication date Nov 12, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- F21 - LIGHTING
Information Patent Application
Electronic Assemblies without Solder and Method for their Design, P...
- Publication number 20090277677
- Publication date Nov 12, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Monolithic Molded Flexible Electronic Assemblies Without Solder and...
- Publication number 20090237901
- Publication date Sep 24, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assemblies Without Solder and Methods for their Manufacture
- Publication number 20090056997
- Publication date Mar 5, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
System for the Manufacture of Electronic Assemblies Without Solder
- Publication number 20090041977
- Publication date Feb 12, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Assembly of Encapsulated Electronic Components to a Printed Circuit...
- Publication number 20090035454
- Publication date Feb 5, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assemblies Without Solder Having Overlapping Components
- Publication number 20090034219
- Publication date Feb 5, 2009
- OCCAM PORTFOLIO LLC
- Nader Gamini
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE
- Publication number 20090017264
- Publication date Jan 15, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assemblies Without Solder and Methods for their Manufacture
- Publication number 20090008140
- Publication date Jan 8, 2009
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- B32 - LAYERED PRODUCTS
Information Patent Application
Electronic Assemblies Without Solder and Methods for their Manufacture
- Publication number 20080297985
- Publication date Dec 4, 2008
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Assemblies without Solder and Methods for their Manufacture
- Publication number 20080277151
- Publication date Nov 13, 2008
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER
- Publication number 20080277675
- Publication date Nov 13, 2008
- OCCAM PORTFOLIO LLC
- Joseph C. Fjelstad
- F21 - LIGHTING

OCCAM PORTFOLIO LLC

Organization

Patents Grantslast 30 patents

Electronic assemblies without solder and methods for their manufacture

Flexible circuit assembly without solder

Electronic assemblies without solder having overlapping components

Flexible circuit assemblies without solder and methods for their ma...

Monolithic molded flexible electronic assemblies without solder and...

Light emitting diode package assembly

Electronic assemblies without solder and methods for their manufacture

Monolithic molded flexible electronic assemblies without solder and...

Method of making a circuit assembly

Patents Applicationslast 30 patents

FLEXIBLE CIRCUIT ASSEMBLY WITHOUT SOLDER

Light-Emitting Diode Package Assembly

Electronic Assemblies Without Solder and Methods for their Manufacture

Occam Process for Components Having Variations in Part Dimensions

Monolithic Molded Flexible Electronic Assemblies Without Solder and...

Electronic Assemblies without Solder and Methods for their Manufacture

Electronic Assemblies without Solder and Methods for their Manufacture

Flexible Circuit Assemblies without Solder and Methods for their Ma...

LIGHT-EMITTING DIODE PACKAGE ASSEMBLY

Electronic Assemblies without Solder and Method for their Design, P...

Monolithic Molded Flexible Electronic Assemblies Without Solder and...

Electronic Assemblies Without Solder and Methods for their Manufacture

System for the Manufacture of Electronic Assemblies Without Solder

Assembly of Encapsulated Electronic Components to a Printed Circuit...

Electronic Assemblies Without Solder Having Overlapping Components

ELECTRONIC ASSEMBLIES WITHOUT SOLDER AND METHODS FOR THEIR MANUFACTURE

Electronic Assemblies Without Solder and Methods for their Manufacture

Electronic Assemblies Without Solder and Methods for their Manufacture

Electronic Assemblies without Solder and Methods for their Manufacture

LIGHT-EMITTING DIODE ASSEMBLY WITHOUT SOLDER

Trademarklast 30 trademarks