Phoenix Precision Technology Corporation

Organization

Hsin-Chu, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Package structure in which coreless substrate has direct electrical...
- Patent number 8,058,723
- Issue date Nov 15, 2011
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrier structure embedded with semiconductor chip
- Patent number 7,768,119
- Issue date Aug 3, 2010
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure with semiconductor chips embeded therein
- Patent number 7,763,969
- Issue date Jul 27, 2010
- Phoenix Precision Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate structure with electronic components embedded t...
- Patent number 7,754,538
- Issue date Jul 13, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing coreless packaging substrate
- Patent number 7,754,598
- Issue date Jul 13, 2010
- Phoenix Precision Technology Corporation
- Wei-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrically connecting terminal structure of circuit board and man...
- Patent number 7,719,853
- Issue date May 18, 2010
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure with embedded semiconductor chip and method...
- Patent number 7,719,104
- Issue date May 18, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and method for fabricating the same
- Patent number 7,718,470
- Issue date May 18, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package substrate
- Patent number 7,705,456
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive bump structure of circuit board and method for forming t...
- Patent number 7,705,471
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure having semiconductor chip embedded therein and me...
- Patent number 7,705,446
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack structure of circuit boards embedded with semiconductor chips
- Patent number 7,706,148
- Issue date Apr 27, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board structure having capacitor array and embedded electro...
- Patent number 7,674,986
- Issue date Mar 9, 2010
- Phoenix Precision Technology Corporation
- Chia-Wei Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabrication of a conductive bump structure of a circuit...
- Patent number 7,674,362
- Issue date Mar 9, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive structures for electrically conductive pads of circuit b...
- Patent number 7,659,193
- Issue date Feb 9, 2010
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack structure of circuit board with semiconductor component embed...
- Patent number 7,656,040
- Issue date Feb 2, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate having heat-dissipating structure
- Patent number 7,656,015
- Issue date Feb 2, 2010
- Phoenix Precision Technology Corporation
- Lin-Yin Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit board structure with embedded electronic components
- Patent number 7,639,473
- Issue date Dec 29, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a metal protection layer on electrically con...
- Patent number 7,627,946
- Issue date Dec 8, 2009
- Phoenix Precision Technology Corporation
- Pao Hung Chou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Surface roughening method for embedded semiconductor chip structure
- Patent number 7,629,204
- Issue date Dec 8, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coreless package substrate with conductive structures
- Patent number 7,626,270
- Issue date Dec 1, 2009
- Phoenix Precision Technology Corporation
- Bo-Wei Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Carrier structure for semiconductor chip and method for manufacturi...
- Patent number 7,619,317
- Issue date Nov 17, 2009
- Phoenix Precision Technology Corporation
- Chung-Cheng Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating circuit board structure
- Patent number 7,614,146
- Issue date Nov 10, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical connector structure of circuit board and method for fabr...
- Patent number 7,608,929
- Issue date Oct 27, 2009
- Phoenix Precision Technology Corporation
- Wen-Hung Hu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plate structure having chip embedded therein and the manufacturing...
- Patent number 7,598,610
- Issue date Oct 6, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer circuit board with fine pitches and fabricating method...
- Patent number 7,592,706
- Issue date Sep 22, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure with circuits directly connected to semiconductor...
- Patent number 7,582,961
- Issue date Sep 1, 2009
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 7,579,690
- Issue date Aug 25, 2009
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electrical conductive structure of circuit b...
- Patent number 7,553,750
- Issue date Jun 30, 2009
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip embedded package structure and fabrication method thereof
- Patent number 7,554,131
- Issue date Jun 30, 2009
- Phoenix Precision Technology Corporation
- Zhao-Chong Zeng
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN
- Publication number 20120281375
- Publication date Nov 8, 2012
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING SEMICONDUCTOR COMPONENT EMBEDDED THEREIN A...
- Publication number 20110057305
- Publication date Mar 10, 2011
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20110056738
- Publication date Mar 10, 2011
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20110042800
- Publication date Feb 24, 2011
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING PRINTED CIRCUIT BOARD HAVING CAPACITANCE COM...
- Publication number 20100115767
- Publication date May 13, 2010
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging substrate
- Publication number 20100096750
- Publication date Apr 22, 2010
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electrical connection element of packaging substrate
- Publication number 20100089612
- Publication date Apr 15, 2010
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR CO...
- Publication number 20100029047
- Publication date Feb 4, 2010
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN
- Publication number 20100002406
- Publication date Jan 7, 2010
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE STRUCTURE
- Publication number 20100002405
- Publication date Jan 7, 2010
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED PHOTOSENSITIVE SEMICONDUCTOR CHIP...
- Publication number 20090309179
- Publication date Dec 17, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METH...
- Publication number 20090308652
- Publication date Dec 17, 2009
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP AND FABRICATIO...
- Publication number 20090309202
- Publication date Dec 17, 2009
- Phoenix Precision Technology Corporation
- Shin-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090294962
- Publication date Dec 3, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Packaging substrate structure
- Publication number 20090294993
- Publication date Dec 3, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package structure in which coreless substrate has direct electrical...
- Publication number 20090236750
- Publication date Sep 24, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Kan-Jung Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE EMBEDDED WITH SEMICONDUCTOR CHIPS
- Publication number 20090200658
- Publication date Aug 13, 2009
- Phoenix Precision Technology Corporation
- Shih Ping HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT
- Publication number 20090168380
- Publication date Jul 2, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT
- Publication number 20090166841
- Publication date Jul 2, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE HAVING ELECTRICALLY CONNECTING STRUCTURE
- Publication number 20090146317
- Publication date Jun 11, 2009
- Phoenix Precision Technology Corporation
- Chao Wen Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE
- Publication number 20090134515
- Publication date May 28, 2009
- Phoenix Precision Technology Corporation
- Wen-Hung HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit board having power source
- Publication number 20090129040
- Publication date May 21, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked package module and method for fabricating the same
- Publication number 20090115045
- Publication date May 7, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Package on package structure
- Publication number 20090102039
- Publication date Apr 23, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaging substrate having capacitor embedded therein
- Publication number 20090102045
- Publication date Apr 23, 2009
- PHOENIX PRECISION TECHNOLOGY CORPORATION
- Shih-Ping Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER BALL DISPOSING SURFACE STRUCTURE OF PACKAGE SUBSTRATE
- Publication number 20090102050
- Publication date Apr 23, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME
- Publication number 20090096099
- Publication date Apr 16, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND FABRICATION METHOD THEREOF
- Publication number 20090090548
- Publication date Apr 9, 2009
- Phoenix Precision Technology Corporation
- Chao-Wen Shih
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stack structure of circuit boards embedded with semiconductor chips
- Publication number 20090091903
- Publication date Apr 9, 2009
- Phoenix Precision Technology Corporation
- Shih-Ping Hsu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20090090541
- Publication date Apr 9, 2009
- Phoenix Precision Technology Corporation
- Kan-Jung Chia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Phoenix Precision Technology Corporation

Organization

Patents Grantslast 30 patents

Package structure in which coreless substrate has direct electrical...

Carrier structure embedded with semiconductor chip

Structure with semiconductor chips embeded therein

Packaging substrate structure with electronic components embedded t...

Method for manufacturing coreless packaging substrate

Electrically connecting terminal structure of circuit board and man...

Circuit board structure with embedded semiconductor chip and method...

Package substrate and method for fabricating the same

Semiconductor package substrate

Conductive bump structure of circuit board and method for forming t...

Package structure having semiconductor chip embedded therein and me...

Stack structure of circuit boards embedded with semiconductor chips

Circuit board structure having capacitor array and embedded electro...

Method for fabrication of a conductive bump structure of a circuit...

Conductive structures for electrically conductive pads of circuit b...

Stack structure of circuit board with semiconductor component embed...

Packaging substrate having heat-dissipating structure

Circuit board structure with embedded electronic components

Method for fabricating a metal protection layer on electrically con...

Surface roughening method for embedded semiconductor chip structure

Coreless package substrate with conductive structures

Carrier structure for semiconductor chip and method for manufacturi...

Method for fabricating circuit board structure

Electrical connector structure of circuit board and method for fabr...

Plate structure having chip embedded therein and the manufacturing...

Multi-layer circuit board with fine pitches and fabricating method...

Package structure with circuits directly connected to semiconductor...

Semiconductor package structure

Method for fabricating electrical conductive structure of circuit b...

Chip embedded package structure and fabrication method thereof

Patents Applicationslast 30 patents

CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN

PACKAGE SUBSTRATE HAVING SEMICONDUCTOR COMPONENT EMBEDDED THEREIN A...

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE

METHOD FOR FABRICATING PRINTED CIRCUIT BOARD HAVING CAPACITANCE COM...

Packaging substrate

Electrical connection element of packaging substrate

METHOD OF FABRICATING PRINTED CIRCUIT BOARD HAVING SEMICONDUCTOR CO...

CIRCUIT BOARD HAVING SEMICONDUCTOR CHIP EMBEDDED THEREIN

PACKAGE SUBSTRATE STRUCTURE

PACKAGE SUBSTRATE HAVING EMBEDDED PHOTOSENSITIVE SEMICONDUCTOR CHIP...

PACKAGE SUBSTRATE HAVING DOUBLE-SIDED CIRCUITS AND FABRICATION METH...

PACKAGE SUBSTRATE HAVING EMBEDDED SEMICONDUCTOR CHIP AND FABRICATIO...

PACKAGING SUBSTRATE AND METHOD FOR FABRICATING THE SAME

Packaging substrate structure

Package structure in which coreless substrate has direct electrical...

CIRCUIT BOARD STRUCTURE EMBEDDED WITH SEMICONDUCTOR CHIPS

PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT

PACKAGE SUBSTRATE EMBEDDED WITH SEMICONDUCTOR COMPONENT

PACKAGE SUBSTRATE HAVING ELECTRICALLY CONNECTING STRUCTURE

SEMICONDUCTOR PACKAGE SUBSTRATE

Circuit board having power source

Stacked package module and method for fabricating the same

Package on package structure

Packaging substrate having capacitor embedded therein

SOLDER BALL DISPOSING SURFACE STRUCTURE OF PACKAGE SUBSTRATE

PACKAGE SUBSTRATE AND METHOD FOR FABRICATING THE SAME

CIRCUIT BOARD AND FABRICATION METHOD THEREOF

Stack structure of circuit boards embedded with semiconductor chips

STACKED SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF