Semigear Inc

Organization

Wakefield, MA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Apparatus and method for cooling substrate
- Patent number 11,456,192
- Issue date Sep 27, 2022
- Semigear, Inc.
- Jonghoon Kim
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Substrate pressing module, substrate pressing method, substrate tre...
- Patent number 11,315,807
- Issue date Apr 26, 2022
- Semigear, Inc.
- Suncheol Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,937,757
- Issue date Mar 2, 2021
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate support unit
- Patent number 10,861,735
- Issue date Dec 8, 2020
- Semigear, Inc.
- Yonghoe Heo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Alignment apparatus
- Patent number 10,790,179
- Issue date Sep 29, 2020
- Semigear, Inc.
- Seockhwi Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 10,283,481
- Issue date May 7, 2019
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,824,998
- Issue date Nov 21, 2017
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,741,683
- Issue date Aug 22, 2017
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow treating unit and substrate treating apparatus
- Patent number 9,629,258
- Issue date Apr 18, 2017
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reflow treating unit and substrate treating apparatus
- Patent number 9,572,266
- Issue date Feb 14, 2017
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device packaging facility and method, and device processing apparat...
- Patent number 9,472,531
- Issue date Oct 18, 2016
- Semigear, Inc.
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow treating unit and substrate treating apparatus
- Patent number 9,226,407
- Issue date Dec 29, 2015
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for solder bump formation on wafers
- Patent number 8,524,593
- Issue date Sep 3, 2013
- Semigear Inc
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux-free chip to substrate joint serial linear thermal processor a...
- Patent number 8,274,161
- Issue date Sep 25, 2012
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux-free chip to wafer joint serial thermal processor arrangement
- Patent number 8,252,678
- Issue date Aug 28, 2012
- Semigear, Inc.
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for solder bump formation on wafers
- Patent number 7,982,320
- Issue date Jul 19, 2011
- Semigear Inc.
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Arrangement for solder bump formation on wafers
- Patent number 7,632,750
- Issue date Dec 15, 2009
- Semigear Inc
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Isolation chamber arrangement for serial processing of semiconducto...
- Patent number 7,008,879
- Issue date Mar 7, 2006
- Semigear, Inc.
- Chunghsin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Isolation chamber arrangement for serial processing of semiconducto...
- Patent number 6,827,789
- Issue date Dec 7, 2004
- Semigear, Inc.
- Chunghsin Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
APPARATUS AND METHOD FOR COOLING SUBSTRATE
- Publication number 20210035828
- Publication date Feb 4, 2021
- Semigear, Inc.
- Jonghoon KIM
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ALIGNMENT APPARATUS
- Publication number 20190378738
- Publication date Dec 12, 2019
- Semigear, Inc.
- Seockhwi LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PRESSING MODULE, SUBSTRATE PRESSING METHOD, SUBSTRATE TRE...
- Publication number 20190348308
- Publication date Nov 14, 2019
- Semigear, Inc.
- Suncheol LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE SUPPORT UNIT
- Publication number 20190333800
- Publication date Oct 31, 2019
- Semigear, Inc.
- Yonghoe HEO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20190229086
- Publication date Jul 25, 2019
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20160336293
- Publication date Nov 17, 2016
- Semigear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...
- Publication number 20160233191
- Publication date Aug 11, 2016
- Semigear, Inc.
- Jian ZHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reflow Treating Unit and Substrate Treating Apparatus
- Publication number 20160143155
- Publication date May 19, 2016
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow treating unit and substrate treating apparatus
- Publication number 20160143156
- Publication date May 19, 2016
- Semigear, Inc.
- Jian ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow treating unit & substrate treating apparatus
- Publication number 20150034700
- Publication date Feb 5, 2015
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reflow treating unit & substrate treating apparatus
- Publication number 20150034699
- Publication date Feb 5, 2015
- Semigear Inc
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus & method for treating substrate
- Publication number 20150034702
- Publication date Feb 5, 2015
- Semigear Inc
- Jian Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flux-free chip to wafer joint serial thermal processor arrangement
- Publication number 20110198388
- Publication date Aug 18, 2011
- Semigear Inc
- Jian Zhang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Arrangement for solder bump formation on wafers
- Publication number 20080009122
- Publication date Jan 10, 2008
- Semigear Inc
- Chunghsin Lee
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Semigear Inc

Organization

Patents Grantslast 30 patents

Apparatus and method for cooling substrate

Substrate pressing module, substrate pressing method, substrate tre...

Device packaging facility and method, and device processing apparat...

Substrate support unit

Alignment apparatus

Device packaging facility and method, and device processing apparat...

Device packaging facility and method, and device processing apparat...

Device packaging facility and method, and device processing apparat...

Reflow treating unit and substrate treating apparatus

Reflow treating unit and substrate treating apparatus

Device packaging facility and method, and device processing apparat...

Reflow treating unit and substrate treating apparatus

Arrangement for solder bump formation on wafers

Flux-free chip to substrate joint serial linear thermal processor a...

Flux-free chip to wafer joint serial thermal processor arrangement

Arrangement for solder bump formation on wafers

Arrangement for solder bump formation on wafers

Isolation chamber arrangement for serial processing of semiconducto...

Isolation chamber arrangement for serial processing of semiconducto...

Patents Applicationslast 30 patents

APPARATUS AND METHOD FOR COOLING SUBSTRATE

ALIGNMENT APPARATUS

SUBSTRATE PRESSING MODULE, SUBSTRATE PRESSING METHOD, SUBSTRATE TRE...

SUBSTRATE SUPPORT UNIT

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

DEVICE PACKAGING FACILITY AND METHOD, AND DEVICE PROCESSING APPARAT...

Reflow Treating Unit and Substrate Treating Apparatus

Reflow treating unit and substrate treating apparatus

Reflow treating unit & substrate treating apparatus

Reflow treating unit & substrate treating apparatus

Apparatus & method for treating substrate

Flux-free chip to wafer joint serial thermal processor arrangement

Arrangement for solder bump formation on wafers

Trademarklast 30 trademarks