Sensys Instruments Corporation

Organization

Santa Clara, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Integrated surface metrology
- Patent number 6,829,054
- Issue date Dec 7, 2004
- Sensys Instruments Corporation
- Fred E. Stanke
- B24 - GRINDING POLISHING
Information Patent Grant
Integrated surface metrology
- Patent number 6,690,473
- Issue date Feb 10, 2004
- Sensys Instruments Corporation
- Fred E. Stanke
- B24 - GRINDING POLISHING
Information Patent Grant
Notch and flat sensor for wafer alignment
- Patent number 6,677,602
- Issue date Jan 13, 2004
- Sensys Instruments Corporation
- Adam E. Norton
- G01 - MEASURING TESTING
Information Patent Grant
Small-spot spectrometry instrument with reduced polarization
- Patent number 6,667,805
- Issue date Dec 23, 2003
- Sensys Instruments Corporation
- Adam E. Norton
- G01 - MEASURING TESTING
Information Patent Grant
Bathless wafer measurement apparatus and method
- Patent number 6,572,456
- Issue date Jun 3, 2003
- Sensys Instruments Corporation
- Michael Weber-Grabau
- B24 - GRINDING POLISHING
Information Patent Grant
Method of detecting residue on a polished wafer
- Patent number 6,510,395
- Issue date Jan 21, 2003
- Sensys Instruments Corporation
- Fred E. Stanke
- G01 - MEASURING TESTING
Information Patent Grant
Method of measuring meso-scale structures on wafers
- Patent number 6,340,602
- Issue date Jan 22, 2002
- Sensys Instruments
- Kenneth C. Johnson
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for characterizing semiconductor wafers during...
- Patent number 6,182,510
- Issue date Feb 6, 2001
- Sensys Instruments Corporation
- Fred E. Stanke
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for characterizing semiconductor wafers during...
- Patent number 6,112,595
- Issue date Sep 5, 2000
- Sensys Instruments Corporation
- Fred E. Stanke
- G01 - MEASURING TESTING
Information Patent Grant
In-situ measurement of deposition on reactor chamber members
- Patent number 6,019,000
- Issue date Feb 1, 2000
- Sensys Instruments Corporation
- Fred E Stanke
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus and method for characterizing semiconductor wafers during...
- Patent number 5,996,415
- Issue date Dec 7, 1999
- Sensys Instruments Corporation
- Fred E. Stanke
- G01 - MEASURING TESTING

NSF Awardslast 12 months

processing...

Count: 2

NSF Awards

Information NSF Award
SBIR Phase II: Real-Time Sensor for Control of Deposits on Etch and...
- Award Id 9901714
- Effective date Jul 15, 1999
Information NSF Award
SBIR Phase I: Real-Time Sensing and Control for Physical Vapor Depo...
- Award Id 9761085
- Effective date Jan 1, 1998

Sensys Instruments Corporation

Organization

Patents Grantslast 30 patents

Integrated surface metrology

Integrated surface metrology

Notch and flat sensor for wafer alignment

Small-spot spectrometry instrument with reduced polarization

Bathless wafer measurement apparatus and method

Method of detecting residue on a polished wafer

Method of measuring meso-scale structures on wafers

Apparatus and method for characterizing semiconductor wafers during...

Apparatus and method for characterizing semiconductor wafers during...

In-situ measurement of deposition on reactor chamber members

Apparatus and method for characterizing semiconductor wafers during...

NSF Awardslast 12 months

NSF Awards

SBIR Phase II: Real-Time Sensor for Control of Deposits on Etch and...

SBIR Phase I: Real-Time Sensing and Control for Physical Vapor Depo...