Shanghai KaiHong Technology Co., Ltd.

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Shanghai, CN

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Patents Grantslast 30 patents

Information Patent Grant
Thin quad flat package with no leads (QFN) fabrication methods
- Patent number 8,008,128
- Issue date Aug 30, 2011
- Shanghai Kaihong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor power device
- Patent number 7,834,433
- Issue date Nov 16, 2010
- Shanghai Kaihong Technology Co., Ltd.
- Tan Xiaochun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package fabrication methods
- Patent number 7,745,261
- Issue date Jun 29, 2010
- Shanghai Kaihong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin quad flat package with no leads (QFN) fabrication methods
- Patent number 7,713,784
- Issue date May 11, 2010
- Shanghai Kaihong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package (CSP) assembly apparatus and method
- Patent number 7,682,874
- Issue date Mar 23, 2010
- Shanghai KaiHong Technology Co., Ltd
- Tan Xiaochun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonded chip scale package fabrication methods
- Patent number 7,517,726
- Issue date Apr 14, 2009
- Shanghai KaiHong Technology Co., Ltd
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat no-lead (QFN) chip package assembly apparatus and method
- Patent number 7,402,459
- Issue date Jul 22, 2008
- Shanghai Kaihong Technology Co., Ltd.
- Tan Xiaochun
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Wire Bonder and Gas Pipe Connector Therefor
- Publication number 20250060067
- Publication date Feb 20, 2025
- DIODES INCORPORATED
- Huaigang Zhang
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Application
Semiconductor Molding System and Foreign Object Detection Method
- Publication number 20250029232
- Publication date Jan 23, 2025
- DIODES INCORPORATED
- Desen Wang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS
- Publication number 20110281398
- Publication date Nov 17, 2011
- SHANGHAI KAIHONG TECHNOLOGY CO., LTD
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Quad Flat Package with No Leads (QFN) Fabrication Methods
- Publication number 20100178733
- Publication date Jul 15, 2010
- Shanghai KaiHong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS
- Publication number 20090233401
- Publication date Sep 17, 2009
- Shanghai KaiHong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Scale Package Fabrication Methods
- Publication number 20090215227
- Publication date Aug 27, 2009
- Shanghai KaiHong Technology Co., Ltd.
- Xiaochun Tan
- H01 - BASIC ELECTRIC ELEMENTS

Shanghai KaiHong Technology Co., Ltd.

Organization

Patents Grantslast 30 patents

Thin quad flat package with no leads (QFN) fabrication methods

Semiconductor power device

Chip scale package fabrication methods

Thin quad flat package with no leads (QFN) fabrication methods

Chip scale package (CSP) assembly apparatus and method

Wire bonded chip scale package fabrication methods

Quad flat no-lead (QFN) chip package assembly apparatus and method

Patents Applicationslast 30 patents

Wire Bonder and Gas Pipe Connector Therefor

Semiconductor Molding System and Foreign Object Detection Method

THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS

Thin Quad Flat Package with No Leads (QFN) Fabrication Methods

THIN QUAD FLAT PACKAGE WITH NO LEADS (QFN) FABRICATION METHODS

Chip Scale Package Fabrication Methods

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