SHINKAWA LTD.

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Tokyo, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wire tension adjustment method and wire tension adjuster
- Patent number 12,154,801
- Issue date Nov 26, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flux transfer apparatus
- Patent number 12,145,218
- Issue date Nov 19, 2024
- Shinkawa Ltd.
- Shigeyuki Sekiguchi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and bonding method
- Patent number 12,136,604
- Issue date Nov 5, 2024
- Shinkawa Ltd.
- Hideharu Nihei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing apparatus of semiconductor device
- Patent number 12,131,921
- Issue date Oct 29, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Arrangement apparatus and arrangement method
- Patent number 12,112,962
- Issue date Oct 8, 2024
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding device, wire cutting method and non-transitory compute...
- Patent number 12,107,067
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus and method for manufacturing semiconductor d...
- Patent number 12,107,070
- Issue date Oct 1, 2024
- Shinkawa Ltd.
- Hiroaki Yoshino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus, method for measuring opening amount of clam...
- Patent number 12,087,725
- Issue date Sep 10, 2024
- Shinkawa Ltd.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding apparatus and alignment method
- Patent number 12,080,679
- Issue date Sep 3, 2024
- Shinkawa Ltd.
- Toru Maeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 12,057,427
- Issue date Aug 6, 2024
- Shinkawa Ltd.
- Osamu Kakutani
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasonic horn and manufacturing apparatus of semiconductor device
- Patent number 12,046,574
- Issue date Jul 23, 2024
- Shinkawa Ltd.
- Yuhei Ito
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus and parallelism detection method in mounting app...
- Patent number 12,018,936
- Issue date Jun 25, 2024
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,961,819
- Issue date Apr 16, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding apparatus
- Patent number 11,908,827
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Naoki Sekine
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 11,910,534
- Issue date Feb 20, 2024
- Shinkawa Ltd.
- Tomonori Nakamura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus and film supply apparatus
- Patent number 11,848,219
- Issue date Dec 19, 2023
- Shinkawa Ltd.
- Yuichiro Noguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bonding apparatus
- Patent number 11,824,038
- Issue date Nov 21, 2023
- Shinkawa Ltd.
- Nobuyuki Aoyagi
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 11,769,749
- Issue date Sep 26, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus
- Patent number 11,749,541
- Issue date Sep 5, 2023
- Shinkawa Ltd.
- Shigeyuki Sekiguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capillary guide device and wire bonding apparatus
- Patent number 11,717,912
- Issue date Aug 8, 2023
- Shinkawa Ltd.
- Yohei Uchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultrasound horn
- Patent number 11,691,214
- Issue date Jul 4, 2023
- Shinkawa Ltd.
- Hiroshi Munakata
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mounting apparatus
- Patent number 11,664,344
- Issue date May 30, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus
- Patent number 11,616,041
- Issue date Mar 28, 2023
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing structure, and structure
- Patent number 11,569,192
- Issue date Jan 31, 2023
- Shinkawa Ltd.
- Yuji Eguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and temperature measurement method
- Patent number 11,562,916
- Issue date Jan 24, 2023
- Shinkawa Ltd.
- Shoji Wada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mounting apparatus and mounting system
- Patent number 11,545,462
- Issue date Jan 3, 2023
- Shinkawa Ltd.
- Tomonori Nakamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor device
- Patent number 11,521,890
- Issue date Dec 6, 2022
- Shinkawa Ltd.
- Shoji Wada
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
PTFE sheet and method for mounting die
- Patent number 11,512,411
- Issue date Nov 29, 2022
- Shinkawa Ltd.
- Osamu Watanabe
- D01 - NATURAL OR ARTIFICIAL THREADS OR FIBRES SPINNING
Information Patent Grant
Wiring structure with movement mechanism
- Patent number 11,509,126
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Kohei Seyama
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bonding apparatus including a heater and a cooling flow path used f...
- Patent number 11,508,688
- Issue date Nov 22, 2022
- Shinkawa Ltd.
- Kohei Seyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INSPECTION DEVICE, MOUNTING APPARATUS, INSPECTION METHOD, AND NON-T...
- Publication number 20240404890
- Publication date Dec 5, 2024
- SHINKAWA LTD.
- Makoto TAKAHASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL
- Publication number 20240379613
- Publication date Nov 14, 2024
- SHINKAWA LTD.
- Hiroshi MUNAKATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING DEVICE, AND METHOD FOR DETECTING DEGREE OF PARALLELISM OF...
- Publication number 20240318958
- Publication date Sep 26, 2024
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- G01 - MEASURING TESTING
Information Patent Application
BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...
- Publication number 20240304592
- Publication date Sep 12, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE TENSION ADJUSTMENT METHOD AND WIRE TENSION ADJUSTER
- Publication number 20240297055
- Publication date Sep 5, 2024
- SHINKAWA LTD.
- Toshihiko TOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS
- Publication number 20240276695
- Publication date Aug 15, 2024
- SHINKAWA LTD.
- Shinichi YOSHIDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING SYSTEM, INSPECTION DEVICE, WIRE BONDING METHOD, AND RE...
- Publication number 20240242984
- Publication date Jul 18, 2024
- SHINKAWA LTD.
- Hiroyuki KASAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...
- Publication number 20240203933
- Publication date Jun 20, 2024
- SHINKAWA LTD.
- Hikaru MIURA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRIC CIRCUIT ABNORMALITY DETECTION DEVICE
- Publication number 20240175941
- Publication date May 30, 2024
- SHINKAWA LTD.
- Hiroshi KIKUCHI
- G01 - MEASURING TESTING
Information Patent Application
MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM
- Publication number 20240162073
- Publication date May 16, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...
- Publication number 20240127423
- Publication date Apr 18, 2024
- SHINKAWA LTD.
- Yoshiyuki OGATA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
BONDING APPARATUS AND BONDING METHOD
- Publication number 20240120219
- Publication date Apr 11, 2024
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20240105672
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Shigeru HAYATA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND ALIGNMENT METHOD
- Publication number 20240105673
- Publication date Mar 28, 2024
- SHINKAWA LTD.
- Toru MAEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
FLUX TRANSFER APPARATUS
- Publication number 20240082941
- Publication date Mar 14, 2024
- SHINKAWA LTD.
- Shigeyuki SEKIGUCHI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...
- Publication number 20240088089
- Publication date Mar 14, 2024
- SHINKAWA LTD.
- Tsutomu KIYONO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONVEYANCE DEVICE, CONVEYANCE METHOD, AND NON-TRANSITORY COMPUTER R...
- Publication number 20240076142
- Publication date Mar 7, 2024
- SHINKAWA LTD.
- Katsutoshi Nomura
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
SUCTION DEVICE, SUCTION UNIT, SUCTION METHOD, AND COMPUTER-READABLE...
- Publication number 20240063049
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Yuji EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOUNTING HEAD
- Publication number 20240063170
- Publication date Feb 22, 2024
- SHINKAWA LTD.
- Shinsuke FUKUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...
- Publication number 20240055388
- Publication date Feb 15, 2024
- SHINKAWA LTD.
- Kiyotaka TANAKA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE HOLDER AND BONDING SYSTEM
- Publication number 20240014167
- Publication date Jan 11, 2024
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS
- Publication number 20240006193
- Publication date Jan 4, 2024
- SHINKAWA LTD.
- Hiroaki YOSHINO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEASUREMENT DEVICE, MEASUREMENT METHOD, AND BONDING SYSTEM
- Publication number 20230392921
- Publication date Dec 7, 2023
- SHINKAWA LTD.
- Shinichi YOSHIDA
- G01 - MEASURING TESTING
Information Patent Application
MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230352324
- Publication date Nov 2, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE
- Publication number 20230343742
- Publication date Oct 26, 2023
- SHINKAWA LTD.
- Yuhei ITO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...
- Publication number 20230282613
- Publication date Sep 7, 2023
- SHINKAWA LTD.
- Toshihiko Toyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POSITION CONTROL APPARATUS, POSITION CONTROL METHOD, POSITION CONTR...
- Publication number 20230273599
- Publication date Aug 31, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- G05 - CONTROLLING REGULATING
Information Patent Application
MOUNTING DEVICE AND MOUNTING METHOD
- Publication number 20230274951
- Publication date Aug 31, 2023
- SHINKAWA LTD.
- Yuichiro NOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD
- Publication number 20230268313
- Publication date Aug 24, 2023
- SHINKAWA LTD.
- Kohei SEYAMA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...
- Publication number 20230230853
- Publication date Jul 20, 2023
- SHINKAWA LTD.
- Daisuke TANI
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
87420505 - INTELLIGENTBONDER
- Serial number 87420505
- Registration number 5478689
- Filing date Apr 21, 2017
- Shinkawa Ltd.
- 7 - Machines and machine tools
Information Trademark
79038532 - SHINKAWA
- Serial number 79038532
- Registration number 3458277
- Filing date Mar 27, 2007
- SHINKAWA LTD.
- 7 - Machines and machine tools
Information Trademark
79038533
- Serial number 79038533
- Registration number 3550351
- Filing date Mar 27, 2007
- SHINKAWA LTD.
- 7 - Machines and machine tools

SHINKAWA LTD.

Organization

Patents Grantslast 30 patents

Wire tension adjustment method and wire tension adjuster

Flux transfer apparatus

Bonding apparatus and bonding method

Manufacturing apparatus of semiconductor device

Arrangement apparatus and arrangement method

Wire bonding device, wire cutting method and non-transitory compute...

Wire bonding apparatus and method for manufacturing semiconductor d...

Wire bonding apparatus, method for measuring opening amount of clam...

Bonding apparatus and alignment method

Wire bonding apparatus

Ultrasonic horn and manufacturing apparatus of semiconductor device

Mounting apparatus and parallelism detection method in mounting app...

Wire bonding apparatus

Wire bonding apparatus

Mounting apparatus

Mounting apparatus and film supply apparatus

Wire bonding apparatus

Mounting apparatus

Bonding apparatus

Capillary guide device and wire bonding apparatus

Ultrasound horn

Mounting apparatus

Mounting apparatus

Method for producing structure, and structure

Mounting apparatus and temperature measurement method

Mounting apparatus and mounting system

Apparatus for manufacturing semiconductor device

PTFE sheet and method for mounting die

Wiring structure with movement mechanism

Bonding apparatus including a heater and a cooling flow path used f...

Patents Applicationslast 30 patents

INSPECTION DEVICE, MOUNTING APPARATUS, INSPECTION METHOD, AND NON-T...

PIN WIRE FORMING METHOD, WIRE BONDING APPARATUS, AND BONDING TOOL

MOUNTING DEVICE, AND METHOD FOR DETECTING DEGREE OF PARALLELISM OF...

BONDING APPARATUS, BONDING METHOD, AND COMPUTER READABLE STORAGE ME...

WIRE TENSION ADJUSTMENT METHOD AND WIRE TENSION ADJUSTER

FLUX TRANSFER APPARATUS, FLUX TRANSFER METHOD, AND MOUNTING APPARATUS

WIRE BONDING SYSTEM, INSPECTION DEVICE, WIRE BONDING METHOD, AND RE...

ULTRASONIC COMPOSITE VIBRATION DEVICE AND MANUFACTURING APPARATUS O...

ELECTRIC CIRCUIT ABNORMALITY DETECTION DEVICE

MOUNTING APPARATUS, MOUNTING METHOD, AND RECORDING MEDIUM

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE AND MANUFACTURING M...

BONDING APPARATUS AND BONDING METHOD

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

BONDING APPARATUS AND ALIGNMENT METHOD

FLUX TRANSFER APPARATUS

WIRE BONDING DEVICE, MAINTENANCE METHOD AND NON-TRANSITORY COMPUTER...

CONVEYANCE DEVICE, CONVEYANCE METHOD, AND NON-TRANSITORY COMPUTER R...

SUCTION DEVICE, SUCTION UNIT, SUCTION METHOD, AND COMPUTER-READABLE...

MOUNTING HEAD

BUMP-FORMING DEVICE, BUMP-FORMING METHOD, AND NON-TRANSITORY COMPUT...

SUBSTRATE HOLDER AND BONDING SYSTEM

SEMICONDUCTOR DEVICE MANUFACTURING METHOD AND MANUFACTURING APPARATUS

MEASUREMENT DEVICE, MEASUREMENT METHOD, AND BONDING SYSTEM

MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

ULTRASONIC HORN AND MANUFACTURING APPARATUS OF SEMICONDUCTOR DEVICE

MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE AND WIRE BONDING APPAR...

POSITION CONTROL APPARATUS, POSITION CONTROL METHOD, POSITION CONTR...

MOUNTING DEVICE AND MOUNTING METHOD

SEMICONDUCTOR DEVICE MANUFACTURING DEVICE AND MANUFACTURING METHOD

MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR D...

Trademarklast 30 trademarks

87420505 - INTELLIGENTBONDER

79038532 - SHINKAWA

79038533