Patent Grant
12107067
This application is a 371 application of the International PCT application serial no. PCT/JP2020/047415, filed on Dec. 18, 2020. The entirety of the above-mentioned patent application is hereby incorporated by reference herein and made a part of this specification.
The disclosure relates to a wire bonding device, a wire cutting method and a non-transitory computer-readable recording medium recording a program.
Conventionally, known is a wire bonding device in which a first bonding point (for example, a pad of a semiconductor die) and a second bonding point (for example, a lead of a package) are electrically connected by a wire. Depending on the bonding conditions of the wire bonding device, the shape of the bonding end part, which is the connection part between the lower end of the wire tail and the electrode pad (which is the second bonding point), may not be thin. In this case, when the wire is gripped by the clamper and the wire tail is pulled up, a large tension is applied to the wire tail, whereby the wire tail is in a stretched state. Then, after the wire tail is further pulled up, the wire tail is cut at the bonding end part. At this time, the stretched wire tail jumps up due to the reaction force at the time of cutting. This causes the wire and the wire tail at the lower part of the clamper to bend in an S shape. The bent wire tail may cause poor ball formation by electric discharge or the like during the next bonding to the electrode pad. Therefore, a method for cutting a wire tail that does not cause bending of the wire tail has been proposed.
[Patent Literature 1] Japanese Patent Lain-Open No. 2723277
The wire bonding method disclosed in Patent Literature 1 raises the capillary diagonally upward from the bonding position after bonding so that the wire tail led out to the tip end of the capillary does not bend. However, in the wire bonding method, if the bonding end part which is the connection part between the lower end of the tail wire and the electrode pad is not thin enough, a large tensile force is applied to the wire when the wire tail is cut. In this case, in the wire bonding method, the wire may jump up due to the reaction force at the time of cutting the wire tail, and the wire at the lower part of the clamper and the wire tail may bend in an S shape.
Therefore, the disclosure has been made in view of the above, and the disclosure cuts the wire tail without applying a large tensile force to prevent bending of the wire when the wire tail is cut.
A wire bonding device according to an embodiment of the disclosure is a wire bonding device for performing a wire bonding process. The wire bonding device includes: a bonding tool for inserting a wire; an ultrasonic vibrator for supplying ultrasonic vibration to the bonding tool via an ultrasonic horn; a drive mechanism for moving the bonding tool; and a control part for controlling the wire bonding process. The control part performs: a bonding step of bonding the wire to a bonding point which is a bonding target by pressing the wire with the bonding tool; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps comprising the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire bonded to the bonding point.
A wire cutting method according to an embodiment of the disclosure is a wire bonding method performed by using a wire bonding device for performing a wire bonding process. The wire bonding device includes: a bonding tool for inserting a wire; an ultrasonic vibrator for supplying ultrasonic vibration to the bonding tool via an ultrasonic horn; a drive mechanism for moving the bonding tool; and a control part for controlling the wire bonding process. The wire cutting method includes: a bonding step of bonding the wire to a bonding point which is a bonding target by pressing the wire with the bonding tool; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps comprising the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire bonded to the bonding point.
A non-transitory computer-readable recording medium recording a program according to an embodiment of the disclosure is one that records a program for causing a wire bonding device to perform a wire bonding process. The wire bonding device includes: a bonding tool for inserting a wire; an ultrasonic vibrator for supplying ultrasonic vibration to the bonding tool via an ultrasonic horn; a drive mechanism for moving the bonding tool; and a control part for controlling the wire bonding process. The program causes the wire bonding device to perform: a bonding step of bonding the wire to a bonding point which is a bonding target by pressing the wire with the bonding tool; a tail feeding out step of feeding out a wire tail from the wire bonded to the bonding point; a tension applying step of raising the bonding tool to apply tension to the wire while the wire is clamped; a tension release step of lowering the bonding tool to release the tension applied to the wire; and after performing a series of steps comprising the tension applying step and the tension release step at least once, a tail cutting step of raising the bonding tool to cut the wire tail from the wire bonded to the bonding point.
According to the disclosure, the wire tail may be cut without a large tensile force being applied to prevent bending of the wire when the wire tail is cut.
Embodiments of the disclosure will be described below. In the description of the drawings below, the same or similar components are denoted by the same or similar reference numerals. The drawings are examples, and the dimensions and shapes of each part are schematic, and the technical scope of the disclosure should not be limited to the embodiments.
[Configuration of Wire Bonding Device 1] The wire bonding device 1 will be described with reference to
As shown in
The XY drive mechanism 10 is configured to be movable in the XY axis direction (direction parallel to the bonding surface), for example. The XY drive mechanism 10 is provided with, for example, the Z drive mechanism 12 capable of moving the bonding arm 20 in the Z-axis direction (direction perpendicular to the bonding surface).
The bonding arm 20 is supported by a support shaft 14 and is configured to be swingable with respect to the XY drive mechanism 10. The bonding arm 20 is formed in a substantially rectangular parallelepiped to extend from the XY drive mechanism 10 toward a bonding stage 16 on which a semiconductor device 100 to be bonded is placed. The bonding arm 20 includes an arm base end part 22 attached to the XY drive mechanism 10, an arm tip end part 24 located on the tip end side (−Y direction side) of the arm base end part 22 and to which the ultrasonic horn 30 is attached, and a flexible connection part 23 that connects the arm base end part 22 and the arm tip end part 24. The connection part 23 is configured by, for example, slits 25a and 25b having a predetermined width extending from a top surface 21a toward a bottom surface 21b of the bonding arm 20, and a slit 25c having a predetermined width extending from the bottom surface 21b toward the top surface 21a of the bonding arm 20. In this way, the connection part 23 is locally configured as a thin-walled part by the slits 25a, 25b, and 25c, so that the arm tip end part 24 may be bent with respect to the arm base end part 22.
As shown in
Further, as shown in
The bonding tool 40 is for inserting a wire 42, and is, for example, a capillary provided with an insertion hole 41. The wire 42 used for bonding is inserted into the insertion hole 41 of the bonding tool 40. The bonding tool 40 is configured so that a part of the wire 42 may be fed out from the tip end thereof. Hereinafter, for convenience of description, the wire 42 fed out from the tip end of the bonding tool 40 is referred to as a wire tail 42a. Further, a pressing part 40a for pressing the wire 42 is provided at the tip end of the bonding tool 40. The pressing part 40a has a rotationally symmetric shape around the insertion hole 41 of the bonding tool 40 in the axial direction, and has a pressing surface on the lower surface around the insertion hole 41. The bonding tool 40 is attached to the ultrasonic horn 30 to be replaceable by a spring force or the like.
A clamper 44 is provided above the bonding tool 40, for example, and operates together with the bonding tool 40. The clamper 44 is configured to grip (constrain) or release the wire 42 at a predetermined timing based on, for example, a control signal output from a clamper control part 81. A wire tensioner (not shown) may be provided above the clamper 44. The wire tensioner is configured to, for example, insert the wire 42 and apply an appropriate tension to the wire 42 during bonding.
The material of the wire 42 is appropriately selected from the viewpoint of ease of processing, low electrical resistance, and the like, and for example, gold (Au), aluminum (Al), copper (Cu), silver (Ag), or the like is used. The wire 42 forms a ball part 43 extending from the tip end of the bonding tool 40. The ball part 43 is bonded to a predetermined bonding point (for example, an electrode pad 112, hereinafter referred to as a first bonding point).
The detection part 70 electrically detects, for example, whether the ball part 43 formed at the tip end of the wire 42 inserted into the bonding tool 40 is grounded to the semiconductor device 100 which is the bonding target. Further, the detection part 70 detects, for example, whether the wire tail 42a is cut from a predetermined bonding point of the semiconductor device 100 (for example, an electrode pad 122, hereinafter referred to as a second bonding point) based on an output of an electric signal supplied to the wire 42.
The detection part 70 includes, for example, a power supply part 71, an output measurement part 72, and a determination part 73. The power supply part 71 applies a predetermined electric signal between the semiconductor device 100 and the wire 42, for example. The output measurement part 72 measures, for example, the output of an electric signal supplied by the power supply part 71. The determination part 73 determines whether the wire 42 has electrically contacted the semiconductor device 100, for example, based on the measurement result of the output measurement part 72. As shown in
As shown in
As shown in
With reference back to
The control part 80 includes, for example, a clamper control part 81 and an XYZ axis control part 82. The clamper control part 81 controls the opening and closing operation of the clamper 44. The XYZ axis control part 82 controls the operation in the X-axis direction, the Y-axis direction, and the Z-axis direction in the bonding tool 40.
The control part 80 is connected to be able to transmit and receive signals to and from each configuration such as the XY drive mechanism 10, the Z drive mechanism 12, the ultrasonic horn 30 (ultrasonic vibrator 60), the clamper 44, the load sensor 50, the detection part 70, the bonding tool position detection part 90, and the like. By controlling the operation of these configurations, the control part 80 may perform a process of cutting the wire tail 42a so as not to cause bending of the wire tail 42a in the wire bonding.
The control part 80 raises and lowers the bonding tool 40 in the Z-axis direction based on the detection result information output from the bonding tool position detection part 90. After bonding the wire 42 to the second bonding point, the control part 80 applies tension to the wire 42 by raising the bonding tool 40 in the Z-axis direction (hereinafter referred to as a tension applying step). That is, the control part 80 applies stress to the connection part between the wire tail 42a and the second bonding point. After that, the control part 80 releases the tension applied to the wire 42 by lowering the bonding tool 40 in the Z-axis direction (hereinafter referred to as a tension release step). That is, the control part 80 releases the stress at the connection part between the wire tail 42a and the second bonding point.
The control part 80 determines, for example, the moving direction and the height of raising the tip end of the bonding tool 40 in the tension applying step based on preset information on raising (hereinafter referred to as raising information). Similarly, the control part 80 determines, for example, the moving direction and the height of lowering the tip end of the bonding tool 40 in the tension release step based on preset information on lowering (hereinafter referred to as lowering information). Here, the height of the tip end of the bonding tool 40 means a distance from a predetermined reference point, and the predetermined reference point is not particularly limited and may be, for example, the second bonding point. In the above description, it has been described that the control part 80 determines the height of the tip end of the bonding tool 40 based on the raising information or the lowering information, but the disclosure is not limited thereto. For example, the control part 80 may determine the moving distance of the tip end of the bonding tool 40 based on the raising information or the lowering information. Specifically, as an example, the control part 80 may determine in the tension applying step the moving distance that is raised in the Z-axis direction from the second bonding point, or may determine in the tension release step the moving distance that is lowered in the Z-axis direction from the end point that has been raised in the tension applying step. Hereinafter, for convenience of description, the raising height or moving distance of the tip end of the bonding tool 40 may be referred to as the “raising moving amount,” and the lowering height or moving distance may be referred to as the “lowering moving amount.”
Here, the raising moving direction is, for example, a direction away from the second bonding point, and is preferably the Z-axis direction. The lowering moving direction is, for example, a direction approaching the second bonding point, and is preferably a direction along the raising moving direction. However, when the raising moving direction and the lowering moving direction are angled with respect to the Z-axis direction, stress in the X-axis direction or the Y-axis direction may be applied to the lower end of the wire tail 42a. As a result, the wire tail 42a may be cut with a small tensile force as described later. Here, the start point in the raising moving direction may be, for example, the second bonding point or a point deviated from the second bonding point in the XY plane. As a result, stress in the X-axis direction or the Y-axis direction may be applied to the lower end of the wire tail 42a, so that the wire tail 42a may be cut with a small tensile force as described later. Further, the start point in the lowering moving direction may be, for example, the end point of the tension applying step. Hereinafter, for convenience of description, in the control part 80, the raising moving direction and the lowering moving direction are set in the Z-axis direction; the start point of the starting raising moving direction is set as the second bonding point; and the start point of the starting lowering moving direction is set as the end point of the tension applying step.
Further, the control part 80 may automatically set the height or the moving distance (moving amount) in the tension applying step and the tension release step based on the thickness of the wire 42, for example. Specifically, the control part 80 may set, for example, a predetermined ratio (for example, 60%) to the thickness of the wire 42 as the raising moving amount. The control part 80 may set a predetermined ratio (for example, 30%) to the thickness of the wire 42 as the lowering moving amount. Further, the control part 80 may automatically set the lowering moving amount in the tension release step based on, for example, the raising information. Specifically, the control part 80 may set a predetermined ratio (for example, 50%) to the raising moving amount as the lowering moving amount. Furthermore, the control part 80 may automatically set, for example, the raising moving amount of the tension applying step and the lowering moving amount of the tension release step based on the material of the wire 42 in addition to the thickness of the wire 42. Specifically, for example, the control part 80 may set the raising moving amount to be larger and the lowering moving amount to be smaller when the material of the wire 42 is harder. This is because the stronger the strength of the wire 42, the less bending deformation occurs even if a large tension is applied. As a result, the amount of work required for setting of the operator may be reduced.
Further, the control part 80 sets so that, for example, the raising moving amount in the tension applying step is larger than the lowering moving amount in the tension release step. Then, it is preferable that the control part 80 repeats, for example, the tension applying step and the tension release step multiple times. That is, in the control part 80 sets so that, for example, the height of the tip end of the bonding tool 40 in the current tension applying step (the second tension applying step described later) is higher than the height of the tip end of the bonding tool 40 in the previous tension applying step (the first tension applying step described later). In this way, the control part 80 repeats the tension applying step and the tension release step, so that metal fatigue is gradually caused in the part between the lower end of the wire tail 42a (the end in the −Z axis direction) and the end of the wire 42 connected to the second bonding point in a thinly crushed shape (hereinafter referred to as a bonding end part 42c). That is, the tensile strength at the part between the lower end of the wire tail 42a and the bonding end part 42c is reduced. As a result, the wire tail 42a may be cut from the second bonding point without applying a large tensile force to the part. In other words, the connection part between the wire tail 42a and the second bonding point is gradually thinned, and the wire tail 42a may be cut with a small pulling force at the time of cutting. As a result, the wire tail 42a is not bent and deformed, and the bonding quality may be improved.
Further, the control part 80, for example, stops a series of steps including the tension applying step and the tension release step when the detection part 70 detects that the wire tail 42a is cut from the second bonding point of the semiconductor device 100. As a result, the tension applying step and the tension release step may be performed a minimum number of times, so the time of the cutting step of the wire tail 42a may be shortened. Further, since it is not necessary to set the number of times of the tension applying step and the tension release step, the amount of work of the operator may be reduced.
The control part 80 is connected to, for example, an operation part 132 for inputting information for control (hereinafter referred to as control information) and a display part 134 for outputting the control information. The operator confirms the screen on the display part 134, and inputs control information (raising information, lowering information, and the like) by the operation part 132. The control part 80 is a computer device including a CPU, a memory, and the like, and the memory stores a program and the like for executing processing necessary for wire bonding in advance. The control part 80 is configured to perform each step for controlling the operation of the bonding tool 40 described in the wire bonding method described later (for example, includes a program for causing a computer to execute each step).
[Wire Bonding Method]
Next, the wire bonding method will be described with reference to
In step S10 (time t1), as shown in
In step S11 (time t1), the wire bonding device 1 lowers the bonding tool 40 toward the electrode pad 112 of a semiconductor die 110. In step S11, the clamper 44 is, for example, in a closed state.
In step S12 (time t2), as shown in
In step S13 (time t3), as shown in
In step S14 (time t4), as shown in
In step S15 (time t5), as shown in
At time t6, as shown in
Further, at time t6, when the control part 80 acquires the height information indicating that the height of the bonding tool 40 is the height H1, it controls the Z drive mechanism 12 by the XYZ axis control part 82 to stop the operation of the bonding tool 40. At this time, as shown in
At time t7, as shown in
In step S16 (time t81 in
In step S17 (time t82 in
In step S18, the wire bonding device 1, for example, sets a moving amount indicating the height or moving distance of the bonding tool 40 for each of the next tension applying step (hereinafter referred to as the second tension applying step) and tension release step (hereinafter referred to as the second tension release step) with respect to the first tension applying step and the first tension release step. The wire bonding device 1 sets the moving amount of each step based on, for example, information (raising information, lowering information, and the like) regarding the moving amount stored in a predetermined storage part.
Here, the wire bonding device 1 sets, for example, the height of the second tension applying step to be higher than the height of the first tension applying step. Similarly, the wire bonding device 1 sets, for example, the height of the second tension release step to be higher than the height of the first tension release step. Further, the wire bonding device 1 may set the moving distance of the second tension applying step and the moving distance of the second tension release step to be equal to the moving distance of the first tension applying step and the moving distance of the first tension release step. Here, the “equal moving distance” means, for example, a moving distance that allows a mechanical error of the wire bonding device 1 in two moving distances.
In step S19 (time t83 in
In step S20 (time t84 in
In step S21, the wire bonding device 1 determines whether the wire tail 42a has been cut. Specifically, the wire bonding device 1 determines that the wire tail 42a has been cut when the electric signal is not detected by the detection part 70 (step 521: YES). In this case, the wire bonding device 1 ends the process for cutting the wire tail 42a. On the other hand, the wire bonding device 1 determines that the wire tail 42a is not cut when the electric signal is detected by the detection part 70 (step 521: NO). In this case, the wire bonding device 1 proceeds the process to step S18.
Further, in the above description, only the first and second tension applying steps and the first and second tension release steps have been described as shown at time t81 to time t84, but as shown at times t85 and t86 in
By repeating the tension applying step and the tension release step in this way, as shown in
As shown in
In the above, as shown in
In the above, as an example of the wire bonding method, wire bonding for connecting two points of the bonding target by a wire has been described, but the disclosure is not limited thereto. For example, the above embodiment may be applied to a method of forming the bump 140 on the electrode 212 which is the bonding point of the semiconductor device 200 in the bump bonding shown in
In the above, it has been described that the wire bonding device 1 determines whether the wire tail 42a has been cut after the second tension release step (step S20), but the disclosure is not limited thereto. The wire bonding device 1 may determine whether the wire tail 42a has been cut after the second tension applying step (step S19), or may constantly determine whether the wire tail 42a has been cut. As a result, it may be determined whether the wire tail 42a has been cut without delay, so that the operation related to the cutting of the wire tail 42a of the wire bonding device 1 may be reduced.
In the above, it has been described that in the wire bonding device 1, the clamper 44 is closed in the tension release step, but the disclosure is not limited to this. In the tension release step, the clamper 44 may be open. This facilitates the operation of releasing the tension of the wire 42.
The embodiments described through the embodiments of the disclosure may be appropriately combined, modified or changed according to the intended use, and the disclosure is not limited to the description of the above-described embodiments. It is clear from the description of the claims that such combinations or modifications or changes may also be included in the technical scope of the disclosure.
| Filing Document | Filing Date | Country | Kind |
|---|---|---|---|
| PCT/JP2020/047415 | 12/18/2020 | WO |
| Publishing Document | Publishing Date | Country | Kind |
|---|---|---|---|
| WO2022/130617 | 6/23/2022 | WO | A |
| Number | Name | Date | Kind |
|---|---|---|---|
| 5981371 | Yamazaki | Nov 1999 | A |
| 6564453 | Tamai et al. | May 2003 | B2 |
| 6595400 | Terakado | Jul 2003 | B2 |
| 8919632 | Liu | Dec 2014 | B2 |
| 9887174 | Sekine | Feb 2018 | B2 |
| 11450640 | Tei | Sep 2022 | B2 |
| 20070246513 | Tei | Oct 2007 | A1 |
| 20080197510 | Mii | Aug 2008 | A1 |
| 20110180590 | Akiyama | Jul 2011 | A1 |
| 20160351537 | Sekine | Dec 2016 | A1 |
| 20160358883 | Yoshino | Dec 2016 | A1 |
| 20240006193 | Yoshino | Jan 2024 | A1 |
| Number | Date | Country |
|---|---|---|
| H109252005 | Sep 1997 | JP |
| 2723277 | Mar 1998 | JP |
| 2007294581 | Nov 2007 | JP |
| 522497 | Mar 2003 | TW |
| 201841273 | Nov 2018 | TW |
| 2015122410 | Aug 2015 | WO |
| Entry |
|---|
| “International Search Report (Form PCT/ISA/210) of PCT/JP2020/047415”, mailed on Mar. 16, 2021, with English translation thereof, pp. 1-4. |
| “Office Action of Taiwan Counterpart Application,” issued on Mar. 23, 2023, with partial English translation thereof, p. 1-p. 17. |
| “Office Action of Korea Counterpart Application”, issued on Apr. 17, 2024, with English translation thereof, p. 1-p. 18. |
| Number | Date | Country | |
|---|---|---|---|
| 20230163097 A1 | May 2023 | US |
