Silicon Precision Industries Co., Ltd.

Organization

Taichung, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating carrier structure
- Patent number 11,792,938
- Issue date Oct 17, 2023
- Silicon Precision Industries Co., Ltd.
- Yu-Lung Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,629,572
- Issue date Apr 21, 2020
- Silicon Precision Industries Co., Ltd.
- Chi-Rui Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure and fabrication method thereof
- Patent number 10,587,041
- Issue date Mar 10, 2020
- Silicon Precision Industries Co., Ltd.
- Chih-Yuan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of electronic package
- Patent number 10,211,082
- Issue date Feb 19, 2019
- Silicon Precision Industries Co., Ltd.
- Lu-Yi Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a packaging substrate including a carrier hav...
- Patent number 10,096,491
- Issue date Oct 9, 2018
- Silicon Precision Industries Co., Ltd.
- Yu-Cheng Pai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 9,999,132
- Issue date Jun 12, 2018
- Silicon Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device has encapsulant with chamfer such that portion...
- Patent number 7,884,456
- Issue date Feb 8, 2011
- Silicon Precision Industries Co., Ltd.
- Yun-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device for use as multimedia memory card, has encapsu...
- Patent number 7,443,016
- Issue date Oct 28, 2008
- Silicon Precision Industries Co., Ltd.
- Yun-Lung Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure stacking chips on front surface and back surface...
- Patent number 6,414,384
- Issue date Jul 2, 2002
- Silicon Precision Industries Co., Ltd.
- Randy H. Y. Lo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Fabrication method of multichip stacking structure
- Publication number 20080176358
- Publication date Jul 24, 2008
- Silicon Precision Industries Co., Ltd.
- Chung-Lun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced semiconductor package and fabrication method the...
- Publication number 20040238945
- Publication date Dec 2, 2004
- Silicon Precision Industries Co., Ltd
- Chien-Ping Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ground-enhanced semiconductor package and lead frame for the same
- Publication number 20040238921
- Publication date Dec 2, 2004
- Silicon Precision Industries Co., Ltd
- Yi-Shiung Lee
- H01 - BASIC ELECTRIC ELEMENTS

Silicon Precision Industries Co., Ltd.

Organization

Patents Grantslast 30 patents

Method for fabricating carrier structure

Electronic package and method for fabricating the same

Electronic package structure and fabrication method thereof

Fabrication method of electronic package

Method of fabricating a packaging substrate including a carrier hav...

Electronic package

Semiconductor device has encapsulant with chamfer such that portion...

Semiconductor device for use as multimedia memory card, has encapsu...

Package structure stacking chips on front surface and back surface...

Patents Applicationslast 30 patents

Fabrication method of multichip stacking structure

Thermally enhanced semiconductor package and fabrication method the...

Ground-enhanced semiconductor package and lead frame for the same

Trademarklast 30 trademarks