Siliconware Precision Industries Co., Ltd.

Organization

Taichung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,205,906
- Issue date Jan 21, 2025
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,199,047
- Issue date Jan 14, 2025
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,176,291
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,176,327
- Issue date Dec 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,159,821
- Issue date Dec 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Ting-Yang Chou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and substrate...
- Patent number 12,154,848
- Issue date Nov 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,132,003
- Issue date Oct 29, 2024
- Siliconware Precision Industries Co., Ltd.
- You-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrying substrate, electronic package having the carrying substrat...
- Patent number 12,125,828
- Issue date Oct 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,113,004
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating assemble substrate
- Patent number 12,114,427
- Issue date Oct 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,107,055
- Issue date Oct 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, manufacturing method thereof and electronic pack...
- Patent number 12,100,648
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 12,100,641
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,100,642
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising wire inside an electronic component
- Patent number 12,100,633
- Issue date Sep 24, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, heat dissipation structure and manufacturing me...
- Patent number 12,080,618
- Issue date Sep 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising multiple wires inside an electronic c...
- Patent number 12,068,211
- Issue date Aug 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof, and antenna mo...
- Patent number 12,068,535
- Issue date Aug 20, 2024
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 12,057,618
- Issue date Aug 6, 2024
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,057,409
- Issue date Aug 6, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 12,051,641
- Issue date Jul 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip matching system and method thereof
- Patent number 12,046,494
- Issue date Jul 23, 2024
- Siliconware Precision Industries Co., Ltd.
- Wu-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 12,033,868
- Issue date Jul 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and carrier thereof and method for manufacturing...
- Patent number 12,027,484
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ren Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and antenna structure thereof
- Patent number 12,027,753
- Issue date Jul 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of electronic package comprising a wire within...
- Patent number 12,014,967
- Issue date Jun 18, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 12,009,340
- Issue date Jun 11, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method of fabricating the same
- Patent number 12,002,737
- Issue date Jun 4, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing Su
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,984,379
- Issue date May 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, manufacturing method for the same, and electron...
- Patent number 11,984,393
- Issue date May 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022803
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- You-Chen Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250022809
- Publication date Jan 16, 2025
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20250015054
- Publication date Jan 9, 2025
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240421023
- Publication date Dec 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240421026
- Publication date Dec 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Chiu-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240407079
- Publication date Dec 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chien-Sheng CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF
- Publication number 20240395687
- Publication date Nov 28, 2024
- Siliconware Precision Industries Co., Ltd.
- Ching-Chih LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INDUCTOR MODULE AND MANUFACTURING METHOD THEREOF
- Publication number 20240387102
- Publication date Nov 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Huei-Chi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379609
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Wei-Shen HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379590
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Chu LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...
- Publication number 20240379534
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240379477
- Publication date Nov 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371721
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240373545
- Publication date Nov 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Hsiang-Hua HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240363577
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240363545
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Che-Yu LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MO...
- Publication number 20240364001
- Publication date Oct 31, 2024
- Siliconware Precision Industries Co., Ltd.
- Shao-Tzu Tang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF
- Publication number 20240332149
- Publication date Oct 3, 2024
- Siliconware Precision Industries Co., Ltd.
- Yuan-Chang NI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321769
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING ELECTRONIC PACKAGE
- Publication number 20240321591
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240321672
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Lun CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...
- Publication number 20240321784
- Publication date Sep 26, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF
- Publication number 20240312889
- Publication date Sep 19, 2024
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240297126
- Publication date Sep 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290728
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290675
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290691
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Min-Han Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290701
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240290674
- Publication date Aug 29, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20240282689
- Publication date Aug 22, 2024
- Siliconware Precision Industries Co., Ltd.
- Chan-Yu YEH
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
78417649 - TERMINATOR CSP
- Serial number 78417649
- Registration number 3124459
- Filing date May 12, 2004
- Siliconware Precision Industries Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78417645 - TERMINATOR FC
- Serial number 78417645
- Registration number 3124458
- Filing date May 12, 2004
- Siliconware Precision Industries Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75753260 - MCB
- Serial number 75753260
- Registration number 2565705
- Filing date Jul 16, 1999
- Silicon Motion, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Siliconware Precision Industries Co., Ltd.

Organization

Patents Grantslast 30 patents

Electronic package and fabrication method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Method for fabricating electronic package

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof, and substrate...

Electronic package and manufacturing method thereof

Carrying substrate, electronic package having the carrying substrat...

Electronic package and manufacturing method thereof

Method for fabricating assemble substrate

Electronic package and fabrication method thereof

Electronic module, manufacturing method thereof and electronic pack...

Electronic package and method for manufacturing the same

Electronic package and fabrication method thereof

Electronic package comprising wire inside an electronic component

Electronic package, heat dissipation structure and manufacturing me...

Electronic package comprising multiple wires inside an electronic c...

Electronic package and manufacturing method thereof, and antenna mo...

Electronic package and fabrication method thereof

Electronic package and manufacturing method thereof

Electronic package and manufacturing method thereof

Chip matching system and method thereof

Electronic package and method for fabricating the same

Electronic package and carrier thereof and method for manufacturing...

Electronic package and antenna structure thereof

Manufacturing method of electronic package comprising a wire within...

Method for fabricating electronic package

Electronic package and method of fabricating the same

Electronic package and manufacturing method thereof

Electronic package, manufacturing method for the same, and electron...

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CARRIER STRUCTURE

ELECTRONIC PACKAGE AND CARRIER STRUCTURE THEREOF

INDUCTOR MODULE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, MANUFACTURING METHOD FOR THE SAME, AND ELECTRON...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ANTENNA MO...

ELECTRONIC PACKAGE AND SUBSTRATE STRUCTURE THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FABRICATING ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE INCLUDING LEAD FRAME HAVING MULTIPLE CONDUCTIVE...

ELECTRONIC PACKAGE AND CIRCUIT STRUCTURE THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE, PACKAGING SUBSTRATE AND FABRICATING METHOD THEREOF

Trademarklast 30 trademarks

78417649 - TERMINATOR CSP

78417645 - TERMINATOR FC

75753260 - MCB