Siliconware Precision Industries Co., Ltd.

Organization

Taichung, TW

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple conductive posts
- Patent number 11,973,043
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package including electronic structure and electronic co...
- Patent number 11,973,047
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Carrying substrate, electronic package having the carrying substrat...
- Patent number 11,923,337
- Issue date Mar 5, 2024
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of substrate having electrical interconnection s...
- Patent number 11,913,121
- Issue date Feb 27, 2024
- Siliconware Precision Industries Co., Ltd.
- Po-Yi Wu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,881,459
- Issue date Jan 23, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,810,862
- Issue date Nov 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and circuit structure thereof
- Patent number 11,791,300
- Issue date Oct 17, 2023
- Siliconware Precision Industries Co., Ltd.
- Fang-Lin Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module, manufacturing method thereof and electronic pack...
- Patent number 11,776,897
- Issue date Oct 3, 2023
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 11,764,162
- Issue date Sep 19, 2023
- Siliconware Precision Industries Co., Ltd.
- Ming-Fan Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,764,188
- Issue date Sep 19, 2023
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Test equipment and test device thereof
- Patent number 11,747,382
- Issue date Sep 5, 2023
- Siliconware Precision Industries Co., Ltd.
- Bo-Siang Fang
- G01 - MEASURING TESTING
Information Patent Grant
Electronic package and method for manufacturing the same
- Patent number 11,749,583
- Issue date Sep 5, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,742,296
- Issue date Aug 29, 2023
- Siliconware Precision Industries Co., Ltd.
- Wei-Jhen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,728,178
- Issue date Aug 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Shu-Chi Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package comprising wire inside an electronic component a...
- Patent number 11,728,234
- Issue date Aug 15, 2023
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and circuit board thereof
- Patent number 11,723,144
- Issue date Aug 8, 2023
- Siliconware Precision Industries Co., Ltd.
- Ming-Fan Tsai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,682,826
- Issue date Jun 20, 2023
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package with multiple electronic components spaced apart...
- Patent number 11,676,877
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Hong-Da Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package
- Patent number 11,676,948
- Issue date Jun 13, 2023
- Siliconware Precision Industries Co., Ltd.
- Kong-Toon Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,670,607
- Issue date Jun 6, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and fabrication method thereof
- Patent number 11,610,850
- Issue date Mar 21, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsun Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip process and bonding equipment
- Patent number 11,605,554
- Issue date Mar 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package, packaging substrate, and methods for fabricatin...
- Patent number 11,600,571
- Issue date Mar 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Jun-Chang Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of electronic package having antenna function
- Patent number 11,594,501
- Issue date Feb 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and manufacturing method thereof
- Patent number 11,587,892
- Issue date Feb 21, 2023
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating electronic package and carrier structure the...
- Patent number 11,545,385
- Issue date Jan 3, 2023
- Siliconware Precision Industries Co., Ltd.
- Tse-Yuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package
- Patent number 11,532,568
- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing device for burn-in test operations and control method thereof
- Patent number 11,531,059
- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Chao-Ming Tu
- G01 - MEASURING TESTING
Information Patent Grant
Chip matching system and method thereof
- Patent number 11,532,495
- Issue date Dec 20, 2022
- Siliconware Precision Industries Co., Ltd.
- Wu-Hung Yen
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240153884
- Publication date May 9, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Min FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240145398
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Cheng-Liang HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145908
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Chun LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145455
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Meng-Jie LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...
- Publication number 20240145372
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chia-Wen TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240145403
- Publication date May 2, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240136263
- Publication date Apr 25, 2024
- Siliconware Precision Industries Co., Ltd.
- Hung-Kai WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240128249
- Publication date Apr 18, 2024
- Siliconware Precision Industries Co., Ltd.
- Chih-Hsien CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF ELECTRONIC PACKAGE
- Publication number 20240096835
- Publication date Mar 21, 2024
- Siliconware Precision Industries Co., Ltd.
- Pin-Jing SU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240088054
- Publication date Mar 14, 2024
- Siliconware Precision Industries Co., Ltd.
- Shu-Ting LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240079301
- Publication date Mar 7, 2024
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240072019
- Publication date Feb 29, 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240055402
- Publication date Feb 15, 2024
- Siliconware Precision Industries Co., Ltd.
- Lung-Yuan WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE
- Publication number 20240049382
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Chin-Wei Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047374
- Publication date Feb 8, 2024
- SILICONWARE PRECISION INDUSTRIES CO., LTD.
- Chih-Hsien Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...
- Publication number 20240047420
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Yi-Ling CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240047440
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Wen-Jung Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20240047336
- Publication date Feb 8, 2024
- Siliconware Precision Industries Co., Ltd.
- Ching-Chih Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038670
- Publication date Feb 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240038685
- Publication date Feb 1, 2024
- Siliconware Precision Industries Co., Ltd.
- Chao-Chiang Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420391
- Publication date Dec 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Feng Kao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...
- Publication number 20230420420
- Publication date Dec 28, 2023
- Siliconware Precision Industries Co., Ltd.
- Chi-Ching Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230411364
- Publication date Dec 21, 2023
- Siliconware Precision Industries Co., Ltd.
- Po-Kai HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402409
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Chung-Yu Ke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230395571
- Publication date Dec 7, 2023
- Siliconware Precision Industries Co., Ltd.
- Meng-Huan Chia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC PACK...
- Publication number 20230386992
- Publication date Nov 30, 2023
- Siliconware Precision Industries Co., Ltd.
- Ho-Chuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRASONIC DEVICE
- Publication number 20230381996
- Publication date Nov 30, 2023
- Siliconware Precision Industries Co., Ltd.
- Yu-Lung Huang
- B26 - HAND CUTTING TOOLS CUTTING SEVERING
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230378072
- Publication date Nov 23, 2023
- Siliconware Precision Industries Co., Ltd.
- Shuai-Lin Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE THEREOF
- Publication number 20230369268
- Publication date Nov 16, 2023
- Siliconware Precision Industries Co., Ltd.
- Yung-Ta Li
- H01 - BASIC ELECTRIC ELEMENTS

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Trademarklast 30 trademarks

Information Trademark
78417649 - TERMINATOR CSP
- Serial number 78417649
- Registration number 3124459
- Filing date May 12, 2004
- Siliconware Precision Industries Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78417645 - TERMINATOR FC
- Serial number 78417645
- Registration number 3124458
- Filing date May 12, 2004
- Siliconware Precision Industries Co., Ltd.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
75753260 - MCB
- Serial number 75753260
- Registration number 2565705
- Filing date Jul 16, 1999
- Silicon Motion, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Siliconware Precision Industries Co., Ltd.

Organization

Patents Grantslast 30 patents

Method of manufacturing substrate structure with filling material f...

Multiple conductive posts

Electronic package including electronic structure and electronic co...

Carrying substrate, electronic package having the carrying substrat...

Fabrication method of substrate having electrical interconnection s...

Electronic package and fabrication method thereof

Electronic package and manufacturing method thereof

Electronic package and circuit structure thereof

Electronic module, manufacturing method thereof and electronic pack...

Electronic package and method for manufacturing the same

Electronic package and manufacturing method thereof

Test equipment and test device thereof

Electronic package and method for manufacturing the same

Electronic package and manufacturing method thereof

Method for fabricating electronic package

Electronic package comprising wire inside an electronic component a...

Electronic device and circuit board thereof

Electronic package and fabrication method thereof

Electronic package with multiple electronic components spaced apart...

Method for fabricating electronic package

Electronic package

Electronic package and fabrication method thereof

Flip-chip process and bonding equipment

Electronic package, packaging substrate, and methods for fabricatin...

Fabrication method of electronic package having antenna function

Electronic package and manufacturing method thereof

Method for fabricating electronic package and carrier structure the...

Electronic package

Testing device for burn-in test operations and control method thereof

Chip matching system and method thereof

Patents Applicationslast 30 patents

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CARRIER STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE

MANUFACTURING METHOD OF ELECTRONIC PACKAGE

CARRIER STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CARRIER STRUCTURE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND ELECTRONIC...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

CARRYING SUBSTRATE, ELECTRONIC PACKAGE HAVING THE CARRYING SUBSTRAT...

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC MODULE, MANUFACTURING METHOD THEREOF AND ELECTRONIC PACK...

ULTRASONIC DEVICE

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

ELECTRONIC PACKAGE AND ELECTRONIC STRUCTURE THEREOF

Trademarklast 30 trademarks

78417649 - TERMINATOR CSP

78417645 - TERMINATOR FC

75753260 - MCB