SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.

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Chongqing, CN

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

Information Patent Application
FABRICATION METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR ST...
- Publication number 20250015022
- Publication date Jan 9, 2025
- SiPLP Microelectronics (Chongqing) Limited
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE METHOD AND SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20240321846
- Publication date Sep 26, 2024
- SIPLP MICROELECTRONICS (CHONGQING) LTD.
- Xufeng TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR
- Publication number 20240274501
- Publication date Aug 15, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20240203922
- Publication date Jun 20, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD
- Publication number 20240087912
- Publication date Mar 14, 2024
- SiPLP Microelectronics (Chongqing) Limited
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE AND MANUFACTURING METHOD THEREFOR, AND CHIP PACKAGING STRUCTURE...
- Publication number 20230268299
- Publication date Aug 24, 2023
- SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
- Weiyuan YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20230170318
- Publication date Jun 1, 2023
- SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
- Yan HUO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR ENCAPSULATION METHOD AND SEMICONDUCTOR ENCAPSULATION...
- Publication number 20220399207
- Publication date Dec 15, 2022
- SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.
- Jimmy CHEW
- H01 - BASIC ELECTRIC ELEMENTS

SIPLP MICROELECTRONICS (CHONGQING) CO., LTD.

Organization

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

FABRICATION METHOD FOR SEMICONDUCTOR STRUCTURE AND SEMICONDUCTOR ST...

SEMICONDUCTOR PACKAGE METHOD AND SEMICONDUCTOR PACKAGE STRUCTURE

MCM PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREFOR

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGING METHOD

DIE AND MANUFACTURING METHOD THEREFOR, AND CHIP PACKAGING STRUCTURE...

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR ENCAPSULATION METHOD AND SEMICONDUCTOR ENCAPSULATION...

Trademarklast 30 trademarks