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SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.

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  • SHENZHEN, CN
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  • Information Patent Application

    PACKAGE BODY AND PREPARATION METHOD THEREFOR
    • Publication number 20240404938
    • Publication date Dec 5, 2024
    • SKY CHIP INTERCONNECTION TECHNOLOGY CO., LTD.
    • Shijie ZHONG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PACKAGING METHOD AND PACKAGE MEMBER
    • Publication number 20240021555
    • Publication date Jan 18, 2024
    • SKY CHIP INTERCONNECTION TECHNOLOGY CO.,LTD.
    • YUHONG LI
    • H01 - BASIC ELECTRIC ELEMENTS

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