Patent Application
20250125306
The present disclosure relates to the technical field of device packaging, and in particular to a packaging method and a packaging body.
Packaging refers to manufacturing a shell used for a target device, and the packaging plays a role in mounting, fixing, sealing and protecting the devices, and enhancing electrical heating performance, etc.
In a later stage of manufacturing a packaging body, a large plate is required to be separated and cut to obtain multiple independent packaging bodies, so as to achieve batch manufacture. A traditional separation method includes cutter wheel cutting or laser cutting.
However, the cutter wheel cutting only is used in cutting along a straight line, and the more cutting paths, the slower the cutting speed. The efficiency of the laser cutting is very slow, and phenomena of thermal melting and blackening is occurred on the cutting paths.
A packaging method is provided and includes: obtaining a mounting plate defining multiple mounting holes; disposing a target device in a corresponding mounting hole of the multiple mounting holes; performing plastic sealing on the multiple mounting holes to form packaging bodies, and each of the packaging bodies wrapping the target device; and performing chemical etching on the mounting plate until each of the packaging bodies is separated from each other, and obtaining multiple independent packaging bodies.
A packaging method is provided and includes: performing chemical etching on an initial plate to obtain a mounting plate with a plurality of mounting holes; disposing a target device in each of the plurality of mounting holes to form a plurality of packaging bodies; and performing chemical etching on the mounting plate to separate the packaging bodies; The chemical etching includes chemically etching through hydrofluoric acid etching solution or chemically etching through metal etching solution.
A packaging body is provided, and the packaging body is manufactured by any one of the above packaging methods. The packaging body includes a plastic sealing layer and a target device, and the target device is received in the plastic sealing layer.
The technical solutions in embodiments of the present disclosure are clearly and completely described in conjunction with the drawings in the embodiments of the present disclosure. It is obvious that the described embodiments are only some embodiments of the present disclosure, and not all embodiments. All other embodiments acquired by those skilled in the art based on the embodiments in the present disclosure without the creative work are all within the scope of the present disclosure.
It should be noted that when directional indications (such as above, lower, left, right, front, rear . . . ) used in embodiments of the present disclosure are only used to explain relative position relationship, motion situation, etc. between components in a specific posture (as shown in the drawings). When the specific posture changes, the directional indication also changes accordingly.
In addition, the terms “first” and “second” in embodiments of the present disclosure are only used for description purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as “first” and “second” may explicitly or implicitly include at least one of the features. Moreover, the technical solutions of various embodiments may be combined with each other, but the technical solutions may be implemented by those skilled in the art. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that this combination of technical solutions does not exist and is not within the scope of the present disclosure.
As shown in
An operation S11 includes: obtaining a mounting plate defining multiple mounting holes.
The mounting plate with multiple mounting holes is obtained. The mounting plate is required to be removed when the final packaging body is formed. Therefore, the mounting plate in this embodiment may be made of removable materials to cooperate with subsequent chemical etching operation for removal.
The multiple mounting holes are defined on the mounting plate, and the number of the mounting holes are set based on the requirements of batch manufacture of the packaging bodies. The number of the mounting holes may be 10, 20, 50, 100, 300, 500, 800, 1000, 3000, or 5000, etc., which may be set based on the actual situation.
In some embodiments, the multiple mounting holes on the mounting plate may be defined in an array to facilitate the manufacture of the packaging bodies. In another embodiments, the positions of the multiple mounting holes on the mounting plate may be determined based on the characteristics of a processing device, such that the processing device may manufacture multiple packaging bodies on the mounting plate.
An operation S12 includes: mounting a target device in each of the multiple mounting holes.
The target device may include but is not limited to one or more components including a chip, a resistor, a capacitor, a diode, a transistor, and an inductor, etc.
In some embodiments, the mounting holes may be mounting through-holes. The mounting of the target device may be achieved by placing a temporary support layer on one side of the mounting plate and then mounting the target device in the corresponding mounting through-holes from another side of the mounting plate opposite to the one side of the mounting plate until the target device attach to the temporary support layer, so as to complete the mounting of the target device. After fixing the target device through plastic sealing, the temporary support layer may be removed. The temporary support layer may include but is not limited to a temporary bonding adhesive, a tape, a glass substrate, a wooden substrate, or a metal substrate.
In some embodiments, the mounting holes may be mounting blind-holes that the bottom of the mounting blind-holes are not hollowed out, such that the target device may be directly mounted at the bottom of the corresponding mounting blind-holes.
An operation S13 includes: performing plastic sealing on the multiple mounting holes to form the packaging bodies, each of the packaging bodies wrapping the target device.
The plastic sealing material may include but is not limited to one or more types of insulation materials including epoxy resin, polyester resin (PET), polyimide, polyimide, polycarbonate (PC), bismaleimide triazine (BT), and ceramic based materials, etc.
In some embodiments, when the mounting holes are the mounting through-holes, plastic sealing is performed on the side of the mounting holes away from the temporary support layer, such that the plastic sealing material fills the mounting holes and fixes the target device.
In some embodiments, when the mounting holes are mounting blind-holes, plastic sealing is performed on the side of the mounting blind-holes away from the bottom of the mounting blind-holes, such that the plastic sealing material fills the mounting holes and fixes the target device.
After plastic sealing is performed, a relevant process manufacture may be performed based on electrical requirements of the packaging bodies to form the packaging bodies wrapping the target device. The process manufacture depends on the actual manufacture requirements of the packaging bodies and is not limited here. When there are no other electrical requirements for the packaging bodies, the plastic sealed structure may be directly used as the packaging bodies.
An operation S14 includes: performing chemical etching on the mounting plate until each of the packaging bodies is separated from each other, and obtaining multiple independent packaging bodies.
After manufacturing the multiple packaging bodies on the mounting plate, the mounting plate is removed by chemical etching to separate each of the packaging bodies and obtain multiple independent packaging bodies.
In some embodiments, the mounting plate is made of glass, and the chemical etching includes using hydrofluoric acid etching solution for chemical etching. In some embodiments, the mounting plate is made of metal, and chemical etching includes using metal etching solution for chemical etching. The metal etching solution may include acidic etching solution or hydrogen peroxide etching solution.
In other embodiments, the mounting plate may be made of other materials, as long as the etching solution used for chemical etching is capable of etching away the corresponding materials of the mounting plate.
In the above operations of this embodiment, the packaging method includes obtaining a mounting plate defining multiple mounting holes; disposing a target device in each of the multiple mounting holes; performing plastic sealing on the multiple mounting holes to form packaging bodies, each of the packaging bodies wrapping the target device; and performing chemical etching on the mounting plate until each of the packaging bodies is separated from each other, and obtaining multiple independent packaging bodies. In this way, the large plate is separated by chemical etching to obtain multiple independent packaging bodies. The separation path is not limited to a straight line, and the separation surface is not limited to a plane surface, which may greatly improve the freedom of batch separation of packaging bodies and provide more possibilities for the shape of each of the packaging bodies. The chemical etching does not cause phenomena such as thermal melting and blackening that affect the quality of the packaging bodies, thereby ensuring the appearance quality of the packaging bodies. In addition, etching and separation are simultaneously performed on all separation paths, without queuing in sequence, thereby greatly improving the separation efficiency of the large plate.
As shown in
An operation S21 includes: obtaining a mounting plate.
The method of obtaining the mounting plate may include: obtaining an initial plate. The initial plate is an entire piece of plate. The mounting plate is obtained by defining multiple mounting holes on the entire plate. Since the target device is required to be mounted inside the mounting plate, the thickness of the initial plate may be greater than or equal to the thickness of the target device for ease of accommodation.
In some embodiments, the method of defining the mounting holes may include: attaching a protective film to one entire side of the initial plate, exposing and developing the protective film based on an appearance size of each of packaging bodies to expose an area corresponding to each of the packaging bodies on the initial plate, performing chemical etching on the initial plate to form the multiple mounting holes, and removing the protective film. Since the target device is mounted in the corresponding mounting holes to form the packaging bodies through plastic sealing, the shape of each of the mounting holes is related to the appearance size of the corresponding packaging body. Each of the mounting holes is manufactured by chemical etching, and the freedom of chemical etching is used to improve the freedom of the appearance size of each of the mounting holes, thereby meeting the appearance size requirements of different packaging bodies.
In some embodiments, the method of defining the mounting holes may include: defining the multiple mounting holes on the initial plate through mechanical punching or laser ablation.
The mounting holes in this embodiment include but are not limited to mounting through-holes, mounting blind-holes, mounting threaded-holes, mounting step-holes, or mounting inclined-holes. In this embodiment, the mounting through-holes refer to through-holes with smooth and perpendicular hole walls, the mounting blind-holes refer to blind-holes with smooth and perpendicular hole walls, the mounting threaded-holes refer to through-holes or blind-holes with threaded-hole walls, the mounting step-holes refer to through-holes or blind-holes with step-hole walls, and the mounting inclined-holes refer to through-holes or blind-holes with inclined walls.
Different mounting holes in this embodiment may be configured to manufacture packaging bodies with different appearance shapes, thereby providing more possibilities for the shapes of the packaging bodies.
As shown in 3a of
A mounting plate 110 in this embodiment defines multiple mounting holes 111, and the mounting holes 111 are mounting step-holes.
The mounting step-holes in this embodiment may be formed through chemical etching on both opposite sides of the mounting plate 110 to obtain the mounting holes 111 with a step surface on the hole walls. In some embodiments, the mounting step-holes may be formed through mechanical punching on both opposite sides of the mounting plate 110 to obtain the mounting holes 111 with a step surface on the hole walls.
An operation S22 includes: attaching a temporary support layer to one side of the mounting plate, placing the target device in a mounting hole from another side of the mounting plate away from the temporary support layer until the target device is in contact with the temporary support layer.
When the mounting holes are through-holes, there may be no support for the mounting of the target device, therefore, the temporary support layer is required to be configured to support.
As shown in 3b of
The temporary support layer 130 may include but is not limited to a temporary bonding adhesive, a tape, a glass substrate, a wooden substrate, or a metal substrate. In some embodiments, the temporary support layer 130 may be the temporary bonding adhesive or the tape, which may be configured to fix the target device 120 with the adhesive property of the temporary support layer 130 after the target device 120 is placed in the mounting holes 111, thereby reducing the movement of the target device 120 before plastic sealing is performed and improving the structural stability of the packaging bodies.
The target device 120 is placed the mounting holes 111. However, the number and type of the target device 120 inside each of the mounting holes 111 are arranged based on actual needs and are not limited here.
An operation S23 includes: performing plastic sealing on the side of the mounting plate away from the temporary support layer to form a plastic sealing layer filling all the mounting holes, and removing the temporary support layer.
As shown in 3c of
The plastic sealing layer 140 fills all the mounting hole 111 to wrap and fix the target device 120. The plastic sealing material of the plastic sealing layer 140 may include but is not limited to one or more insulating materials including epoxy resin, polyester resin (PET), polyimide, polyimide, polycarbonate (PC), bismaleimide triazine (BT), and ceramic based materials, etc.
After the plastic sealing is performed, the temporary support layer 130 is removed. Since the target device 120 is in contact with the temporary support layer 130 during mounting, after the temporary support layer 130 is removed, the sides of the target device 120 originally in contact with the temporary support layer 130 is exposed. Therefore, other electrical connections may be performed through the exposed sides of the target device 120.
An operation S24 includes: disposing a processing plate connected to the target device on the side of the mounting plate away from the plastic sealing layer to obtain the packaging bodies.
The structure and manufacturing method of the processing plate may be set based on actual needs.
In some embodiments, the manufacturing method of the processing plate may include: disposing multiple first connectors on the side of the target device away from the plastic sealing layer, filling an insulation layer on the side of the target device away from the plastic sealing layer, and then disposing a second connector on the side of the insulation layer away from the multiple first connectors to obtain the processing plate.
As shown in 3d of
As shown in 3e of
The method of attaching the protective film 160 to the partial side of the seed conductive layer 150 may include: attaching the protective film 160 to the entire plate, performing exposure and development to retain the partial protective film 160. A part of the target device 120 is exposed from the partial protective film 160, so that the subsequently formed first connectors may be connected to the target device 120 to lead out the signal of the target device 120.
As shown in 3f of
When the exposed seed conductive layer 150 is etched, a protective film may be covered on the electroplating layer 170 for protection, and the protective film may be removed after the etching is performed.
Some first connectors 171 are connected to the target device 120, thereby leading out the signal of the target device 120.
As shown in 3g of
The thickness of the insulation layer 180 is greater than the thickness of each of the multiple first connectors 171 to fill the gaps between the multiple first connectors 171 and cover the multiple first connectors 171.
As shown in 4a of
In some embodiments, the insulation layer 180 may be made of photosensitive materials, such that by photolithography development, the blind-holes 181 may be defined and the insulation layer 180 arranged on the other first connectors 171 in contact with the mounting plate 110 may be removed in this operation. In some embodiments, by laser ablation, the blind-hole 181 may be defined and the insulation layer 180 arranged on the other first connectors 171 in contact with the mounting plate 110 may be removed.
As shown in 4b of
The conductive layer 190 is contact with the each of the multiple first connectors 171 through the blind-hole 181, so as to be connected to the target device 120.
As shown in 4c of
The second connector 191 is contact with each of the multiple first connector 171, so as to be connected to the target device 120.
As shown in 4d of
The plastic sealing layer 140 is ground on the side of the mounting plate 110 away from the processing plate 200 until the plastic sealing layer 140 is flush with the mounting plate 110 and the mounting plate 110 is exposed, thereby facilitating etching and separation of the plastic sealing layer 140 corresponding to each of the packaging bodies, facilitating the independence of the packaging bodies, and meeting the appearance requirements of each of the packaging bodies.
An operation S25 includes: performing chemical etching on the mounting plate until each of the packaging bodies is separated from each other, and obtaining multiple independent packaging bodies.
As shown in
The mounting plate 110 in this embodiment is arranged with multiple packaging bodies 210 in an array. The appearance of each of the packaging bodies 210 is regular and square.
As shown in
The mounting plate 110 in this embodiment is arranged with multiple packaging bodies 210 in an array. The appearance of each of the packaging bodies 210 is irregular and has a high freedom.
As shown in 4e of
In some embodiments, the mounting plate 110 is made of glass, and the chemical etching includes chemically etching through hydrofluoric acid etching solution. In some embodiments, the mounting plate 110 is made of metal, and chemical etching includes chemically etching through metal etching solution. The metal etching solution may include acidic etching solution or hydrogen peroxide etching solution.
In other embodiments, the mounting plate 110 may be made of other materials, as long as the etching solution used for chemical etching is capable of etching the corresponding materials of the mounting plate 110.
The method of removing the mounting plate 110 by chemical etching is not limited by mechanical thickness or laser spot diameter, the separation path may be processed into any width, the separation path is not limited to a straight line, and the separation surface is not limited to a plane surface, thereby greatly improving the freedom of batch separation of the packaging bodies and providing more possibilities for the shape of each of the packaging bodies. In this embodiment, etching and separation are simultaneously performed on all separation paths, without queuing in sequence, thereby greatly improving the separation efficiency of the large plate.
In the above operations of this embodiment, the large plate is separated by chemical etching to obtain multiple independent packaging bodies. The separation path is not limited to a straight line, and the separation surface is not limited to a plane surface, which may greatly improve the freedom of batch separation of the packaging bodies and provide more possibilities for the shape of each of the packaging bodies. The chemical etching does not cause phenomena of thermal melting and blackening that affect the quality of the packaging bodies, thereby ensuring the appearance quality of the packaging bodies. In addition, etching and separation are simultaneously performed on all separation paths, without queuing in sequence, thereby greatly improving the separation efficiency of the large plate.
As shown in
A packaging body 500 in this embodiment includes a plastic sealing layer 540 and a target device 520. The target device 520 is received in the plastic sealing layer 540.
The target device 520 may include but is not limited to one or more components including a chip, a resistor, a capacitor, a diode, a transistor, and an inductor, etc. The plastic sealing layer 540 may include but is not limited to one or more insulating materials including epoxy resin, polyester resin (PET), polyimide, polyimide, polycarbonate (PC), bismaleimide triazine (BT), and ceramic based materials, etc.
The packaging body 500 in this embodiment is manufactured by the packaging method in any one of the above embodiments. Therefore, the outer surface of the packaging body 500 in this embodiment is not limited to a plane surface, and has a high freedom in appearance. The packaging body 500 does not occur phenomena of thermal melting and blackening during separation, thereby ensuring the appearance quality of the packaging body 500.
In other embodiments, the packaging body 500 includes a processing plate 510. The processing plate 510 is contact with the target device 520, thereby leading out the signal of the target device 520.
In other embodiments, the processing plate 510 includes an insulation layer 580, and a first connector 571 and a second connector 591 connected one by one.
The first connector 571 is attached to the side of the target device 520 away from the plastic sealing layer 540, and the insulation layer 580 is attached to the side of the target device 520 away from the plastic sealing layer 540 and wraps the first connector 571. The second connector 591 inserts the insulation layer 580 and is connected to the side of the first connector 571 away from the target device 520.
The second connector 591 is exposed from the insulation layer 580 to lead out the signal of the target device 520.
In other embodiments, a chemical plating layer 592 is attached to the exposed surface of the second connector 591, the chemical plating layer 592 includes but is not limited to materials including silver, gold, and/or tin to reduce the oxidation of the second connector 291.
The above description is only some embodiments of the present disclosure and does not limit the scope of the present disclosure. Any equivalent structure or equivalent process transformation made using the description and drawings of the present disclosure, or directly or indirectly applied the description and drawings of the present disclosure in other related technical fields, are included in the present disclosure.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202311324523.7 | Oct 2023 | CN | national |
The present disclosure is a continuation of International Patent Application No. PCT/CN2024/111143, filed Aug. 9, 2024, which claims foreign priority to Chinese Patent Application No. 202311324523.7, filed Oct. 12, 2023, both of which are hereby incorporated by reference in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2024/111143 | Aug 2024 | WO |
| Child | 18981551 | US |
