ST ASSEMBLY TEST SERVICES PTE LTD

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with heat sink
- Patent number 7,446,408
- Issue date Nov 4, 2008
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip molded/exposed die process and package structure
- Patent number 7,081,668
- Issue date Jul 25, 2006
- St Assembly Test Services Pte.
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package conversion kit for a pick and place handler
- Patent number 7,076,861
- Issue date Jul 18, 2006
- St Assembly Test Services Pte.
- Kai Wah Sum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ground plane for exposed package
- Patent number 6,876,069
- Issue date Apr 5, 2005
- ST Assembly Test Services PTE LTD
- Jefferey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader anchoring and grounding method and thermally enhanced...
- Patent number 6,875,634
- Issue date Apr 5, 2005
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe for die stacking applications and related die stacking co...
- Patent number 6,841,858
- Issue date Jan 11, 2005
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PBGA singulated substrate for model melamine cleaning
- Patent number 6,834,658
- Issue date Dec 28, 2004
- ST Assembly Test Services PTE LTD
- Loreto Ycong Cantillep
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Enhanced BGA grounded heatsink
- Patent number 6,828,671
- Issue date Dec 7, 2004
- ST Assembly Test Services PTE LTD
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold cap anchoring method for molded flex BGA packages
- Patent number 6,825,067
- Issue date Nov 30, 2004
- ST Assembly Test Services PTE LTD
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader interconnect for thermally enhanced PBGA packages
- Patent number 6,818,981
- Issue date Nov 16, 2004
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cost effective substrate fabrication for flip-chip packages
- Patent number 6,802,445
- Issue date Oct 12, 2004
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Testing of BGA and other CSP packages using probing techniques
- Patent number 6,791,346
- Issue date Sep 14, 2004
- ST Assembly Test Services PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Grant
Test coupon pattern design to control multilayer saw singulated pla...
- Patent number 6,774,640
- Issue date Aug 10, 2004
- ST Assembly Test Services PTE LTD
- Jian-Jun Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming a small pitch torch bump for mounting high-perfor...
- Patent number 6,740,577
- Issue date May 25, 2004
- ST Assembly Test Services PTE LTD
- Yong Gang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-package conversion kit for a pick and place handler
- Patent number 6,718,608
- Issue date Apr 13, 2004
- ST Assembly Test Services PTE LTD
- Sum Kai Wah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Enhanced chip scale package for wire bond dies
- Patent number 6,710,438
- Issue date Mar 23, 2004
- Institute of Microelectronics
- Yong Kee Yeo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader interconnect methodology for thermally enhanced PBGA...
- Patent number 6,706,563
- Issue date Mar 16, 2004
- ST Assembly Test Services PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip molded/exposed die process and package structure
- Patent number 6,660,565
- Issue date Dec 9, 2003
- ST Assembly Test Services PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming drop-in heat spreader plastic ball grid array (P...
- Patent number 6,432,742
- Issue date Aug 13, 2002
- ST Assembly Test Services PTE LTD
- Chow Seng Guan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Velcro strapping for semiconductor carrying trays
- Patent number 6,426,460
- Issue date Jul 30, 2002
- ST Assembly Test Services PTE LTD
- Kester Ong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat spreader hole pin 1 identifier
- Patent number 6,403,401
- Issue date Jun 11, 2002
- ST Assembly Test Services PTE LTD
- Weddie Pacio Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing of BGA and other CSP packages using probing techniques
- Patent number 6,404,212
- Issue date Jun 11, 2002
- ST Assembly Test Services PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Grant
High volume fluid head
- Patent number 6,383,303
- Issue date May 7, 2002
- ST Assembly Test Services PTE LTD
- Hwee Nam Wee
- B08 - CLEANING
Information Patent Grant
Die paddle enhancement for exposed pad in semiconductor packaging
- Patent number 6,380,048
- Issue date Apr 30, 2002
- ST Assembly Test Services PTE LTD
- Tan Hien Boon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Disposable mold runner gate for substrate based electronic packages
- Patent number 6,372,553
- Issue date Apr 16, 2002
- ST Assembly Test Services, PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Boat and assembly method for ball grid array packages
- Patent number 6,359,336
- Issue date Mar 19, 2002
- ST Assembly Test Services PTE LTD
- Loreto Yeong Cantillep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of molding flexible circuit with molded stiffener
- Patent number 6,355,199
- Issue date Mar 12, 2002
- ST Assembly Test Services PTE LTD
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Zig-zagged plating bus lines
- Patent number 6,319,418
- Issue date Nov 20, 2001
- ST Assembly Test Services PTE LTD
- Arvin Verdeflor
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Reliable method and apparatus for interfacing between a ball grid a...
- Patent number 6,300,781
- Issue date Oct 9, 2001
- ST Assembly Test Services PTE LTD
- Liop Jin Yap
- G01 - MEASURING TESTING
Information Patent Grant
Multi air-knife box and method of use
- Patent number 6,282,812
- Issue date Sep 4, 2001
- ST Assembly Test Services PTE LTD
- Hwee Nam Wee
- F26 - DRYING

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Patents Applicationslast 30 patents

Information Patent Application
Torch Bump
- Publication number 20040178503
- Publication date Sep 16, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Yong Gang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-package conversion kit for a pick and place handler
- Publication number 20040134054
- Publication date Jul 15, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Kai Wah Sum
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Mold cap anchoring method for molded flex BGA packages
- Publication number 20040108601
- Publication date Jun 10, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Virgil C. Ararao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Cost effective substrate fabrication for flip-chip packages
- Publication number 20040079788
- Publication date Apr 29, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Il Kwon Shim
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Ground plane for exposed package
- Publication number 20040070055
- Publication date Apr 15, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe for die stacking applications and related die stacking co...
- Publication number 20040061202
- Publication date Apr 1, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Test coupon pattern design to control multilayer saw singulated pla...
- Publication number 20040036068
- Publication date Feb 26, 2004
- ST ASSEMBLY TEST SERVICES PTE LTD
- Jian-Jun Li
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SMALL PITCH TORCH BUMP FOR MOUNTING HIGH-PERFORMANCE FLIP-CHIP
- Publication number 20030219966
- Publication date Nov 27, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Yong Gang Jin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PBGA substrate for anchoring heat sink
- Publication number 20030216024
- Publication date Nov 20, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader interconnect methodology for thermally enhanced PBGA...
- Publication number 20030197195
- Publication date Oct 23, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUND PLANE FOR EXPOSED PACKAGE
- Publication number 20030160309
- Publication date Aug 28, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Jeffrey D. Punzalan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single unit automated assembly of flex enhanced ball grid array pac...
- Publication number 20030151148
- Publication date Aug 14, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-package conversion kit for a pick and place handler
- Publication number 20030140475
- Publication date Jul 31, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Sum Kai Wah
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat spreader anchoring & grounding method & thermally enhanced PBG...
- Publication number 20030138994
- Publication date Jul 24, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PBGA substrate for anchoring heat sink
- Publication number 20030057545
- Publication date Mar 27, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- IL Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PBGA singulated substrate for model melamine cleaning
- Publication number 20030024548
- Publication date Feb 6, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Loreto Ycong Cantillep
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Semi-automated probe bender
- Publication number 20030015013
- Publication date Jan 23, 2003
- ST ASSEMBLY TEST SERVICES PTE LTD
- Chong Meng Lee
- G01 - MEASURING TESTING
Information Patent Application
Super thin/super thermal ball grid array package
- Publication number 20020180040
- Publication date Dec 5, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Raymundo M. Camenforte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Enhanced BGA grounded heatsink
- Publication number 20020163064
- Publication date Nov 7, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Weddie Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Robust universal docking system
- Publication number 20020145438
- Publication date Oct 10, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Ramamoorthi Ramesh
- G01 - MEASURING TESTING
Information Patent Application
Testing of BGA and other CSP packages using probing techniques
- Publication number 20020125909
- Publication date Sep 12, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Application
Testing of BGA and other CSP packages using probing techniques
- Publication number 20020125908
- Publication date Sep 12, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Rajiv Mehta
- G01 - MEASURING TESTING
Information Patent Application
Process carrier for flexible substrates
- Publication number 20020093080
- Publication date Jul 18, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Yuen Yew Kay
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat spreader hole pin 1 identifier
- Publication number 20020093095
- Publication date Jul 18, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Weddie Pacio Aquien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Disposable mold runner gate for substrate based electronic packages
- Publication number 20020056893
- Publication date May 16, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Molded stiffener for flexible circuit molding
- Publication number 20020056570
- Publication date May 16, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- John Briar
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Boat and assembly method for ball grid array packages
- Publication number 20020041024
- Publication date Apr 11, 2002
- ST ASSEMBLY TEST SERVICES PTE LTD
- Loreto Yeong Cantillep
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip thermally enhanced ball grid array
- Publication number 20010026955
- Publication date Oct 4, 2001
- ST ASSEMBLY TEST SERVICES PTE LTD
- John Briar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extended lead package
- Publication number 20010002320
- Publication date May 31, 2001
- ST ASSEMBLY TEST SERVICES PTE LTD
- Tonglong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

ST ASSEMBLY TEST SERVICES PTE LTD

Organization

Patents Grantslast 30 patents

Semiconductor package with heat sink

Flip chip molded/exposed die process and package structure

Multi-package conversion kit for a pick and place handler

Ground plane for exposed package

Heat spreader anchoring and grounding method and thermally enhanced...

Leadframe for die stacking applications and related die stacking co...

PBGA singulated substrate for model melamine cleaning

Enhanced BGA grounded heatsink

Mold cap anchoring method for molded flex BGA packages

Heat spreader interconnect for thermally enhanced PBGA packages

Cost effective substrate fabrication for flip-chip packages

Testing of BGA and other CSP packages using probing techniques

Test coupon pattern design to control multilayer saw singulated pla...

Method of forming a small pitch torch bump for mounting high-perfor...

Multi-package conversion kit for a pick and place handler

Enhanced chip scale package for wire bond dies

Heat spreader interconnect methodology for thermally enhanced PBGA...

Flip chip molded/exposed die process and package structure

Methods of forming drop-in heat spreader plastic ball grid array (P...

Velcro strapping for semiconductor carrying trays

Heat spreader hole pin 1 identifier

Testing of BGA and other CSP packages using probing techniques

High volume fluid head

Die paddle enhancement for exposed pad in semiconductor packaging

Disposable mold runner gate for substrate based electronic packages

Boat and assembly method for ball grid array packages

Method of molding flexible circuit with molded stiffener

Zig-zagged plating bus lines

Reliable method and apparatus for interfacing between a ball grid a...

Multi air-knife box and method of use

Patents Applicationslast 30 patents

Torch Bump

Multi-package conversion kit for a pick and place handler

Mold cap anchoring method for molded flex BGA packages

Cost effective substrate fabrication for flip-chip packages

Ground plane for exposed package

Leadframe for die stacking applications and related die stacking co...

Test coupon pattern design to control multilayer saw singulated pla...

SMALL PITCH TORCH BUMP FOR MOUNTING HIGH-PERFORMANCE FLIP-CHIP

PBGA substrate for anchoring heat sink

Heat spreader interconnect methodology for thermally enhanced PBGA...

GROUND PLANE FOR EXPOSED PACKAGE

Single unit automated assembly of flex enhanced ball grid array pac...

Multi-package conversion kit for a pick and place handler

Heat spreader anchoring & grounding method & thermally enhanced PBG...

PBGA substrate for anchoring heat sink

PBGA singulated substrate for model melamine cleaning

Semi-automated probe bender

Super thin/super thermal ball grid array package

Enhanced BGA grounded heatsink

Robust universal docking system

Testing of BGA and other CSP packages using probing techniques

Testing of BGA and other CSP packages using probing techniques

Process carrier for flexible substrates

Heat spreader hole pin 1 identifier

Disposable mold runner gate for substrate based electronic packages

Molded stiffener for flexible circuit molding

Boat and assembly method for ball grid array packages

Flip chip thermally enhanced ball grid array

Extended lead package