STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.

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Chungcheongnam-do, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing wafer level packaging including through enc...
- Patent number 9,905,551
- Issue date Feb 27, 2018
- STS Semiconductor & Telecommunications Co., Ltd.
- Eun Dong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level fan-out package and method for manufacturing the same
- Patent number 9,905,436
- Issue date Feb 27, 2018
- STS Semiconductor & Telecommunications Co., Ltd.
- You Jin Oh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing wafer-level fan-out package
- Patent number 9,466,586
- Issue date Oct 11, 2016
- STS Semiconductor & Telecommunications Co., Ltd.
- Jai Kyoung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out wafer level package and manufacturing method thereof
- Patent number 9,449,911
- Issue date Sep 20, 2016
- STS Semiconductor & Telecommunications Co., Ltd.
- Hee Cheol Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing stacked package
- Patent number 9,349,667
- Issue date May 24, 2016
- STS Semiconductor & Telecommunications Co., Ltd.
- Jae Bok Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package comprising an interposer and method of manufa...
- Patent number 9,024,452
- Issue date May 5, 2015
- STS Semiconductor & Telecommunications Co., Ltd.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 8,952,514
- Issue date Feb 10, 2015
- STS Semiconductor & Telecommunications Co., Ltd.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method for manufacturing the same
- Patent number 8,941,225
- Issue date Jan 27, 2015
- STS Semiconductor & Telecommunications Co., Ltd.
- Daesik Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level package and method of manufacturing the same
- Patent number 8,912,662
- Issue date Dec 16, 2014
- STS Semiconductor & Telecommunications Co., Ltd.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package having no chip pad
- Patent number 8,802,498
- Issue date Aug 12, 2014
- STS Semiconductor & Telecommunications Co., Ltd.
- Jong Myoung Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing high-capacity semiconductor package
- Patent number 8,785,254
- Issue date Jul 22, 2014
- STS Semiconductor & Telecommunications Co., Ltd.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 8,742,551
- Issue date Jun 3, 2014
- STS Semiconductor & Telecommunications Co., Ltd.
- Min Suh Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor package for wide lead fra...
- Patent number 8,424,195
- Issue date Apr 23, 2013
- STS Semiconductor & Telecommunications Co., Ltd.
- Sun Ha Hwang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of dicing wafer using plasma
- Patent number 8,222,120
- Issue date Jul 17, 2012
- STS Semiconductor & Telecommunications Co., Ltd.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer through silicon via forming method and equipment therefor
- Patent number 8,202,744
- Issue date Jun 19, 2012
- STS Semiconductor & Telecommunications Co., Ltd.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for manufacturing semiconductor package for wide lead fra...
- Patent number 7,934,632
- Issue date May 3, 2011
- STS Semiconductor & Telecommunications Co., Ltd.
- Sun Ha Hwang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

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Patents Applicationslast 30 patents

Information Patent Application
WAFER LEVEL FAN-OUT PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20170092510
- Publication date Mar 30, 2017
- STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
- You Jin OH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING VOICE COIL
- Publication number 20170047831
- Publication date Feb 16, 2017
- STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
- Jai Kyoung CHOI
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING WAFER LEVEL PACKAGE
- Publication number 20160365324
- Publication date Dec 15, 2016
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Eun Dong KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING VOICE COIL
- Publication number 20160365195
- Publication date Dec 15, 2016
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Jai Kyoung CHOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLUSTER TYPE SEMICONDUCTOR PROCESSING APPARATUS AND METHOD FOR MANU...
- Publication number 20150243535
- Publication date Aug 27, 2015
- STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
- Eun Soo LEE
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MANUFACTURING STACKED PACKAGE
- Publication number 20150228507
- Publication date Aug 13, 2015
- STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
- Jae Bok YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE
- Publication number 20140097530
- Publication date Apr 10, 2014
- STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
- Kyung Teck BOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING HIGH-CAPACITY SEMICONDUCTOR PACKAGE
- Publication number 20130323885
- Publication date Dec 5, 2013
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130320518
- Publication date Dec 5, 2013
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Jung Hwan Chun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD OF SEMICONDUCTOR PACKAGE FOR DECREASING NOISE...
- Publication number 20130319731
- Publication date Dec 5, 2013
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Yun Im Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING NO CHIP PAD
- Publication number 20130316496
- Publication date Nov 28, 2013
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Jong Myoung Son
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20130285222
- Publication date Oct 31, 2013
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Min Suh Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK-TYPE SOLID-STATE DRIVE
- Publication number 20110089553
- Publication date Apr 21, 2011
- STS SEMICONDUCTOR & TELECOMMUNICATIONS CO., LTD.
- Tae Hyun KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Manufacturing Semiconductor Package for Wide Lead Fra...
- Publication number 20090269889
- Publication date Oct 29, 2009
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Sun Ha HWANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus for Manufacturing Semiconductor Package for Wide Lead Fra...
- Publication number 20090269887
- Publication date Oct 29, 2009
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Sun Ha HWANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
USB storage device including USB plug with top and bottom terminals
- Publication number 20050079738
- Publication date Apr 14, 2005
- STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.
- Hyoung-Jun Ahn
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

STS SEMICONDUCTOR AND TELECOMMUNICATIONS CO., LTD.

Organization

Patents Grantslast 30 patents

Method of manufacturing wafer level packaging including through enc...

Wafer level fan-out package and method for manufacturing the same

Method for manufacturing wafer-level fan-out package

Fan-out wafer level package and manufacturing method thereof

Method of manufacturing stacked package

Semiconductor package comprising an interposer and method of manufa...

Semiconductor package

Integrated circuit package and method for manufacturing the same

Wafer-level package and method of manufacturing the same

Method of manufacturing semiconductor package having no chip pad

Method of manufacturing high-capacity semiconductor package

Semiconductor package and method of manufacturing the same

Apparatus for manufacturing semiconductor package for wide lead fra...

Method of dicing wafer using plasma

Wafer through silicon via forming method and equipment therefor

Apparatus for manufacturing semiconductor package for wide lead fra...

Patents Applicationslast 30 patents

WAFER LEVEL FAN-OUT PACKAGE AND METHOD FOR MANUFACTURING THE SAME

METHOD OF MANUFACTURING VOICE COIL

METHOD OF MANUFACTURING WAFER LEVEL PACKAGE

METHOD FOR MANUFACTURING VOICE COIL

CLUSTER TYPE SEMICONDUCTOR PROCESSING APPARATUS AND METHOD FOR MANU...

METHOD OF MANUFACTURING STACKED PACKAGE

INTEGRATED CIRCUIT PACKAGE

METHOD OF MANUFACTURING HIGH-CAPACITY SEMICONDUCTOR PACKAGE

WAFER-LEVEL PACKAGE AND METHOD OF MANUFACTURING THE SAME

PRINTED CIRCUIT BOARD OF SEMICONDUCTOR PACKAGE FOR DECREASING NOISE...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE HAVING NO CHIP PAD

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

STACK-TYPE SOLID-STATE DRIVE

Apparatus for Manufacturing Semiconductor Package for Wide Lead Fra...

Apparatus for Manufacturing Semiconductor Package for Wide Lead Fra...

USB storage device including USB plug with top and bottom terminals