SUBTRON TECHNOLOGY CO., LTD.

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HSINCHU, TW

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Patents Grantslast 30 patents

Information Patent Grant
Waveguide structure
- Patent number 11,764,451
- Issue date Sep 19, 2023
- Subtron Technology Co., Ltd.
- Jenn-Hwan Tarng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation substrate and manufacturing method thereof
- Patent number 11,171,072
- Issue date Nov 9, 2021
- Subtron Technology Co., Ltd.
- Chien-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipation substrate and fabricating method thereof
- Patent number 10,957,614
- Issue date Mar 23, 2021
- Subtron Technology Co., Ltd.
- Chien-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a component embedded package carrier
- Patent number 10,798,822
- Issue date Oct 6, 2020
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier
- Patent number 10,319,610
- Issue date Jun 11, 2019
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package carrier
- Patent number 10,297,517
- Issue date May 21, 2019
- Subtron Technology Co., Ltd.
- Chih-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package carrier
- Patent number 10,177,067
- Issue date Jan 8, 2019
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method thereof
- Patent number 10,123,413
- Issue date Nov 6, 2018
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit substrate
- Patent number 9,961,784
- Issue date May 1, 2018
- Subtron Technology Co., Ltd.
- Tzu-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Illumination apparatus
- Patent number 9,933,149
- Issue date Apr 3, 2018
- Subtron Technology Co., Ltd.
- Tzyy-Jang Tseng
- F21 - LIGHTING
Information Patent Grant
Manufacturing method for multi-layer circuit board having cavity
- Patent number 9,883,599
- Issue date Jan 30, 2018
- Subtron Technology Co., Ltd.
- Chien-Hung Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure for packaging chip
- Patent number 9,883,594
- Issue date Jan 30, 2018
- Subtron Technology Co., Ltd.
- Yu-Chi Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,870,931
- Issue date Jan 16, 2018
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure
- Patent number 9,761,515
- Issue date Sep 12, 2017
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and manufacturing method thereof
- Patent number 9,693,468
- Issue date Jun 27, 2017
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,668,351
- Issue date May 30, 2017
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of circuit substrate
- Patent number 9,655,254
- Issue date May 16, 2017
- Subtron Technology Co. Ltd.
- Tzu-Wei Huang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate structure and manufacturing method thereof
- Patent number 9,648,760
- Issue date May 9, 2017
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing method of circuit substrate
- Patent number 9,603,263
- Issue date Mar 21, 2017
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and manufacturing method thereof
- Patent number 9,591,753
- Issue date Mar 7, 2017
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,589,942
- Issue date Mar 7, 2017
- Subtron Technology Co., Ltd.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,578,750
- Issue date Feb 21, 2017
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and manufacturing method thereof
- Patent number 9,538,647
- Issue date Jan 3, 2017
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure
- Patent number 9,532,494
- Issue date Dec 27, 2016
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier
- Patent number 9,510,453
- Issue date Nov 29, 2016
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of cover structure
- Patent number 9,491,894
- Issue date Nov 8, 2016
- Subtron Technology Co., Ltd.
- Chien-Ming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package substrate and manufacturing method thereof
- Patent number 9,458,540
- Issue date Oct 4, 2016
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Package carrier
- Patent number 9,433,099
- Issue date Aug 30, 2016
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,418,931
- Issue date Aug 16, 2016
- Subtron Technology Co., Ltd.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package carrier and manufacturing method thereof
- Patent number 9,330,941
- Issue date May 3, 2016
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20230422411
- Publication date Dec 28, 2023
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION SUBSTRATE
- Publication number 20230403826
- Publication date Dec 14, 2023
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER AND PACKAGE STRUCTURE
- Publication number 20230068160
- Publication date Mar 2, 2023
- Subtron Technology Co., Ltd.
- Shaw-Wen Lao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20220157674
- Publication date May 19, 2022
- Subtron Technology Co., Ltd.
- Chung Ying Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAVEGUIDE STRUCTURE
- Publication number 20210384618
- Publication date Dec 9, 2021
- Subtron Technology Co., Ltd.
- Jenn-Hwan Tarng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL WAVEGUIDE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20210096298
- Publication date Apr 1, 2021
- Subtron Technology Co., Ltd.
- Pei-Wei Wang
- G02 - OPTICS
Information Patent Application
HEAT DISSIPATION SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20210050276
- Publication date Feb 18, 2021
- Subtron Technology Co., Ltd.
- Chien-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATION SUBSTRATE AND FABRICATING METHOD THEREOF
- Publication number 20200303271
- Publication date Sep 24, 2020
- Subtron Technology Co., Ltd.
- Chien-Hung Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20180352658
- Publication date Dec 6, 2018
- Subtron Technology Co., Ltd.
- Jing-Cyuan Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20180114739
- Publication date Apr 26, 2018
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CARRIER
- Publication number 20180090339
- Publication date Mar 29, 2018
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE CARRIER
- Publication number 20180025956
- Publication date Jan 25, 2018
- Subtron Technology Co., Ltd.
- Chih-Hsien Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
- Publication number 20170325330
- Publication date Nov 9, 2017
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20170311450
- Publication date Oct 26, 2017
- Subtron Technology Co., Ltd.
- Yu-Chi Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20170251552
- Publication date Aug 31, 2017
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE
- Publication number 20170207156
- Publication date Jul 20, 2017
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CIRCUIT SUBSTRATE
- Publication number 20170208696
- Publication date Jul 20, 2017
- Subtron Technology Co., Ltd.
- Tzu-Wei Huang
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20170086293
- Publication date Mar 23, 2017
- Subtron Technology Co., Ltd.
- Chih-Hsien Cheng
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20170079128
- Publication date Mar 16, 2017
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20170013710
- Publication date Jan 12, 2017
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20170006713
- Publication date Jan 5, 2017
- Subtron Technology Co., Ltd.
- Chih-Hong Chuang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION PLATE AND PACKAGE STRUCTURE
- Publication number 20160282055
- Publication date Sep 29, 2016
- Subtron Technology Co., Ltd.
- Ching-Sheng Chen
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF
- Publication number 20160230286
- Publication date Aug 11, 2016
- Subtron Technology Co., Ltd.
- Chin-Sheng Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF
- Publication number 20160204054
- Publication date Jul 14, 2016
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- B32 - LAYERED PRODUCTS
Information Patent Application
PACKAGE CARRIER
- Publication number 20160197034
- Publication date Jul 7, 2016
- Subtron Technology Co., Ltd.
- Shih-Hao Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160174390
- Publication date Jun 16, 2016
- Subtron Technology Co., Ltd.
- Chao-Min Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160163614
- Publication date Jun 9, 2016
- Subtron Technology Co., Ltd.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20160155702
- Publication date Jun 2, 2016
- Subtron Technology Co., Ltd.
- Chien-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER CIRCUIT BOARD HAVING CAVITY AND MANUFACTURING METHOD TH...
- Publication number 20160095231
- Publication date Mar 31, 2016
- Subtron Technology Co., Ltd.
- Chien-Hung Wu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATION MODULE
- Publication number 20160095256
- Publication date Mar 31, 2016
- Subtron Technology Co., Ltd.
- Ching-Sheng Chen
- F28 - HEAT EXCHANGE IN GENERAL

SUBTRON TECHNOLOGY CO., LTD.

Organization

Patents Grantslast 30 patents

Waveguide structure

Heat dissipation substrate and manufacturing method thereof

Heat dissipation substrate and fabricating method thereof

Method of manufacturing a component embedded package carrier

Package carrier

Manufacturing method of package carrier

Manufacturing method of package carrier

Package substrate and manufacturing method thereof

Manufacturing method of circuit substrate

Illumination apparatus

Manufacturing method for multi-layer circuit board having cavity

Substrate structure for packaging chip

Package carrier and manufacturing method thereof

Substrate structure

Package substrate and manufacturing method thereof

Package carrier and manufacturing method thereof

Manufacturing method of circuit substrate

Substrate structure and manufacturing method thereof

Manufacturing method of circuit substrate

Circuit board and manufacturing method thereof

Package structure and manufacturing method thereof

Package carrier and manufacturing method thereof

Substrate structure and manufacturing method thereof

Manufacturing method of package structure

Package carrier

Manufacturing method of cover structure

Package substrate and manufacturing method thereof

Package carrier

Package structure and manufacturing method thereof

Package carrier and manufacturing method thereof

Patents Applicationslast 30 patents

SUBSTRATE STRUCTURE

HEAT DISSIPATION SUBSTRATE

PACKAGE CARRIER AND PACKAGE STRUCTURE

SUBSTRATE STRUCTURE

WAVEGUIDE STRUCTURE

OPTICAL WAVEGUIDE CIRCUIT SUBSTRATE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION SUBSTRATE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION SUBSTRATE AND FABRICATING METHOD THEREOF

COMPONENT EMBEDDED PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER

MANUFACTURING METHOD OF PACKAGE CARRIER

MANUFACTURING METHOD OF CIRCUIT SUBSTRATE

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

SUBSTRATE STRUCTURE

MANUFACTURING METHOD OF CIRCUIT SUBSTRATE

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

HEAT DISSIPATION PLATE AND PACKAGE STRUCTURE

PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER AND MANUFACTURING METHOD THEREOF

PACKAGE CARRIER

SUBSTRATE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

MULTI-LAYER CIRCUIT BOARD HAVING CAVITY AND MANUFACTURING METHOD TH...

HEAT DISSIPATION MODULE

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