Sumitomo Mitsubishi Silicon Corporation

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Tokyo, JP

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Epitaxial growth susceptor
- Patent number 8,926,754
- Issue date Jan 6, 2015
- Sumitomo Mitsubishi Silicon Corporation
- Masayuki Ishibashi
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Silicon wafer and method for manufacturing the same
- Patent number 8,758,505
- Issue date Jun 24, 2014
- Sumitomo Mitsubishi Silicon Corporation
- Toshiaki Ono
- C30 - CRYSTAL GROWTH
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 8,283,252
- Issue date Oct 9, 2012
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Grant
High resistivity silicon wafers
- Patent number 8,252,404
- Issue date Aug 28, 2012
- Sumitomo Mitsubishi Silicon Corporation
- Shinsuke Sadamitsu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Double side polishing method and apparatus
- Patent number 8,002,610
- Issue date Aug 23, 2011
- Sumitomo Mitsubishi Silicon Corporation
- Akira Horiguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a SOI structure having a SiGe layer interpo...
- Patent number 7,947,572
- Issue date May 24, 2011
- Sumitomo Mitsubishi Silicon Corp.
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon single crystal wafer for particle monitor
- Patent number 7,837,791
- Issue date Nov 23, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Hiroki Murakami
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon wafer and method for manufacturing the same
- Patent number 7,824,493
- Issue date Nov 2, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Toshiaki Ono
- C30 - CRYSTAL GROWTH
Information Patent Grant
Silicon wafer and method for manufacturing the same
- Patent number 7,740,702
- Issue date Jun 22, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Yasuo Koike
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
SOI structure having a SiGe layer interposed between the silicon an...
- Patent number 7,741,193
- Issue date Jun 22, 2010
- Sumitomo Mitsubishi Silicon Corp.
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer etching method and apparatus, and impurity analysis m...
- Patent number 7,686,973
- Issue date Mar 30, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Katsuya Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique on ozone water for use in cleaning semiconductor substrate
- Patent number 7,678,200
- Issue date Mar 16, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Makoto Takemura
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Production method for silicon wafers and silicon wafer
- Patent number 7,670,965
- Issue date Mar 2, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Yoshinobu Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Double side polishing method and apparatus
- Patent number 7,648,409
- Issue date Jan 19, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Akira Horiguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,601,603
- Issue date Oct 13, 2009
- Denso Corporation
- Shoichi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor wafer
- Patent number 7,589,023
- Issue date Sep 15, 2009
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Manufacturing method of silicon wafer
- Patent number 7,563,319
- Issue date Jul 21, 2009
- Sumitomo Mitsubishi Silicon Corporation
- Shigeru Umeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing silicon wafer and silicon wafer
- Patent number 7,521,381
- Issue date Apr 21, 2009
- Sumitomo Mitsubishi Silicon Corporation
- Yoshinobu Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of polishing semiconductor wafers by using double-sided poli...
- Patent number 7,470,169
- Issue date Dec 30, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Toru Taniguchi
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for manufacturing silicon single crystal, method for manu...
- Patent number 7,470,326
- Issue date Dec 30, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Youji Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for producing a silicon wafer
- Patent number 7,456,106
- Issue date Nov 25, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Sakae Koyata
- B24 - GRINDING POLISHING
Information Patent Grant
Heat treatment jig for semiconductor silicon substrate
- Patent number 7,442,038
- Issue date Oct 28, 2008
- Sumitomo Mitsubishi Silicaon Corporation
- Naoshi Adachi
- F27 - FURNACES KILNS OVENS RETORTS
Information Patent Grant
High resistance silicon wafer and its manufacturing method
- Patent number 7,397,110
- Issue date Jul 8, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Nobumitsu Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminated substrate, method of manufacturing the substrate, and waf...
- Patent number 7,378,332
- Issue date May 27, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Shinichi Tomita
- B24 - GRINDING POLISHING
Information Patent Grant
Apparatus for manufacturing silicon single crystal, method for manu...
- Patent number 7,368,011
- Issue date May 6, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Youji Suzuki
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for manufacturing silicon-on-insulator wafer
- Patent number 7,329,589
- Issue date Feb 12, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Toru Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat treatment jig for semiconductor substrate
- Patent number 7,329,947
- Issue date Feb 12, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Naoshi Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat shielding member of silicon single crystal pulling system
- Patent number 7,294,203
- Issue date Nov 13, 2007
- Sumitomo Mitsubishi Silicon Corporation
- Kazuhiro Harada
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Epitaxial wafer and method for manufacturing method
- Patent number 7,288,791
- Issue date Oct 30, 2007
- Sumitomo Mitsubishi Silicon Corporation
- Shigeru Umeno
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon annealed wafer and silicon epitaxial wafer
- Patent number 7,273,647
- Issue date Sep 25, 2007
- Sumitomo Mitsubishi Silicon Corporation
- Hideshi Nishikawa
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING A SOI STRUCTURE HAVING A SIGE LAYER INTERPO...
- Publication number 20100221877
- Publication date Sep 2, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20100178753
- Publication date Jul 15, 2010
- Sumitomo Mitsubishi Silicon Corporation
- Toshiaki Ono
- C30 - CRYSTAL GROWTH
Information Patent Application
SILICON WAFER ETCHING METHOD AND APPARATUS, AND IMPURITY ANALYSIS M...
- Publication number 20080047934
- Publication date Feb 28, 2008
- Sumitomo Mitsubishi Silicon Corporation
- Katsuya Hirano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for manufacturing silicon single crystal, method for manu...
- Publication number 20070261632
- Publication date Nov 15, 2007
- Sumitomo Mitsubishi Silicon Corporation
- Youji Suzuki
- C30 - CRYSTAL GROWTH
Information Patent Application
HEAT TREATMENT JIG FOR SEMICONDUCTOR SILICON SUBSTRATE
- Publication number 20070087299
- Publication date Apr 19, 2007
- Sumitomo Mitsubishi Silicon Corporation
- Naoshi Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for inspection, proces for making analytic piece, method for...
- Publication number 20060249479
- Publication date Nov 9, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Akira Okubo
- G01 - MEASURING TESTING
Information Patent Application
Slurry composition for chemical mechanical polishing, method for pl...
- Publication number 20060246723
- Publication date Nov 2, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Jea Gun Park
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SOI structure having a sige layer interposed between the silicon an...
- Publication number 20060063356
- Publication date Mar 23, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon wafer production process and silicon wafer
- Publication number 20060027159
- Publication date Feb 9, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Takashi Shibayama
- C30 - CRYSTAL GROWTH
Information Patent Application
Method for producing semiconductor substrate and method for fabrica...
- Publication number 20060022200
- Publication date Feb 2, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Ichiro Shiono
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon wafer and method for manufacturing the same
- Publication number 20060016385
- Publication date Jan 26, 2006
- Sumitomo Mitsubishi Silicon Corporation
- Toshiaki Ono
- C30 - CRYSTAL GROWTH
Information Patent Application
Method for evaluating semiconductor substrate
- Publication number 20050260861
- Publication date Nov 24, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Toru Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon single crystal and method for growing silicon single crystal
- Publication number 20050252442
- Publication date Nov 17, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Koji Kato
- C30 - CRYSTAL GROWTH
Information Patent Application
High resistance silicon wafer and method for production thereof
- Publication number 20050253221
- Publication date Nov 17, 2005
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Nobumitsu Takase
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
High-resistance silicon wafer and process for producing the same
- Publication number 20050250349
- Publication date Nov 10, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Shinsuke Sadamitsu
- C30 - CRYSTAL GROWTH
Information Patent Application
SOI structure having a sige layer interposed between the silicon an...
- Publication number 20050242396
- Publication date Nov 3, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing silicon-on insulator wafer
- Publication number 20050227462
- Publication date Oct 13, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Yoshio Murakami
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20050221547
- Publication date Oct 6, 2005
- DENSO Corporation
- Shoichi Yamauchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for analyzing impurities
- Publication number 20050208674
- Publication date Sep 22, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Kaori Tokushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat treatment jig for semiconductor silicon substrate
- Publication number 20050170307
- Publication date Aug 4, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Naoshi Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Double-side polishing method and apparatus
- Publication number 20050159089
- Publication date Jul 21, 2005
- Kashiwara Machine Mfg. Co., Ltd.
- Akira Horiguchi
- B24 - GRINDING POLISHING
Information Patent Application
Process for producing silicon single crystal layer and silicon sing...
- Publication number 20050153550
- Publication date Jul 14, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Takashi Shibayama
- C30 - CRYSTAL GROWTH
Information Patent Application
Production method for silicon wafers and silicon wafer
- Publication number 20050130452
- Publication date Jun 16, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Yoshinobu Nakada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pasted soi substrate, process for producing the same and semiconduc...
- Publication number 20050081958
- Publication date Apr 21, 2005
- Sumitomo Mitsubishi Silicon Corporation
- Naoshi Adachi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Damper system for transportation
- Publication number 20050016896
- Publication date Jan 27, 2005
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Tomohiro Horio
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Method for measuring thickness of thin film-like material during su...
- Publication number 20040263868
- Publication date Dec 30, 2004
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Yoshito Isei
- B24 - GRINDING POLISHING
Information Patent Application
Device and method for measuring position of liquid surface of melt...
- Publication number 20040221794
- Publication date Nov 11, 2004
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Keiichi Takanashi
- C30 - CRYSTAL GROWTH
Information Patent Application
Silicon wafer and manufacturing method thereof
- Publication number 20040207048
- Publication date Oct 21, 2004
- Sumitomo Mitsubishi Silicon Corporation
- Takaaki Shiota
- C30 - CRYSTAL GROWTH
Information Patent Application
SOI structure having a SiGe Layer interposed between the silicon an...
- Publication number 20030230778
- Publication date Dec 18, 2003
- Sumitomo Mitsubishi Silicon Corporation
- Jeagun Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for inspecting defects
- Publication number 20030227620
- Publication date Dec 11, 2003
- SUMITOMO MITSUBISHI SILICON CORPORATION
- Hirokazu Yokoyama
- G01 - MEASURING TESTING

Trademarklast 30 trademarks

Information Trademark
79011180 - CLESTA
- Serial number 79011180
- Registration number 3127115
- Filing date Dec 28, 2004
- SUMITOMO MITSUBISHI SILICON CORPORATION
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76514121 - SUMCO
- Serial number 76514121
- Registration number 2880968
- Filing date May 14, 2003
- Sumitomo Mitsubishi Silicon Corporation
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76312913 - SUMCO
- Serial number 76312913
- Registration number 2992782
- Filing date Sep 17, 2001
- SILICON UNITED MANUFACTURING CORP.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

Sumitomo Mitsubishi Silicon Corporation

Organization

Patents Grantslast 30 patents

Epitaxial growth susceptor

Silicon wafer and method for manufacturing the same

Method of manufacturing semiconductor wafer

High resistivity silicon wafers

Double side polishing method and apparatus

Method of manufacturing a SOI structure having a SiGe layer interpo...

Silicon single crystal wafer for particle monitor

Silicon wafer and method for manufacturing the same

Silicon wafer and method for manufacturing the same

SOI structure having a SiGe layer interposed between the silicon an...

Silicon wafer etching method and apparatus, and impurity analysis m...

Technique on ozone water for use in cleaning semiconductor substrate

Production method for silicon wafers and silicon wafer

Double side polishing method and apparatus

Method for manufacturing semiconductor device

Method of manufacturing semiconductor wafer

Manufacturing method of silicon wafer

Method for producing silicon wafer and silicon wafer

Method of polishing semiconductor wafers by using double-sided poli...

Apparatus for manufacturing silicon single crystal, method for manu...

Method for producing a silicon wafer

Heat treatment jig for semiconductor silicon substrate

High resistance silicon wafer and its manufacturing method

Laminated substrate, method of manufacturing the substrate, and waf...

Apparatus for manufacturing silicon single crystal, method for manu...

Method for manufacturing silicon-on-insulator wafer

Heat treatment jig for semiconductor substrate

Heat shielding member of silicon single crystal pulling system

Epitaxial wafer and method for manufacturing method

Silicon annealed wafer and silicon epitaxial wafer

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING A SOI STRUCTURE HAVING A SIGE LAYER INTERPO...

SILICON WAFER AND METHOD FOR MANUFACTURING THE SAME

SILICON WAFER ETCHING METHOD AND APPARATUS, AND IMPURITY ANALYSIS M...

Apparatus for manufacturing silicon single crystal, method for manu...

HEAT TREATMENT JIG FOR SEMICONDUCTOR SILICON SUBSTRATE

Method for inspection, proces for making analytic piece, method for...

Slurry composition for chemical mechanical polishing, method for pl...

SOI structure having a sige layer interposed between the silicon an...

Silicon wafer production process and silicon wafer

Method for producing semiconductor substrate and method for fabrica...

Silicon wafer and method for manufacturing the same

Method for evaluating semiconductor substrate

Silicon single crystal and method for growing silicon single crystal

High resistance silicon wafer and method for production thereof

High-resistance silicon wafer and process for producing the same

SOI structure having a sige layer interposed between the silicon an...

Method for manufacturing silicon-on insulator wafer

Method for manufacturing semiconductor device

Method for analyzing impurities

Heat treatment jig for semiconductor silicon substrate

Double-side polishing method and apparatus

Process for producing silicon single crystal layer and silicon sing...

Production method for silicon wafers and silicon wafer

Pasted soi substrate, process for producing the same and semiconduc...

Damper system for transportation

Method for measuring thickness of thin film-like material during su...

Device and method for measuring position of liquid surface of melt...

Silicon wafer and manufacturing method thereof

SOI structure having a SiGe Layer interposed between the silicon an...

Method and apparatus for inspecting defects

Trademarklast 30 trademarks

79011180 - CLESTA

76514121 - SUMCO

76312913 - SUMCO