Takatori Corporation

Organization

Nara, JP

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Patents Grantslast 30 patents

Information Patent Grant
Device and method for attaching protective tape on semiconductor wafer
- Patent number 11,935,768
- Issue date Mar 19, 2024
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Wire saw device, and processing method and processing device for wo...
- Patent number 11,504,857
- Issue date Nov 22, 2022
- TAKATORI CORPORATION
- Makoto Masuda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device and method for attaching protective tape to semiconductor wafer
- Patent number 11,469,120
- Issue date Oct 11, 2022
- DISCO HI-TEC EUROPE GMBH
- Karl Heinz Priewasser
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire saw
- Patent number 7,387,118
- Issue date Jun 17, 2008
- Takatori Corporation
- Tatsuya Komeda
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cutting method by wire saw and cut workpiece receiving member in wi...
- Patent number 7,284,548
- Issue date Oct 23, 2007
- Takatori Corporation
- Takeharu Matsuda
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Method and apparatus for processing hose material
- Patent number 5,992,712
- Issue date Nov 30, 1999
- Takatori Corporation
- Etsuo Nishikawa
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Method and apparatus for sewing panty hose with backpanel-like guss...
- Patent number 5,970,897
- Issue date Oct 26, 1999
- Takatori Corporation
- Toyonori Takamura
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Method for mounting pantyhose blanks
- Patent number 5,564,609
- Issue date Oct 15, 1996
- Takatori Corporation
- Masataka Tsuchiya
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Finishing device for stockings hose
- Patent number 5,094,371
- Issue date Mar 10, 1992
- Takatori Corporation
- Toyonori Takamura
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Apparatus for automatically positioning pantyhose materials in a pa...
- Patent number 5,058,516
- Issue date Oct 22, 1991
- Takatori Corporation
- Hiroji Maegawa
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Wire saw
- Patent number 5,052,366
- Issue date Oct 1, 1991
- Takatori Corporation
- Yasumasa Matsukura
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Grant
Automatic fitting apparatus for hose part of half made pantyhose
- Patent number 4,957,051
- Issue date Sep 18, 1990
- Takatori Corporation
- Hiroji Maegawa
- D05 - SEWING EMBROIDERING TUFTING
Information Patent Grant
Method and apparatus for applying a protective tape on a wafer and...
- Patent number 4,925,515
- Issue date May 15, 1990
- Takatori Corporation
- Yoshitaka Yoshimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for finishing pantyhose
- Patent number 4,919,315
- Issue date Apr 24, 1990
- Takatori Corporation
- Makoto Nakano
- D06 - TREATMENT OF TEXTILES OR THE LIKE LAUNDERING FLEXIBLE MATERIALS NOT OTH...
Information Patent Grant
Process for preparing methylolated hydantoins
- Patent number 4,908,456
- Issue date Mar 13, 1990
- Takatori Corporation
- Thomas E. Farina
- C07 - ORGANIC CHEMISTRY

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Patents Applicationslast 30 patents

Information Patent Application
SHEET CONNECTION DEVICE, SHEET CONNECTION METHOD, AND SHEET REPLACE...
- Publication number 20240217768
- Publication date Jul 4, 2024
- Takatori Corporation
- Yoshiaki UEDA
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...
- Publication number 20210308871
- Publication date Oct 7, 2021
- Takatori Corporation
- Makoto MASUDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ALIGNMENT DEVICE AND ALIGNMENT METHOD
- Publication number 20210249294
- Publication date Aug 12, 2021
- Disco-Hi-Tec Europe GmbH
- Karl Heinz PRIEWASSER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHOD FOR ATTACHING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER
- Publication number 20210249286
- Publication date Aug 12, 2021
- Disco-Hi-Tec Europe GmbH
- Karl Heinz PRIEWASSER
- B32 - LAYERED PRODUCTS
Information Patent Application
DEVICE AND METHOD FOR ATTACHING PROTECTIVE TAPE ON SEMICONDUCTOR WAFER
- Publication number 20210249285
- Publication date Aug 12, 2021
- Disco-Hi-Tec Europe GmbH
- Karl Heinz PRIEWASSER
- B32 - LAYERED PRODUCTS
Information Patent Application
WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...
- Publication number 20180326590
- Publication date Nov 15, 2018
- Takatori Corporation
- Makoto MASUDA
- B28 - WORKING CEMENT, CLAY, OR STONE
Information Patent Application
STOCK SOLUTION CONCENTRATING DEVICE, STOCK SOLUTION TREATMENT DEVIC...
- Publication number 20160022895
- Publication date Jan 28, 2016
- TAKATORI CORPORATION
- Toshiya OKAHISA
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE

Takatori Corporation

Organization

Patents Grantslast 30 patents

Device and method for attaching protective tape on semiconductor wafer

Wire saw device, and processing method and processing device for wo...

Device and method for attaching protective tape to semiconductor wafer

Wire saw

Cutting method by wire saw and cut workpiece receiving member in wi...

Method and apparatus for processing hose material

Method and apparatus for sewing panty hose with backpanel-like guss...

Method for mounting pantyhose blanks

Finishing device for stockings hose

Apparatus for automatically positioning pantyhose materials in a pa...

Wire saw

Automatic fitting apparatus for hose part of half made pantyhose

Method and apparatus for applying a protective tape on a wafer and...

Apparatus for finishing pantyhose

Process for preparing methylolated hydantoins

Patents Applicationslast 30 patents

SHEET CONNECTION DEVICE, SHEET CONNECTION METHOD, AND SHEET REPLACE...

WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...

ALIGNMENT DEVICE AND ALIGNMENT METHOD

DEVICE AND METHOD FOR ATTACHING PROTECTIVE TAPE TO SEMICONDUCTOR WAFER

DEVICE AND METHOD FOR ATTACHING PROTECTIVE TAPE ON SEMICONDUCTOR WAFER

WIRE SAW DEVICE, AND PROCESSING METHOD AND PROCESSING DEVICE FOR WO...

STOCK SOLUTION CONCENTRATING DEVICE, STOCK SOLUTION TREATMENT DEVIC...