Thin Film Module, Inc.

Organization

Milpitas, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Structure of a substrate for a high density semiconductor package
- Patent number 6,753,600
- Issue date Jun 22, 2004
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost decal material used for packaging
- Patent number 6,586,846
- Issue date Jul 1, 2003
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cavity down flip chip BGA
- Patent number 6,562,656
- Issue date May 13, 2003
- Thin Film Module, Inc.
- Chung W. Ho
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density cavity-up wire bond BGA
- Patent number 6,455,926
- Issue date Sep 24, 2002
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density flip chip BGA
- Patent number 6,331,447
- Issue date Dec 18, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick turn around fabrication process for packaging substrates and...
- Patent number 6,320,256
- Issue date Nov 20, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost high density thin film processing
- Patent number 6,294,477
- Issue date Sep 25, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost method of testing a cavity-up BGA substrate
- Patent number 6,291,268
- Issue date Sep 18, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low cost decal material used for packaging
- Patent number 6,287,890
- Issue date Sep 11, 2001
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
BGA package for high density cavity-up wire bond device connections...
- Patent number 6,277,672
- Issue date Aug 21, 2001
- Thin Film Module, Inc.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density wire bond BGA
- Patent number 6,242,279
- Issue date Jun 5, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density flip chip BGA
- Patent number 6,221,693
- Issue date Apr 24, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quick turn around fabrication process for packaging substrates and...
- Patent number 6,197,614
- Issue date Mar 6, 2001
- Thin Film Module, Inc.
- Chung W. Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High density cavity-up wire bond BGA
- Publication number 20010046725
- Publication date Nov 29, 2001
- THIN FILM MODULE, INC.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low cost decal material used for packaging
- Publication number 20010016370
- Publication date Aug 23, 2001
- THIN FILM MODULE, INC.
- Chung Wen Ho
- H01 - BASIC ELECTRIC ELEMENTS

Thin Film Module, Inc.

Organization

Patents Grantslast 30 patents

Structure of a substrate for a high density semiconductor package

Low cost decal material used for packaging

Cavity down flip chip BGA

High density cavity-up wire bond BGA

High density flip chip BGA

Quick turn around fabrication process for packaging substrates and...

Low cost high density thin film processing

Low cost method of testing a cavity-up BGA substrate

Low cost decal material used for packaging

BGA package for high density cavity-up wire bond device connections...

High density wire bond BGA

High density flip chip BGA

Quick turn around fabrication process for packaging substrates and...

Patents Applicationslast 30 patents

High density cavity-up wire bond BGA

Low cost decal material used for packaging

Trademarklast 30 trademarks