TONG HSING ELECTRONIC INDUSTRIES, LTD.

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Taipei, TW

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Patents Grantslast 30 patents

Information Patent Grant
Sensor package structure having solder mask frame
- Patent number 12,224,359
- Issue date Feb 11, 2025
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,224,299
- Issue date Feb 11, 2025
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly
- Patent number 12,189,152
- Issue date Jan 7, 2025
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,174,446
- Issue date Dec 24, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor package structure
- Patent number 12,177,996
- Issue date Dec 24, 2024
- Tong Hsing Electronic Industries, Ltd.
- Li-Chun Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,119,363
- Issue date Oct 15, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,113,082
- Issue date Oct 8, 2024
- Tong Hsing Electronic Industries, Ltd.
- Ya-Han Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-soldering configuration
- Patent number 12,108,517
- Issue date Oct 1, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Sensor package structure
- Patent number 12,080,659
- Issue date Sep 3, 2024
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 12,027,545
- Issue date Jul 2, 2024
- Tong Hsing Electronic Industries, Ltd.
- Jui-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having ring-shaped solder mask frame
- Patent number 11,984,516
- Issue date May 14, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure having solder mask frame
- Patent number 11,967,652
- Issue date Apr 23, 2024
- Tong Hsing Electronic Industries, Ltd.
- Fu-Chou Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-reflow configuration
- Patent number 11,792,497
- Issue date Oct 17, 2023
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Sensor package structure
- Patent number 11,776,975
- Issue date Oct 3, 2023
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing image sensing chip package structure includ...
- Patent number 11,764,240
- Issue date Sep 19, 2023
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-reflow configuration
- Patent number 11,744,010
- Issue date Aug 29, 2023
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- G02 - OPTICS
Information Patent Grant
Sensor package structure
- Patent number 11,735,562
- Issue date Aug 22, 2023
- Tong Hsing Electronic Industries, Ltd.
- Chien-Chen Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor lens assembly having non-reflow configuration
- Patent number 11,723,147
- Issue date Aug 8, 2023
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic device having a chip package module
- Patent number 11,502,020
- Issue date Nov 15, 2022
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing chip package structure including adhesive loop
- Patent number 11,411,029
- Issue date Aug 9, 2022
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for making a fingerprint sensor package module and the fing...
- Patent number 10,867,158
- Issue date Dec 15, 2020
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Fingerprint sensing device and method for producing the same
- Patent number 9,892,302
- Issue date Feb 13, 2018
- Tong Hsing Electronic Industries, Ltd.
- Chia-Shuai Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Multilayer circuit board and method for manufacturing the same
- Patent number 9,801,288
- Issue date Oct 24, 2017
- Tong Hsing Electronic Industries, Ltd.
- Chien-Cheng Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stress-reduced circuit board and method for forming the same
- Patent number 9,468,091
- Issue date Oct 11, 2016
- Tong Hsing Electronic Industries, Ltd.
- Chien-Cheng Wei
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ceramic circuit board and method of making the same
- Patent number 9,125,335
- Issue date Sep 1, 2015
- Tong Hsing Electronic Industries, Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuit board module
- Patent number 8,898,892
- Issue date Dec 2, 2014
- Tong Hsing Electronic Industries, Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making circuit board module
- Patent number 8,549,739
- Issue date Oct 8, 2013
- Tong Hsing Electronic Industries, Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaging substrate device, method for making the packaging substra...
- Patent number 8,461,614
- Issue date Jun 11, 2013
- Tong Hsing Electronic Industries, Ltd.
- Wen-Chung Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Image sensing device and packaging method thereof
- Patent number 7,811,861
- Issue date Oct 12, 2010
- Tong Hsing Electronic Industries Ltd.
- Chi-Chih Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensing device and packaging method thereof
- Patent number 7,776,640
- Issue date Aug 17, 2010
- Tong Hsing Electronic Industries Ltd.
- Cheng-Lung Chuang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20250048761
- Publication date Feb 6, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF
- Publication number 20250040275
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIEN-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...
- Publication number 20250040036
- Publication date Jan 30, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
WIRELESS TRANSISTOR OUTLINE PACKAGE STRUCTURE
- Publication number 20250029881
- Publication date Jan 23, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- HUNG-HSIANG YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...
- Publication number 20250010390
- Publication date Jan 9, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
ACTIVE METAL BRAZING SUBSTRATE MATERIAL CONTAINING ALUMINUM METAL E...
- Publication number 20250010408
- Publication date Jan 9, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIH-WEI MAO
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PRE-MOLD DIRECT BOND COPPER (DBC) SUBSTRATE AND MANUFACTURING METHO...
- Publication number 20250001730
- Publication date Jan 2, 2025
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JIA-YI WU
- B32 - LAYERED PRODUCTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240395950
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20240397633
- Publication date Nov 28, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIANG LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240371820
- Publication date Nov 7, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION
- Publication number 20240360043
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Kai-Mou CHOU
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363482
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
CERAMIC METAL COMPOSITE SUBSTRATE
- Publication number 20240363479
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- KAI-MOU CHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD
- Publication number 20240363516
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...
- Publication number 20240365473
- Publication date Oct 31, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-HSIEN LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
OPTICAL DEVICE
- Publication number 20240337779
- Publication date Oct 10, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- G02 - OPTICS
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240321810
- Publication date Sep 26, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- YU-CHIAO TSENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...
- Publication number 20240304575
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- ZZU-CHI CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CERAMIC SUBMOUNT FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...
- Publication number 20240304461
- Publication date Sep 12, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-HUNG SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20240290897
- Publication date Aug 29, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIA-SHUAI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME
- Publication number 20240284592
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHENG-YU CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER CHIP PACKAGING STRUCTURE
- Publication number 20240282727
- Publication date Aug 22, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Chung-Hsiao Lien
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...
- Publication number 20240276636
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
- Publication number 20240276650
- Publication date Aug 15, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Yu-Hsien LIAO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHIP PACKAGE STRUCTURE
- Publication number 20240234457
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- JUI-HUNG HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240234166
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20240234454
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- DONG-RU WU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME
- Publication number 20240234475
- Publication date Jul 11, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- LI-CHUN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE
- Publication number 20240204019
- Publication date Jun 20, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- CHIEN-HUNG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGING STRUCTURE
- Publication number 20240204018
- Publication date Jun 20, 2024
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- Jui-Hung Hsu
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
98261076 - TONG HSING
- Serial number 98261076
- Filing date Nov 8, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- 40 - Treatment of materials
Information Trademark
98261083 - TH
- Serial number 98261083
- Filing date Nov 8, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- 40 - Treatment of materials
Information Trademark
97798403 - EZCOB
- Serial number 97798403
- Registration number 7511001
- Filing date Feb 16, 2023
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78200641 - L2GA
- Serial number 78200641
- Registration number 2846782
- Filing date Jan 7, 2003
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76344879 - DPC
- Serial number 76344879
- Filing date Dec 4, 2001
- TONG HSING ELECTRONIC INDUSTRIES, LTD.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

TONG HSING ELECTRONIC INDUSTRIES, LTD.

Organization

Patents Grantslast 30 patents

Sensor package structure having solder mask frame

Sensor package structure

Sensor lens assembly

Sensor lens assembly having non-soldering configuration

Sensor package structure

Sensor package structure

Sensor package structure

Sensor lens assembly having non-soldering configuration

Sensor package structure

Sensor package structure

Sensor package structure having ring-shaped solder mask frame

Sensor package structure having solder mask frame

Sensor lens assembly having non-reflow configuration

Sensor package structure

Method of manufacturing image sensing chip package structure includ...

Sensor lens assembly having non-reflow configuration

Sensor package structure

Sensor lens assembly having non-reflow configuration

Electronic device having a chip package module

Image sensing chip package structure including adhesive loop

Process for making a fingerprint sensor package module and the fing...

Fingerprint sensing device and method for producing the same

Multilayer circuit board and method for manufacturing the same

Stress-reduced circuit board and method for forming the same

Ceramic circuit board and method of making the same

Method of making circuit board module

Method of making circuit board module

Packaging substrate device, method for making the packaging substra...

Image sensing device and packaging method thereof

Image sensing device and packaging method thereof

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

SENSOR PACKAGE STRUCTURE AND SENSING MODULE THEREOF

CIRCUIT BOARD STRUCTURE INCLUDING METAL MATERIALS WITH DIFFERENT TH...

WIRELESS TRANSISTOR OUTLINE PACKAGE STRUCTURE

ACTIVE METAL BRAZING SUBSTRATE MATERIAL AND METHOD FOR PRODUCING TH...

ACTIVE METAL BRAZING SUBSTRATE MATERIAL CONTAINING ALUMINUM METAL E...

PRE-MOLD DIRECT BOND COPPER (DBC) SUBSTRATE AND MANUFACTURING METHO...

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SENSOR PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

COMPOSITE CERAMIC SUBSTRATE HAVING MULTI-LAYER CONFIGURATION

CERAMIC METAL COMPOSITE SUBSTRATE

CERAMIC METAL COMPOSITE SUBSTRATE

INTELLIGENT POWER MODULE PACKAGE STRUCTURE AND HYBRID CERAMIC BOARD

METHOD FOR MANUFACTURING CONDUCTIVE CIRCUIT BOARD AND CONDUCTIVE CI...

OPTICAL DEVICE

CHIP PACKAGE STRUCTURE

BONDING STRUCTURE FOR CONNECTING A CHIP AND A METAL MATERIAL AND MA...

CERAMIC SUBMOUNT FOR SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTUR...

SENSOR PACKAGE STRUCTURE

PRINTED CIRCUIT BOARD AND METHOD FOR MAKING THE SAME

POWER CHIP PACKAGING STRUCTURE

CIRCUIT BOARD STRUCTURE WITH EMBEDDED CERAMIC SUBSTRATE AND MANUFAC...

CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE STRUCTURE

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE STRUCTURE AND METHOD FOR PRODUCING THE SAME

OPTICAL PACKAGE STRUCTURE

CHIP PACKAGING STRUCTURE

Trademarklast 30 trademarks

98261076 - TONG HSING

98261083 - TH

97798403 - EZCOB

78200641 - L2GA

76344879 - DPC