TONGFU MICROELECTRONICS CO., LTD

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NANTONG, CN

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Patents Grantslast 30 patents

Information Patent Grant
Packaging structure and fabrication method thereof
- Patent number 12,205,828
- Issue date Jan 21, 2025
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure of semiconductor chip and formation method thereof
- Patent number 12,119,308
- Issue date Oct 15, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Xiaoyong Miao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 12,074,183
- Issue date Aug 27, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package device having chip substrate with pads around...
- Patent number 11,990,398
- Issue date May 21, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,990,432
- Issue date May 21, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,948,911
- Issue date Apr 2, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging method and semiconductor package device
- Patent number 11,948,960
- Issue date Apr 2, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure
- Patent number 11,791,310
- Issue date Oct 17, 2023
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package device
- Patent number 11,670,571
- Issue date Jun 6, 2023
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure
- Patent number 11,430,706
- Issue date Aug 30, 2022
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 11,139,267
- Issue date Oct 5, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package method and semiconductor chip package de...
- Patent number 11,127,661
- Issue date Sep 21, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging structure and forming method thereof
- Patent number 10,998,289
- Issue date May 4, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package array
- Patent number 10,937,745
- Issue date Mar 2, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with improvement layer and fabrication method the...
- Patent number 10,910,343
- Issue date Feb 2, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System-level packaging structures
- Patent number 10,741,499
- Issue date Aug 11, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D system-level packaging methods and structures
- Patent number 10,515,883
- Issue date Dec 24, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan Tao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Testing probe and semiconductor testing fixture, and fabrication me...
- Patent number 10,119,993
- Issue date Nov 6, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- G01 - MEASURING TESTING
Information Patent Grant
Testing probe, semiconductor testing fixture and fabrication method...
- Patent number 10,067,162
- Issue date Sep 4, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- G01 - MEASURING TESTING
Information Patent Grant
Testing probe and semiconductor testing fixture, and fabrication me...
- Patent number 10,006,939
- Issue date Jun 26, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- G01 - MEASURING TESTING
Information Patent Grant
Fabricating method for wafer-level packaging
- Patent number 10,008,478
- Issue date Jun 26, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Wanchun Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor testing fixture and fabrication method thereof
- Patent number 10,006,943
- Issue date Jun 26, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor testing fixture and fabrication method thereof
- Patent number 10,001,509
- Issue date Jun 19, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Lei Shi
- G01 - MEASURING TESTING
Information Patent Grant
Method and structure for wafer-level packaging
- Patent number 9,922,950
- Issue date Mar 20, 2018
- TONGFU MICROELECTRONICS CO., LTD.
- Guohua Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method
- Patent number 9,761,549
- Issue date Sep 12, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for wafer-level packaging
- Patent number 9,666,550
- Issue date May 30, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Guohua Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packaging structure and method for forming the same
- Patent number 9,620,468
- Issue date Apr 11, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Chang-Ming Lin
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321854
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...
- Publication number 20240321704
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED MEMORY
- Publication number 20240321821
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF
- Publication number 20240321825
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...
- Publication number 20240321853
- Publication date Sep 26, 2024
- TONGFU MICROELECTRONICS CO., LTD.
- Maohua DU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220270982
- Publication date Aug 25, 2022
- TONGFU MICROELECTRONICS CO., LTD.
- Xiaoyong MIAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20220246446
- Publication date Aug 4, 2022
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMATION METHOD THEREOF
- Publication number 20220246540
- Publication date Aug 4, 2022
- NANTONG TONGFU MICROELECTRONICS CO., LTD
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE DEVICE
- Publication number 20210391239
- Publication date Dec 16, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING STRUCTURE
- Publication number 20210391300
- Publication date Dec 16, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210343763
- Publication date Nov 4, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210343775
- Publication date Nov 4, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210265294
- Publication date Aug 26, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210265252
- Publication date Aug 26, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE
- Publication number 20210257334
- Publication date Aug 19, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Guoqing YU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURES
- Publication number 20210233890
- Publication date Jul 29, 2021
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027857
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE AND FORMING METHOD THEREOF
- Publication number 20200027858
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20200027859
- Publication date Jan 23, 2020
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING STRUCTURE
- Publication number 20190385921
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE ARRAY
- Publication number 20190385955
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP METHOD
- Publication number 20190385974
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE METHOD AND SEMICONDUCTOR CHIP PACKAGE DE...
- Publication number 20190385938
- Publication date Dec 19, 2019
- TONGFU MICROELECTRONICS CO., LTD.
- Lei SHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING
- Publication number 20170186717
- Publication date Jun 29, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- GUOHUA GAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES
- Publication number 20170133305
- Publication date May 11, 2017
- TONGFU MICROELECTRONICS CO., LTD.
- Yujuan TAO
- H01 - BASIC ELECTRIC ELEMENTS

TONGFU MICROELECTRONICS CO., LTD

Organization

Patents Grantslast 30 patents

Packaging structure and fabrication method thereof

Packaging structure of semiconductor chip and formation method thereof

Semiconductor packaging method and semiconductor package device

Semiconductor package device having chip substrate with pads around...

Semiconductor packaging method and semiconductor package device

Semiconductor packaging method and semiconductor package device

Semiconductor packaging method and semiconductor package device

Semiconductor packaging structure

Semiconductor chip package device

Packaging structure

Packaging structure and forming method thereof

Semiconductor chip package method and semiconductor chip package de...

Packaging structure and forming method thereof

Semiconductor chip package array

Package structure with improvement layer and fabrication method the...

System-level packaging structures

3D system-level packaging methods and structures

Testing probe and semiconductor testing fixture, and fabrication me...

Testing probe, semiconductor testing fixture and fabrication method...

Testing probe and semiconductor testing fixture, and fabrication me...

Fabricating method for wafer-level packaging

Semiconductor testing fixture and fabrication method thereof

Semiconductor testing fixture and fabrication method thereof

Method and structure for wafer-level packaging

Semiconductor device and fabrication method

Method and structure for wafer-level packaging

Semiconductor packaging structure and method for forming the same

Patents Applicationslast 30 patents

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE OF STACKED CHIPS T...

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED MEMORY

FAN-OUT PACKAGING METHOD AND PACKAGING STRUCTURE THEREOF

PACKAGING METHOD AND PACKAGING STRUCTURE OF MULTI-LAYER STACKED HIG...

PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGING STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGING STRUCTURE AND FORMATION METHOD THEREOF

SEMICONDUCTOR CHIP PACKAGE DEVICE

SEMICONDUCTOR PACKAGING STRUCTURE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

SEMICONDUCTOR PACKAGING METHOD AND SEMICONDUCTOR PACKAGE DEVICE

PACKAGING STRUCTURES

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGING STRUCTURE AND FORMING METHOD THEREOF

PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

PACKAGING STRUCTURE

SEMICONDUCTOR CHIP PACKAGE ARRAY

FLIP-CHIP METHOD

SEMICONDUCTOR CHIP PACKAGE METHOD AND SEMICONDUCTOR CHIP PACKAGE DE...

METHOD AND STRUCTURE FOR WAFER-LEVEL PACKAGING

3D SYSTEM-LEVEL PACKAGING METHODS AND STRUCTURES