UNISEM (M) BERHAD

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Kuala Lumpur, MY

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Patents Grantslast 30 patents

Information Patent Grant
Lead frames with wettable flanks
- Patent number 9,966,326
- Issue date May 8, 2018
- Unisem (M) Berhad
- Maria Cristina T. Santillan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improving manufacturability of cavity packages for direc...
- Patent number 9,783,412
- Issue date Oct 10, 2017
- Unisem (M) Berhad
- Junhua Guan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port MEMS cavity package and method of manufacture thereof
- Patent number 9,337,354
- Issue date May 10, 2016
- Unisem (M) Berhad
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port MEMS cavity package and method of manufacture thereof
- Patent number 9,082,883
- Issue date Jul 14, 2015
- Unisem (M) Berhad
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port MEMS cavity package and method of manufacture thereof
- Patent number 8,999,757
- Issue date Apr 7, 2015
- Unisem (M) Berhad
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package
- Patent number 7,544,541
- Issue date Jun 9, 2009
- Unisem (M) Berhad
- Andrew Wye Choong Low
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BASED FAN-OUT WAFER LEVEL PACKAGING
- Publication number 20190259731
- Publication date Aug 22, 2019
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDING FOR DISCRETE INTEGRATED CIRCUIT PACKAGES
- Publication number 20190181095
- Publication date Jun 13, 2019
- Unisem (M) Berhad
- Kwai Hong Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Based Fan-Out Wafer Level Packaging
- Publication number 20180130769
- Publication date May 10, 2018
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Based Fan-Out Wafer Level Packaging
- Publication number 20180130720
- Publication date May 10, 2018
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate Based Fan-Out Wafer Level Packaging
- Publication number 20180130768
- Publication date May 10, 2018
- UNISEM (M) BERHAD
- Kim Heng Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead Frames With Wettable Flanks
- Publication number 20160276251
- Publication date Sep 22, 2016
- UNISEM (M) BERHAD
- Maria Cristina T. Santillan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Manufacturability of Cavity Packages for Direc...
- Publication number 20160221821
- Publication date Aug 4, 2016
- UNISEM (M) BERHAD
- Junhua Guan
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Top Port MEMS Cavity Package and Method of Manufacture Thereof
- Publication number 20150315014
- Publication date Nov 5, 2015
- UNISEM (M) BERHAD
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Top Port MEMS Cavity Package and Method of Manufacture Thereof
- Publication number 20140246739
- Publication date Sep 4, 2014
- UNISEM (M) BERHAD
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Top Port MEMS Cavity Package and Method of Manufacture Thereof
- Publication number 20140246738
- Publication date Sep 4, 2014
- UNISEM (M) BERHAD
- Rob Protheroe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor package
- Publication number 20080237857
- Publication date Oct 2, 2008
- Unisem (M) Berhad
- Andrew Wye Choong Low
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
77364226 - UNISEM
- Serial number 77364226
- Registration number 3571478
- Filing date Jan 4, 2008
- Unisem (M) Berhad
- 35 - Advertising

UNISEM (M) BERHAD

Organization

Patents Grantslast 30 patents

Lead frames with wettable flanks

Method for improving manufacturability of cavity packages for direc...

Top port MEMS cavity package and method of manufacture thereof

Top port MEMS cavity package and method of manufacture thereof

Top port MEMS cavity package and method of manufacture thereof

Semiconductor package

Patents Applicationslast 30 patents

SUBSTRATE BASED FAN-OUT WAFER LEVEL PACKAGING

EMI SHIELDING FOR DISCRETE INTEGRATED CIRCUIT PACKAGES

Substrate Based Fan-Out Wafer Level Packaging

Substrate Based Fan-Out Wafer Level Packaging

Substrate Based Fan-Out Wafer Level Packaging

Lead Frames With Wettable Flanks

Method for Improving Manufacturability of Cavity Packages for Direc...

Top Port MEMS Cavity Package and Method of Manufacture Thereof

Top Port MEMS Cavity Package and Method of Manufacture Thereof

Top Port MEMS Cavity Package and Method of Manufacture Thereof

Semiconductor package

Trademarklast 30 trademarks

77364226 - UNISEM