Unisem (Mauritius) Holdings Limited

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Port Louis, MU

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Patents Grantslast 30 patents

Information Patent Grant
Lead frame routed chip pads for semiconductor packages
- Patent number 8,304,864
- Issue date Nov 6, 2012
- Unisem (Mauritius) Holdings Limited
- Romarico Santos San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 8,236,612
- Issue date Aug 7, 2012
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RF shielding for a singulated laminate semiconductor device package
- Patent number 8,084,300
- Issue date Dec 27, 2011
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible leadless package and methods of making and using same
- Patent number 8,058,104
- Issue date Nov 15, 2011
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having exposed integrated circuit device
- Patent number 8,053,869
- Issue date Nov 8, 2011
- Unisem (Mauritius) Holdings Limited
- Michael H. McKerreghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless semiconductor package and method of manufacture
- Patent number 7,943,431
- Issue date May 17, 2011
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame routed chip pads for semiconductor packages
- Patent number 7,820,480
- Issue date Oct 26, 2010
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making QFN package with power and ground rings
- Patent number 7,816,186
- Issue date Oct 19, 2010
- Unisem (Mauritius) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,799,611
- Issue date Sep 21, 2010
- Unisem (Mauritius) Holdings Limited
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame routed chip pads for semiconductor packages
- Patent number 7,795,710
- Issue date Sep 14, 2010
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,790,500
- Issue date Sep 7, 2010
- Unisem (Mauritius) Holdings Limited
- Mary Jean Ramos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making thermally enhanced substrate-base package
- Patent number 7,741,158
- Issue date Jun 22, 2010
- Unisem (Mauritius) Holdings Limited
- Timothy Leung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reversible leadless package and methods of making and using same
- Patent number 7,709,935
- Issue date May 4, 2010
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making flip-chip package with underfill
- Patent number 7,700,414
- Issue date Apr 20, 2010
- Unisem (Mauritius) Holdings Limited
- Romarico Santos San Antonio
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Partially patterned lead frames and methods of making and using the...
- Patent number 7,622,332
- Issue date Nov 24, 2009
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and method for manufacturing same
- Patent number 7,563,648
- Issue date Jul 21, 2009
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package having exposed integrated circuit device
- Patent number 7,554,180
- Issue date Jun 30, 2009
- Unisem (Mauritius) Holdings Limited
- Michael H. McKerreghan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Taped lead frames and methods of making and using the same in semic...
- Patent number 7,439,097
- Issue date Oct 21, 2008
- Unisem (Mauritius) Holdings Limited
- Shafidul Islam
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING
- Publication number 20120126378
- Publication date May 24, 2012
- Unisem (Mauritius ) Holdings Limited
- Romarico S. San Antonio
- H01 - BASIC ELECTRIC ELEMENTS

Unisem (Mauritius) Holdings Limited

Organization

Patents Grantslast 30 patents

Lead frame routed chip pads for semiconductor packages

Partially patterned lead frames and methods of making and using the...

RF shielding for a singulated laminate semiconductor device package

Reversible leadless package and methods of making and using same

Package having exposed integrated circuit device

Leadless semiconductor package and method of manufacture

Lead frame routed chip pads for semiconductor packages

Method for making QFN package with power and ground rings

Partially patterned lead frames and methods of making and using the...

Lead frame routed chip pads for semiconductor packages

Partially patterned lead frames and methods of making and using the...

Method of making thermally enhanced substrate-base package

Reversible leadless package and methods of making and using same

Method of making flip-chip package with underfill

Partially patterned lead frames and methods of making and using the...

Semiconductor device package and method for manufacturing same

Package having exposed integrated circuit device

Taped lead frames and methods of making and using the same in semic...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE WITH ELECTROMAGNETIC SHIELDING

Trademarklast 30 trademarks