Unitive International Limited

Organization

Curacao, AN

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Electronic structures including conductive layers comprising copper...
- Patent number 8,294,269
- Issue date Oct 23, 2012
- Unitive International
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming electronic structures including conductive shunt...
- Patent number 7,879,715
- Issue date Feb 1, 2011
- Unitive International Limited
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder structures including barrier layers with nickel and/or copper
- Patent number 7,839,000
- Issue date Nov 23, 2010
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic structures including barrier layers defining lips
- Patent number 7,834,454
- Issue date Nov 16, 2010
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices including metallurgy structures for wire and sol...
- Patent number 7,665,652
- Issue date Feb 23, 2010
- Unitive International Limited
- J. Daniel Mis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder structures for out of plane connections
- Patent number 7,659,621
- Issue date Feb 9, 2010
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic devices including offset conductive bumps
- Patent number 7,579,694
- Issue date Aug 25, 2009
- Unitive International Limited
- Jong-Rong Jan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive structures including titanium-tungsten base layers
- Patent number 7,550,849
- Issue date Jun 23, 2009
- Unitive International Limited
- J. Daniels Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming lead free solder bumps
- Patent number 7,547,623
- Issue date Jun 16, 2009
- Unitive International Limited
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-Circular via holes for bumping pads and related structures
- Patent number 7,531,898
- Issue date May 12, 2009
- Unitive International Limited
- William E. Batchelor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic structures including offset substrates
- Patent number 7,495,326
- Issue date Feb 24, 2009
- Unitive International Limited
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming bumps using barrier layers as etch masks
- Patent number 7,427,557
- Issue date Sep 23, 2008
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of forming electronic structures including conductive shunt...
- Patent number 7,297,631
- Issue date Nov 20, 2007
- Unitive International Limited
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming conductive structures including titanium-tungste...
- Patent number 7,244,671
- Issue date Jul 17, 2007
- Unitive International Limited
- J. Daniels Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical structures including liquid bumps and related methods
- Patent number 7,213,740
- Issue date May 8, 2007
- Unitive International Limited
- Glenn A. Rinne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low temperature methods of bonding components and related structures
- Patent number 7,156,284
- Issue date Jan 2, 2007
- Unitive International Limited
- Glenn A. Rinne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods of providing solder structures for out plane connections
- Patent number 7,049,216
- Issue date May 23, 2006
- Unitive International Limited
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic structures including conductive shunt layers
- Patent number 6,960,828
- Issue date Nov 1, 2005
- Unitive International Limited
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming integrated redistribution routing conductors an...
- Patent number 6,389,691
- Issue date May 21, 2002
- Unitive International Limited
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled-shaped solder reservoirs for increasing the volume of so...
- Patent number 6,392,163
- Issue date May 21, 2002
- Unitive International Limited
- Glenn A. Rinne
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Controlled-shaped solder reservoirs for increasing the volume of so...
- Patent number 6,388,203
- Issue date May 14, 2002
- Unitive International Limited
- Glenn A. Rinne
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Key-shaped solder bumps and under bump metallurgy
- Patent number 6,329,608
- Issue date Dec 11, 2001
- Unitive International Limited
- Glenn A. Rinne
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Solder Structures Including Barrier Layers with Nickel and/or Copper
- Publication number 20090212427
- Publication date Aug 27, 2009
- UNITIVE INTERNATIONAL LIMITED
- J. Daniel Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Structures Including Barrier Layers Defining Lips
- Publication number 20080308931
- Publication date Dec 18, 2008
- UNITIVE INTERNATIONAL LIMITED
- Glenn A. Rinne
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT...
- Publication number 20080026560
- Publication date Jan 31, 2008
- UNITIVE INTERNATIONAL LIMITED
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive Structures Including Titanium-Tungsten Base Layers
- Publication number 20070241460
- Publication date Oct 18, 2007
- UNITIVE INTERNATIONAL LIMITED
- J. Daniels Mis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL STRUCTURES INCLUDING LIQUID BUMPS
- Publication number 20070152020
- Publication date Jul 5, 2007
- UNITIVE INTERNATIONAL LIMITED
- Glenn A. Rinne
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Methods of forming electronic structures including conductive shunt...
- Publication number 20060009023
- Publication date Jan 12, 2006
- UNITIVE INTERNATIONAL LIMITED
- Krishna K. Nair
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature methods of bonding components and related structures
- Publication number 20020074381
- Publication date Jun 20, 2002
- Unitive International Limited
- Glenn A. Rinne
- G02 - OPTICS

Unitive International Limited

Organization

Patents Grantslast 30 patents

Electronic structures including conductive layers comprising copper...

Methods of forming electronic structures including conductive shunt...

Solder structures including barrier layers with nickel and/or copper

Electronic structures including barrier layers defining lips

Electronic devices including metallurgy structures for wire and sol...

Solder structures for out of plane connections

Electronic devices including offset conductive bumps

Conductive structures including titanium-tungsten base layers

Methods of forming lead free solder bumps

Non-Circular via holes for bumping pads and related structures

Stacked electronic structures including offset substrates

Methods of forming bumps using barrier layers as etch masks

Methods of forming electronic structures including conductive shunt...

Methods of forming conductive structures including titanium-tungste...

Optical structures including liquid bumps and related methods

Low temperature methods of bonding components and related structures

Methods of providing solder structures for out plane connections

Electronic structures including conductive shunt layers

Methods for forming integrated redistribution routing conductors an...

Controlled-shaped solder reservoirs for increasing the volume of so...

Controlled-shaped solder reservoirs for increasing the volume of so...

Key-shaped solder bumps and under bump metallurgy

Patents Applicationslast 30 patents

Solder Structures Including Barrier Layers with Nickel and/or Copper

Electronic Structures Including Barrier Layers Defining Lips

METHODS OF FORMING ELECTRONIC STRUCTURES INCLUDING CONDUCTIVE SHUNT...

Conductive Structures Including Titanium-Tungsten Base Layers

OPTICAL STRUCTURES INCLUDING LIQUID BUMPS

Methods of forming electronic structures including conductive shunt...

Low temperature methods of bonding components and related structures

Trademarklast 30 trademarks