UTAC HONG KONG LIMITED

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TSUEN WAN, NT, HK

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Patents Grantslast 30 patents

Information Patent Grant
Ball grid array package with improved thermal characteristics
- Patent number 9,449,903
- Issue date Sep 20, 2016
- UTAC Hong Kong Limited
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless integrated circuit package having standoff contacts and di...
- Patent number 9,305,889
- Issue date Apr 5, 2016
- UTAC Hong Kong Limited
- Kirk Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless array plastic package with various IC packaging configurat...
- Patent number 8,828,801
- Issue date Sep 9, 2014
- UTAC Hong Kong Limited
- John McMillan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless integrated circuit package having standoff contacts and di...
- Patent number 8,736,037
- Issue date May 27, 2014
- UTAC Hong Kong Limited
- Kirk Powell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with improved thermal characteristics
- Patent number 8,610,262
- Issue date Dec 17, 2013
- UTAC Hong Kong Limited
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless array plastic package with various IC packaging configurat...
- Patent number 8,486,762
- Issue date Jul 16, 2013
- UTAC Hong Kong Limited
- John McMillan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having a plurality of spaced apart pad p...
- Patent number 8,330,270
- Issue date Dec 11, 2012
- UTAC Hong Kong Limited
- Geraldine Tsui Yee Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless integrated circuit package having standoff contacts and di...
- Patent number 7,858,443
- Issue date Dec 28, 2010
- UTAC Hong Kong Limited
- Kirk Powell
- H01 - BASIC ELECTRIC ELEMENTS

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Patents Applicationslast 30 patents

Information Patent Application
LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DI...
- Publication number 20140367865
- Publication date Dec 18, 2014
- UTAC Hong Kong Limited
- Kirk POWELL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS
- Publication number 20140183712
- Publication date Jul 3, 2014
- UTAC Hong Kong Limited
- Neil McLellan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURAT...
- Publication number 20120052631
- Publication date Mar 1, 2012
- UTAC Hong Kong Limited
- John Mcmillan
- H01 - BASIC ELECTRIC ELEMENTS

UTAC HONG KONG LIMITED

Organization

Patents Grantslast 30 patents

Ball grid array package with improved thermal characteristics

Leadless integrated circuit package having standoff contacts and di...

Leadless array plastic package with various IC packaging configurat...

Leadless integrated circuit package having standoff contacts and di...

Ball grid array package with improved thermal characteristics

Leadless array plastic package with various IC packaging configurat...

Integrated circuit package having a plurality of spaced apart pad p...

Leadless integrated circuit package having standoff contacts and di...

Patents Applicationslast 30 patents

LEADLESS INTEGRATED CIRCUIT PACKAGE HAVING STANDOFF CONTACTS AND DI...

BALL GRID ARRAY PACKAGE WITH IMPROVED THERMAL CHARACTERISTICS

LEADLESS ARRAY PLASTIC PACKAGE WITH VARIOUS IC PACKAGING CONFIGURAT...