Will Technology Co., Ltd.

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Suwon-si, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming bump of probe card
- Patent number 7,951,302
- Issue date May 31, 2011
- Will Technology Co., Ltd.
- Bong Hwan Kim
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing probe structure
- Patent number 7,824,561
- Issue date Nov 2, 2010
- Will Technology Co., Ltd.
- Bong Hwan Kim
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing cantilever structure of probe card
- Patent number 7,723,143
- Issue date May 25, 2010
- Will Technology Co., Ltd.
- Bong Hwan Kim
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing bump of probe card
- Patent number 7,685,704
- Issue date Mar 30, 2010
- Will Technology Co., Ltd.
- Bong Hwan Kim
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
PROBE CARD AND SEMICONDUCTOR TEST METHOD USING THE SAME
- Publication number 20230221351
- Publication date Jul 13, 2023
- Samsung Electronics Co., Ltd.
- BYUNGWOOK CHOI
- G01 - MEASURING TESTING

Trademarklast 30 trademarks