Xintec Corporation

Organization

Oakland, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
Method for forming chip package with second opening surrounding fir...
- Patent number 11,973,095
- Issue date Apr 30, 2024
- Xintec Inc.
- Kuei-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,942,563
- Issue date Mar 26, 2024
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip structure and manufacturing method thereof
- Patent number 11,935,859
- Issue date Mar 19, 2024
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,873,212
- Issue date Jan 16, 2024
- Xintec Inc.
- Wei-Luen Suen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,784,134
- Issue date Oct 10, 2023
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package including substrate having through hole and redistribu...
- Patent number 11,749,618
- Issue date Sep 5, 2023
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,746,003
- Issue date Sep 5, 2023
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,705,368
- Issue date Jul 18, 2023
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Antenna device and manufacturing method thereof
- Patent number 11,695,199
- Issue date Jul 4, 2023
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package including substrate inclined sidewall and redistributi...
- Patent number 11,521,938
- Issue date Dec 6, 2022
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor removing apparatus and operation method thereof
- Patent number 11,505,457
- Issue date Nov 22, 2022
- Xintec Inc.
- Yu-Tang Shen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Manufacturing method of chip package
- Patent number 11,476,293
- Issue date Oct 18, 2022
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package with substrate having first opening surrounded by seco...
- Patent number 11,450,697
- Issue date Sep 20, 2022
- Xintec Inc.
- Kuei-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,387,201
- Issue date Jul 12, 2022
- Xintec Inc.
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,355,659
- Issue date Jun 7, 2022
- Xintec Inc.
- Po-Han Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,319,208
- Issue date May 3, 2022
- Xintec Inc.
- Tsang-Yu Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Chip structure and manufacturing method thereof
- Patent number 11,309,271
- Issue date Apr 19, 2022
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and power module
- Patent number 11,310,904
- Issue date Apr 19, 2022
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,164,853
- Issue date Nov 2, 2021
- Xintec Inc.
- Chia-Ming Cheng
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Optical chip package and method for forming the same
- Patent number 11,137,559
- Issue date Oct 5, 2021
- Xintec Inc.
- Jiun-Yen Lai
- G02 - OPTICS
Information Patent Grant
Manufacturing method of chip package and chip package
- Patent number 11,121,031
- Issue date Sep 14, 2021
- Xintec Inc.
- Chia-Sheng Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,107,759
- Issue date Aug 31, 2021
- Xintec Inc.
- Wei-Luen Suen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 11,056,427
- Issue date Jul 6, 2021
- Xintec Inc.
- Kuei-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,038,077
- Issue date Jun 15, 2021
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,950,738
- Issue date Mar 16, 2021
- Xintec Inc.
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,833,118
- Issue date Nov 10, 2020
- Xintec Inc.
- Tsang-Yu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 10,714,528
- Issue date Jul 14, 2020
- Xintec Inc.
- Hsin Kuan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure and method for manufacturing semiconductor...
- Patent number 10,461,117
- Issue date Oct 29, 2019
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,446,504
- Issue date Oct 15, 2019
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 10,424,540
- Issue date Sep 24, 2019
- Xintec Inc.
- Yen-Shih Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF MEMS DEVICE
- Publication number 20240351865
- Publication date Oct 24, 2024
- XINTEC INC.
- Jiun-Yen LAI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240304582
- Publication date Sep 12, 2024
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20240178261
- Publication date May 30, 2024
- XINTEC INC.
- Kuei-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240116751
- Publication date Apr 11, 2024
- XINTEC INC.
- Chia-Ming CHENG
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240109769
- Publication date Apr 4, 2024
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420387
- Publication date Dec 28, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20230369151
- Publication date Nov 16, 2023
- XINTEC INC.
- Hsiao-Lan YEH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20230369371
- Publication date Nov 16, 2023
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369362
- Publication date Nov 16, 2023
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369528
- Publication date Nov 16, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230361144
- Publication date Nov 9, 2023
- XINTEC INC.
- Wei-Ming CHIEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAKAGE DETECTING ASSEMBLY AND SHEET LEAKAGE DETECTING MODULE
- Publication number 20230280231
- Publication date Sep 7, 2023
- XINTEC INC.
- Jui Yi KUO
- G01 - MEASURING TESTING
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230238305
- Publication date Jul 27, 2023
- XINTEC INC.
- Ching-Ting PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20230238408
- Publication date Jul 27, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230230933
- Publication date Jul 20, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230081775
- Publication date Mar 16, 2023
- XINTEC INC.
- Hsin-Yi CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20230049126
- Publication date Feb 16, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220384373
- Publication date Dec 1, 2022
- XINTEC INC.
- Chieh CHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20220344396
- Publication date Oct 27, 2022
- XINTEC INC.
- Kuei-Wei CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR REMOVING APPARATUS AND OPERATION METHOD THEREOF
- Publication number 20220332571
- Publication date Oct 20, 2022
- XINTEC INC.
- Yu-Tang SHEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20220285423
- Publication date Sep 8, 2022
- XINTEC INC.
- Tsang-Yu LIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220219970
- Publication date Jul 14, 2022
- XINTEC INC.
- Tsang-Yu LIU
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE STRUCTURE AND SEMICONDUCTOR PACKAGE ASSEMBLY
- Publication number 20220216131
- Publication date Jul 7, 2022
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157762
- Publication date May 19, 2022
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220069454
- Publication date Mar 3, 2022
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE
- Publication number 20210343591
- Publication date Nov 4, 2021
- XINTEC INC.
- Chia-Sheng LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210269303
- Publication date Sep 2, 2021
- XINTEC INC.
- Wei-Luen SUEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CHIP PACKAGE
- Publication number 20210210436
- Publication date Jul 8, 2021
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20210210445
- Publication date Jul 8, 2021
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20210210538
- Publication date Jul 8, 2021
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
97254605 - PROTOUCH
- Serial number 97254605
- Filing date Feb 5, 2022
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
90168840 - OPTICA XT
- Serial number 90168840
- Registration number 6755149
- Filing date Sep 9, 2020
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
87050193 - CONVERGENT LASER TECHNOLOGIES
- Serial number 87050193
- Registration number 5267906
- Filing date May 25, 2016
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
87050190 - OPTILITE
- Serial number 87050190
- Filing date May 25, 2016
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187568 - SUPERPULSE T-1470 LASER
- Serial number 86187568
- Registration number 4697132
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187534 - T-LAP
- Serial number 86187534
- Registration number 4697129
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187466 - T-1470
- Serial number 86187466
- Registration number 4749012
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187501 - SUPERPULSE
- Serial number 86187501
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187516 - T-LEP
- Serial number 86187516
- Registration number 4697128
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187543 - T-TURP
- Serial number 86187543
- Registration number 4697130
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187551 - T-MELA
- Serial number 86187551
- Registration number 4697131
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187491 - CONVERGENT LASER TECHNOLOGIES
- Serial number 86187491
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187479 - PROTOUCH
- Serial number 86187479
- Registration number 4749013
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth
Information Trademark
86187482 - LITETOUCH
- Serial number 86187482
- Registration number 5418473
- Filing date Feb 7, 2014
- Xintec Corporation
- 10 - Surgical, medical, dental and veterinary apparatus and instruments, artificial limbs, eyes and teeth

Xintec Corporation

Organization

Patents Grantslast 30 patents

Method for forming chip package with second opening surrounding fir...

Manufacturing method of chip package and chip package

Chip structure and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package including substrate having through hole and redistribu...

Chip package

Manufacturing method of chip package and chip package

Antenna device and manufacturing method thereof

Chip package including substrate inclined sidewall and redistributi...

Semiconductor removing apparatus and operation method thereof

Manufacturing method of chip package

Chip package with substrate having first opening surrounded by seco...

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Chip structure and manufacturing method thereof

Chip package and power module

Chip package and manufacturing method thereof

Optical chip package and method for forming the same

Manufacturing method of chip package and chip package

Chip package and manufacturing method thereof

Chip package

Chip package and manufacturing method thereof

Chip package and method for forming the same

Chip package and manufacturing method thereof

Chip package and manufacturing method thereof

Semiconductor structure and method for manufacturing semiconductor...

Chip package and method for forming the same

Chip package and method for forming the same

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF MEMS DEVICE

CIRCUIT SUBSTRATE IN CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND METHOD FOR FABRICATING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

LEAKAGE DETECTING ASSEMBLY AND SHEET LEAKAGE DETECTING MODULE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

SEMICONDUCTOR REMOVING APPARATUS AND OPERATION METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE STRUCTURE AND SEMICONDUCTOR PACKAGE ASSEMBLY

CHIP STRUCTURE AND MANUFACTURING METHOD THEREOF

ANTENNA DEVICE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF CHIP PACKAGE AND CHIP PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

Trademarklast 30 trademarks

97254605 - PROTOUCH

90168840 - OPTICA XT

87050193 - CONVERGENT LASER TECHNOLOGIES

87050190 - OPTILITE

86187568 - SUPERPULSE T-1470 LASER

86187534 - T-LAP

86187466 - T-1470

86187501 - SUPERPULSE

86187516 - T-LEP

86187543 - T-TURP

86187551 - T-MELA

86187491 - CONVERGENT LASER TECHNOLOGIES

86187479 - PROTOUCH

86187482 - LITETOUCH