ZIPTRONIX, INC.

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San Jose, CA, US

Organizations

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Patents Grantslast 30 patents

Information Patent Grant
3D IC method and device
- Patent number 9,716,033
- Issue date Jul 25, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 9,698,126
- Issue date Jul 4, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,564,414
- Issue date Feb 7, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional device integration method and integrated device
- Patent number 9,431,368
- Issue date Aug 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,391,143
- Issue date Jul 12, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Room temperature metal direct bonding
- Patent number 9,385,024
- Issue date Jul 5, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,331,149
- Issue date May 3, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 9,184,125
- Issue date Nov 10, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 9,171,756
- Issue date Oct 27, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 9,130,021
- Issue date Sep 8, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 9,082,627
- Issue date Jul 14, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,846,450
- Issue date Sep 30, 2014
- Ziptronix, Inc.
- Qin-yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 8,841,002
- Issue date Sep 23, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Heterogeneous annealing method and device
- Patent number 8,735,219
- Issue date May 27, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D IC method and device
- Patent number 8,709,938
- Issue date Apr 29, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,524,533
- Issue date Sep 3, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Room temperature metal direct bonding
- Patent number 8,426,248
- Issue date Apr 23, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
Information Patent Grant
3D IC method and device
- Patent number 8,389,378
- Issue date Mar 5, 2013
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 8,163,373
- Issue date Apr 24, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,153,505
- Issue date Apr 10, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 8,053,329
- Issue date Nov 8, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Wafer scale die handling
- Patent number 7,956,447
- Issue date Jun 7, 2011
- Ziptronix, Inc.
- Paul M. Enquist
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,871,898
- Issue date Jan 18, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of room temperature covalent bonding
- Patent number 7,862,885
- Issue date Jan 4, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,842,540
- Issue date Nov 30, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,807,549
- Issue date Oct 5, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for low temperature bonding and bonded structure
- Patent number 7,781,307
- Issue date Aug 24, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
Information Patent Grant
Single mask via method and device
- Patent number 7,714,446
- Issue date May 11, 2010
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding hermetic encapsulation
- Patent number 7,622,324
- Issue date Nov 24, 2009
- Ziptronix
- Paul M. Enquist
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Room temperature metal direct bonding
- Patent number 7,602,070
- Issue date Oct 13, 2009
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES
- Publication number 20170338214
- Publication date Nov 23, 2017
- ZIPTRONIX, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20170316971
- Publication date Nov 2, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20170301656
- Publication date Oct 19, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS
- Publication number 20170200711
- Publication date Jul 13, 2017
- ZIPTRONIX, INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING
- Publication number 20170179029
- Publication date Jun 22, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20170170132
- Publication date Jun 15, 2017
- ZIPTRONIX, INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE BARRIER DIRECT HYBRID BONDING
- Publication number 20170062366
- Publication date Mar 2, 2017
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20160322328
- Publication date Nov 3, 2016
- ZIPTRONIX, INC.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20160190093
- Publication date Jun 30, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20160099233
- Publication date Apr 7, 2016
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20160086899
- Publication date Mar 24, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20160086913
- Publication date Mar 24, 2016
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20150340285
- Publication date Nov 26, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20150303263
- Publication date Oct 22, 2015
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE
- Publication number 20150287692
- Publication date Oct 8, 2015
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20150064498
- Publication date Mar 5, 2015
- Ziptronix, Inc.
- Qin-Yi TONG
- B32 - LAYERED PRODUCTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20140370658
- Publication date Dec 18, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140206176
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20140203407
- Publication date Jul 24, 2014
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20140187040
- Publication date Jul 3, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20140061942
- Publication date Mar 6, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROGENEOUS ANNEALING METHOD AND DEVICE
- Publication number 20140061949
- Publication date Mar 6, 2014
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20130233473
- Publication date Sep 12, 2013
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
3D IC METHOD AND DEVICE
- Publication number 20130178062
- Publication date Jul 11, 2013
- Ziptronix, Inc.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20120183808
- Publication date Jul 19, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method For Low Temperature Bonding And Bonded Structure
- Publication number 20120097638
- Publication date Apr 26, 2012
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF ROOM TEMPERATURE COVALENT BONDING
- Publication number 20110143150
- Publication date Jun 16, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE
- Publication number 20110067803
- Publication date Mar 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ROOM TEMPERATURE METAL DIRECT BONDING
- Publication number 20110041329
- Publication date Feb 24, 2011
- Ziptronix, Inc.
- Qin-Yi Tong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE
- Publication number 20100163169
- Publication date Jul 1, 2010
- Ziptronix, Inc.
- Qin-Yi Tong
- H01 - BASIC ELECTRIC ELEMENTS

Trademarklast 30 trademarks

Information Trademark
85361303 - ZIBOND
- Serial number 85361303
- Registration number 4114294
- Filing date Jun 30, 2011
- Ziptronix, Inc.
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
78899459 - DBI
- Serial number 78899459
- Registration number 3324312
- Filing date Jun 2, 2006
- Ziptronix, Inc.
- 42 - Scientific and technological services and research and design relating thereto
Information Trademark
78145187 - ZICON
- Serial number 78145187
- Registration number 2896327
- Filing date Jul 18, 2002
- ZIPTRONIX, INC.
- 40 - Treatment of materials
Information Trademark
78145208 - ZIROC
- Serial number 78145208
- Registration number 2887530
- Filing date Jul 18, 2002
- ZIPTRONIX, INC.
- 40 - Treatment of materials
Information Trademark
78134622 - ZIPRAM
- Serial number 78134622
- Filing date Jun 11, 2002
- Ziptronix, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78134624 - ZIP CHIP
- Serial number 78134624
- Filing date Jun 11, 2002
- ZIPTRONIX, INC.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
78133354 - DROP-ON
- Serial number 78133354
- Filing date Jun 5, 2002
- Ziptronix, Inc.
- 40 - Treatment of materials
Information Trademark
76276767 - GATEWAY TO 3-D ELECTRONICS
- Serial number 76276767
- Filing date Jun 26, 2001
- Ziptronix, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76154114 - ZIPTRONIX
- Serial number 76154114
- Filing date Oct 26, 2000
- Ziptronix, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments
Information Trademark
76154501 - ZIPTRONIX
- Serial number 76154501
- Registration number 2813405
- Filing date Oct 26, 2000
- Ziptronix, Inc.
- 9 - Scientific, nautical, surveying, photographic, cinematographic, optical, weighing, measuring, signalling, checking (supervision), life-saving and teaching apparatus and instruments

ZIPTRONIX, INC.

Organization

Patents Grantslast 30 patents

3D IC method and device

Heterogeneous annealing method and device

Three dimensional device integration method and integrated device

Three dimensional device integration method and integrated device

Method for low temperature bonding and bonded structure

Room temperature metal direct bonding

Method for low temperature bonding and bonded structure

Heterogeneous annealing method and device

3D IC method and device

3D IC method and device

Method for low temperature bonding and bonded structure

Room temperature metal direct bonding

Method of room temperature covalent bonding

Heterogeneous annealing method and device

3D IC method and device

Room temperature metal direct bonding

Room temperature metal direct bonding

3D IC method and device

Method of room temperature covalent bonding

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Wafer scale die handling

Method for low temperature bonding and bonded structure

Method of room temperature covalent bonding

Room temperature metal direct bonding

Method for low temperature bonding and bonded structure

Method for low temperature bonding and bonded structure

Single mask via method and device

Wafer bonding hermetic encapsulation

Room temperature metal direct bonding

Patents Applicationslast 30 patents

STACKED DIES AND METHODS FOR FORMING BONDED STRUCTURES

3D IC METHOD AND DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

SYSTEMS AND METHODS FOR EFFICIENT TRANSFER OF SEMICONDUCTOR ELEMENTS

INCREASED CONTACT ALIGNMENT TOLERANCE FOR DIRECT BONDING

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

CONDUCTIVE BARRIER DIRECT HYBRID BONDING

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

ROOM TEMPERATURE METAL DIRECT BONDING

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

3D IC METHOD AND DEVICE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

THREE DIMENSIONAL DEVICE INTEGRATION METHOD AND INTEGRATED DEVICE

METHOD OF ROOM TEMPERATURE COVALENT BONDING

ROOM TEMPERATURE METAL DIRECT BONDING

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

3D IC METHOD AND DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

HETEROGENEOUS ANNEALING METHOD AND DEVICE

ROOM TEMPERATURE METAL DIRECT BONDING

3D IC METHOD AND DEVICE

METHOD OF ROOM TEMPERATURE COVALENT BONDING

Method For Low Temperature Bonding And Bonded Structure

METHOD OF ROOM TEMPERATURE COVALENT BONDING

METHOD FOR LOW TEMPERATURE BONDING AND AND BONDED STRUCTURE

ROOM TEMPERATURE METAL DIRECT BONDING

METHOD FOR LOW TEMPERATURE BONDING AND BONDED STRUCTURE

Trademarklast 30 trademarks

85361303 - ZIBOND

78899459 - DBI

78145187 - ZICON

78145208 - ZIROC

78134622 - ZIPRAM

78134624 - ZIP CHIP

78133354 - DROP-ON

76276767 - GATEWAY TO 3-D ELECTRONICS

76154114 - ZIPTRONIX

76154501 - ZIPTRONIX