Aaron Fellis

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Suppressing interfacial reactions by varying the wafer temperature...
- Patent number 11,075,127
- Issue date Jul 27, 2021
- Lam Research Corporation
- Seshasayee Varadarajan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Suppressing interfacial reactions by varying the wafer temperature...
- Patent number 10,347,547
- Issue date Jul 9, 2019
- Lam Research Corporation
- Seshasayee Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatuses for atomic layer cleaning of contacts and vias
- Patent number 9,362,163
- Issue date Jun 7, 2016
- Lam Research Corporation
- Michal Danek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Depositing tungsten into high aspect ratio features
- Patent number 9,034,768
- Issue date May 19, 2015
- Novellus Systems, Inc.
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Depositing tungsten into high aspect ratio features
- Patent number 8,835,317
- Issue date Sep 16, 2014
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tungsten barrier and seed for copper filled TSV
- Patent number 8,709,948
- Issue date Apr 29, 2014
- Novellus Systems, Inc.
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive patterning to define circuit components
- Patent number 8,617,982
- Issue date Dec 31, 2013
- Novellus Systems, Inc.
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositing tungsten into high aspect ratio features
- Patent number 8,435,894
- Issue date May 7, 2013
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositing tungsten into high aspect ratio features
- Patent number 8,124,531
- Issue date Feb 28, 2012
- Novellus Systems, Inc.
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Depositing tungsten into high aspect ratio features
- Patent number 8,119,527
- Issue date Feb 21, 2012
- Novellus Systems, Inc.
- Anand Chadrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of forming low-resistivity tungsten interconnects
- Patent number 7,262,125
- Issue date Aug 28, 2007
- Novellus Systems, Inc.
- Panya Wongsenakhum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for reducing tungsten film roughness and improving step cove...
- Patent number 7,141,494
- Issue date Nov 28, 2006
- Novellus Systems, Inc.
- Sang-Hyeob Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH PRESSURE PLASMA INHIBITION
- Publication number 20250062118
- Publication date Feb 20, 2025
- LAM RESEARCH CORPORATION
- Dustin Zachary Austin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPPRESSING INTERFACIAL REACTIONS BY VARYING THE WAFER TEMPERATURE...
- Publication number 20200066607
- Publication date Feb 27, 2020
- LAM RESEARCH CORPORATION
- Seshasayee Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUPPRESSING INTERFACIAL REACTIONS BY VARYING THE WAFER TEMPERATURE...
- Publication number 20180047645
- Publication date Feb 15, 2018
- LAM RESEARCH CORPORATION
- Seshasayee Varadarajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUSES FOR ATOMIC LAYER CLEANING OF CONTACTS AND VIAS
- Publication number 20150037972
- Publication date Feb 5, 2015
- LAM RESEARCH CORPORATION
- Michal Danek
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DEPOSITING TUNGSTEN INTO HIGH ASPECT RATIO FEATURES
- Publication number 20130330926
- Publication date Dec 12, 2013
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITING TUNGSTEN INTO HIGH ASPECT RATIO FEATURES
- Publication number 20120115329
- Publication date May 10, 2012
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE PATTERNING TO DEFINE CIRCUIT COMPONENTS
- Publication number 20120080793
- Publication date Apr 5, 2012
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Depositing Tungsten Into High Aspect Ratio Features
- Publication number 20120009785
- Publication date Jan 12, 2012
- Anand Chandrashekar
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
TUNGSTEN BARRIER AND SEED FOR COPPER FILLED TSV
- Publication number 20110221044
- Publication date Sep 15, 2011
- Michal Danek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITING TUNGSTEN INTO HIGH ASPECT RATIO FEATURES
- Publication number 20110159690
- Publication date Jun 30, 2011
- Anand Chandrashekar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for reducing tungsten film roughness and improving step cove...
- Publication number 20050031786
- Publication date Feb 10, 2005
- Novellus Systems, Inc.
- Sang-Hyeob Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming low-resistivity tungsten interconnects
- Publication number 20040202786
- Publication date Oct 14, 2004
- Novellus Systems, Inc.
- Panya Wongsenakhum
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Aaron Fellis

Person

Patents Grantslast 30 patents

Suppressing interfacial reactions by varying the wafer temperature...

Suppressing interfacial reactions by varying the wafer temperature...

Methods and apparatuses for atomic layer cleaning of contacts and vias

Depositing tungsten into high aspect ratio features

Depositing tungsten into high aspect ratio features

Tungsten barrier and seed for copper filled TSV

Subtractive patterning to define circuit components

Depositing tungsten into high aspect ratio features

Depositing tungsten into high aspect ratio features

Depositing tungsten into high aspect ratio features

Method of forming low-resistivity tungsten interconnects

Method for reducing tungsten film roughness and improving step cove...

Patents Applicationslast 30 patents

HIGH PRESSURE PLASMA INHIBITION

SUPPRESSING INTERFACIAL REACTIONS BY VARYING THE WAFER TEMPERATURE...

SUPPRESSING INTERFACIAL REACTIONS BY VARYING THE WAFER TEMPERATURE...

METHODS AND APPARATUSES FOR ATOMIC LAYER CLEANING OF CONTACTS AND VIAS

DEPOSITING TUNGSTEN INTO HIGH ASPECT RATIO FEATURES

DEPOSITING TUNGSTEN INTO HIGH ASPECT RATIO FEATURES

SUBTRACTIVE PATTERNING TO DEFINE CIRCUIT COMPONENTS

Depositing Tungsten Into High Aspect Ratio Features

TUNGSTEN BARRIER AND SEED FOR COPPER FILLED TSV

DEPOSITING TUNGSTEN INTO HIGH ASPECT RATIO FEATURES

Method for reducing tungsten film roughness and improving step cove...

Method of forming low-resistivity tungsten interconnects