Abram Marc Castro

Person

Fort Worth, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 12,087,673
- Issue date Sep 10, 2024
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with a vertical connector
- Patent number 11,854,947
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic device package and method of making
- Patent number 11,838,004
- Issue date Dec 5, 2023
- Texas Instruments Incorporated
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit package electronic device
- Patent number 11,552,005
- Issue date Jan 10, 2023
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
QFN device having a mechanism that enables an inspectable solder jo...
- Patent number 11,495,524
- Issue date Nov 8, 2022
- Texas Instruments Incorporated
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package electronic device including pillar conta...
- Patent number 11,088,052
- Issue date Aug 10, 2021
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip with a vertical connector
- Patent number 10,804,185
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,756,013
- Issue date Aug 25, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit package...
- Patent number 10,727,085
- Issue date Jul 28, 2020
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor system having unidirectional connections to...
- Patent number 10,566,276
- Issue date Feb 18, 2020
- Texas Instruments Incorporated
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed adhesion deposition to mitigate integrated circuit delamina...
- Patent number 10,347,508
- Issue date Jul 9, 2019
- Texas Instruments Incorporated
- Yong Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Acoustic device package and method of making
- Patent number 10,284,172
- Issue date May 7, 2019
- Texas Instruments Incorporated
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Plastic-packaged semiconductor device having wires with polymerized...
- Patent number 10,199,348
- Issue date Feb 5, 2019
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of packaging a circuit
- Patent number 9,875,930
- Issue date Jan 23, 2018
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,780,017
- Issue date Oct 3, 2017
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing die pad delamination
- Patent number 9,601,414
- Issue date Mar 21, 2017
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit
- Patent number 9,536,781
- Issue date Jan 3, 2017
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged device with additive substrate surface modification
- Patent number 9,524,926
- Issue date Dec 20, 2016
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging a semiconductor device having wires with polymerized insu...
- Patent number 9,378,984
- Issue date Jun 28, 2016
- Texas Instruments Incorporated
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Packaged semiconductor device having leadframe features as pressure...
- Patent number 9,305,869
- Issue date Apr 5, 2016
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for preventing die pad delamination
- Patent number 9,214,440
- Issue date Dec 15, 2015
- Texas Instruments Incorporated
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and method of making
- Patent number 9,142,472
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor flip-chip system having oblong connectors and reduced...
- Patent number 9,129,955
- Issue date Sep 8, 2015
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 8,530,360
- Issue date Sep 10, 2013
- Texas Instruments Incorporated
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged system of semiconductor chips having a semiconductor inter...
- Patent number 8,133,761
- Issue date Mar 13, 2012
- Texas Instruments Incorporated
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for low stress flip-chip assembly of fine-pitch semiconducto...
- Patent number 7,898,083
- Issue date Mar 1, 2011
- Texas Instruments Incorporated
- Abram M Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packed system of semiconductor chips having a semiconductor interposer
- Patent number 7,573,139
- Issue date Aug 11, 2009
- Texas Instruments Incorporated
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package-on-package system including integrated passiv...
- Patent number 7,569,918
- Issue date Aug 4, 2009
- Texas Instruments Incorporated
- Mark A. Gerber
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packaged system of semiconductor chips having a semiconductor inter...
- Patent number 7,390,700
- Issue date Jun 24, 2008
- Texas Instruments Incorporated
- Mark A. Gerber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical circuit and method of formation
- Patent number 6,801,438
- Issue date Oct 5, 2004
- Touch Future Technolocy Ltd.
- Abram M. Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...
- Publication number 20230057405
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Abram Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ELECTRONIC DEVICE
- Publication number 20210366811
- Publication date Nov 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- ABRAM M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH A VERTICAL CONNECTOR
- Publication number 20210028093
- Publication date Jan 28, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...
- Publication number 20200185323
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE ELECTRONIC DEVICE
- Publication number 20200020615
- Publication date Jan 16, 2020
- TEXAS INSTRUMENTS INCORPORATED
- ABRAM M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...
- Publication number 20190378783
- Publication date Dec 12, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Abram Castro
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Acoustic Device Package And Method Of Making
- Publication number 20190214964
- Publication date Jul 11, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...
- Publication number 20190139883
- Publication date May 9, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Saumya Gandhi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170271174
- Publication date Sep 21, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT CHIP WITH A VERTICAL CONNECTOR
- Publication number 20170194233
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...
- Publication number 20170194170
- Publication date Jul 6, 2017
- TEXAS INSTRUMENTS INCORPORATED
- YONG LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged Device with Additive Substrate Surface Modification
- Publication number 20170053854
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ACOUSTIC DEVICE PACKAGE AND METHOD OF MAKING
- Publication number 20160322557
- Publication date Nov 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Enis Tuncer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSU...
- Publication number 20160307866
- Publication date Oct 20, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PREVENTING DIE PAD DELAMINATION
- Publication number 20160181183
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION
- Publication number 20160093558
- Publication date Mar 31, 2016
- TEXAS INSTRUMENTS INCORPORATED
- BENJAMIN STASSEN COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP LED PACKAGE
- Publication number 20160064630
- Publication date Mar 3, 2016
- TEXAS INSTRUMENTS INCORPORATED
- ABRAM CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING NON-CIRCULAR CONNECTORS
- Publication number 20150371963
- Publication date Dec 24, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. Castro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING INTEGRATED CIRCUIT
- Publication number 20150357238
- Publication date Dec 10, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A CIRCUIT
- Publication number 20150111344
- Publication date Apr 23, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSU...
- Publication number 20150037938
- Publication date Feb 5, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASTIC-PACKAGED SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED...
- Publication number 20130277816
- Publication date Oct 24, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Method for Preventing Corrosion of Copper-Aluminum Intermetallic Co...
- Publication number 20130277825
- Publication date Oct 24, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Rongwei Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075890
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075928
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND METHOD OF MAKING
- Publication number 20130075894
- Publication date Mar 28, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Bernardo Gallegos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...
- Publication number 20110143502
- Publication date Jun 16, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Flip-Chip System Having Oblong Connectors and Reduced...
- Publication number 20100193944
- Publication date Aug 5, 2010
- Texas Instrument Incorporated
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR LOW STRESS FLIP-CHIP ASSEMBLY OF FINE-PITCH SEMICONDUCTO...
- Publication number 20100148374
- Publication date Jun 17, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Abram M. CASTRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Package System Vertical Interconnect
- Publication number 20100084755
- Publication date Apr 8, 2010
- Mark Allen Gerber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Abram Marc Castro

Person

Patents Grantslast 30 patents

QFN device having a mechanism that enables an inspectable solder jo...

Integrated circuit chip with a vertical connector

Acoustic device package and method of making

Integrated circuit package electronic device

QFN device having a mechanism that enables an inspectable solder jo...

Integrated circuit package electronic device including pillar conta...

Integrated circuit chip with a vertical connector

Packaged semiconductor system having unidirectional connections to...

Printed adhesion deposition to mitigate integrated circuit package...

Packaged semiconductor system having unidirectional connections to...

Printed adhesion deposition to mitigate integrated circuit delamina...

Acoustic device package and method of making

Plastic-packaged semiconductor device having wires with polymerized...

Method of packaging a circuit

Packaged device with additive substrate surface modification

Method for preventing die pad delamination

Method of making integrated circuit

Packaged device with additive substrate surface modification

Packaging a semiconductor device having wires with polymerized insu...

Packaged semiconductor device having leadframe features as pressure...

Method for preventing die pad delamination

Integrated circuit and method of making

Semiconductor flip-chip system having oblong connectors and reduced...

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Packaged system of semiconductor chips having a semiconductor inter...

Method for low stress flip-chip assembly of fine-pitch semiconducto...

Packed system of semiconductor chips having a semiconductor interposer

Semiconductor package-on-package system including integrated passiv...

Packaged system of semiconductor chips having a semiconductor inter...

Electrical circuit and method of formation

Patents Applicationslast 30 patents

QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...

INTEGRATED CIRCUIT PACKAGE ELECTRONIC DEVICE

INTEGRATED CIRCUIT CHIP WITH A VERTICAL CONNECTOR

PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...

INTEGRATED CIRCUIT PACKAGE ELECTRONIC DEVICE

QFN Device Having A Mechanism That Enables An Inspectable Solder Jo...

Acoustic Device Package And Method Of Making

PACKAGED SEMICONDUCTOR SYSTEM HAVING UNIDIRECTIONAL CONNECTIONS TO...

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

INTEGRATED CIRCUIT CHIP WITH A VERTICAL CONNECTOR

PRINTED ADHESION DEPOSITION TO MITIGATE INTEGRATED CIRCUIT DELAMINA...

Packaged Device with Additive Substrate Surface Modification

ACOUSTIC DEVICE PACKAGE AND METHOD OF MAKING

PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSU...

METHOD FOR PREVENTING DIE PAD DELAMINATION

PACKAGED DEVICE WITH ADDITIVE SUBSTRATE SURFACE MODIFICATION

FLIP CHIP LED PACKAGE

SEMICONDUCTOR DEVICE HAVING NON-CIRCULAR CONNECTORS

METHOD OF MAKING INTEGRATED CIRCUIT

METHOD OF FABRICATING A CIRCUIT

PACKAGING A SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED INSU...

PLASTIC-PACKAGED SEMICONDUCTOR DEVICE HAVING WIRES WITH POLYMERIZED...

Method for Preventing Corrosion of Copper-Aluminum Intermetallic Co...

INTEGRATED CIRCUIT AND METHOD OF MAKING

INTEGRATED CIRCUIT AND METHOD OF MAKING

INTEGRATED CIRCUIT AND METHOD OF MAKING

Method for Low Stress Flip-Chip Assembly of Fine-Pitch Semiconducto...

Semiconductor Flip-Chip System Having Oblong Connectors and Reduced...

METHOD FOR LOW STRESS FLIP-CHIP ASSEMBLY OF FINE-PITCH SEMICONDUCTO...

Semiconductor Chip Package System Vertical Interconnect