Adrian Boyle

Person

Kildare, IE

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for processing image data
- Patent number 10,943,321
- Issue date Mar 9, 2021
- CATHX RESEARCH LTD.
- Adrian Boyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and system for calibrating imaging system
- Patent number 10,930,013
- Issue date Feb 23, 2021
- CATHX OCEAN LIMITED
- Adrian Boyle
- G01 - MEASURING TESTING
Information Patent Grant
3D point clouds
- Patent number 10,163,213
- Issue date Dec 25, 2018
- CATHX RESEARCH LTD
- Adrian Boyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Processing survey data of an underwater scene
- Patent number 10,158,793
- Issue date Dec 18, 2018
- CATHX RESEARCH LTD.
- Adrian Boyle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Gathering range and dimensional information for underwater surveys
- Patent number 10,116,842
- Issue date Oct 30, 2018
- CATHX RESEARCH LTD.
- Adrian Boyle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Relation to underwater imaging for underwater surveys
- Patent number 10,116,841
- Issue date Oct 30, 2018
- CATHX RESEARCH LTD.
- Adrian Boyle
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Increasing die strength by etching during or after dicing
- Patent number 9,352,417
- Issue date May 31, 2016
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dicing a semiconductor wafer
- Patent number 8,551,792
- Issue date Oct 8, 2013
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and systems for laser machining a substrate
- Patent number 8,048,774
- Issue date Nov 1, 2011
- Electro Scientific Industries, Inc.
- Adrian A. Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Die bonding
- Patent number 7,989,320
- Issue date Aug 2, 2011
- Electro Scientific Industries, Inc.
- Adrian Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser machining system and method
- Patent number 7,887,712
- Issue date Feb 15, 2011
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Program-controlled dicing of a substrate using a pulsed laser
- Patent number 7,776,720
- Issue date Aug 17, 2010
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Machine vision
- Patent number 6,983,066
- Issue date Jan 3, 2006
- MV Research Limited
- James Mahon
- G01 - MEASURING TESTING
Information Patent Grant
Laser machining of semiconductor materials
- Patent number 6,841,482
- Issue date Jan 11, 2005
- Xsil Technology Limited
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit singulation system and method
- Patent number 6,781,093
- Issue date Aug 24, 2004
- Xsil Technology Limited
- Peter Conlon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Material inspection
- Patent number 6,697,151
- Issue date Feb 24, 2004
- MV Research Limited
- Mark Owen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microvia inspection system
- Patent number 6,697,154
- Issue date Feb 24, 2004
- MV Research Limited
- Mark Douglas Owen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Measurement system having a camera with a lens and a separate sensor
- Patent number 6,671,397
- Issue date Dec 30, 2003
- MV Research Limited
- James Mahon
- G01 - MEASURING TESTING
Information Patent Grant
Control of laser machining
- Patent number 6,586,707
- Issue date Jul 1, 2003
- Xsil Technology Limited
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Method and System for Calibrating Imaging System
- Publication number 20200105019
- Publication date Apr 2, 2020
- Cathx Ocean Limited
- Adrian Boyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND SYSTEM FOR PROCESSING IMAGE DATA
- Publication number 20190019266
- Publication date Jan 17, 2019
- Cathx Research Ltd
- Adrian Boyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
3D POINT CLOUDS
- Publication number 20170046845
- Publication date Feb 16, 2017
- CATHX RESEARCH LTD
- Adrian Boyle
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
UNDERWATER SURVEYS
- Publication number 20170048494
- Publication date Feb 16, 2017
- CATHX RESEARCH LTD
- Adrian Boyle
- G01 - MEASURING TESTING
Information Patent Application
IMPROVEMENTS IN RELATION TO UNDERWATER IMAGING FOR UNDERWATER SURVEYS
- Publication number 20160198074
- Publication date Jul 7, 2016
- Cathx Research Ltd.
- Adrian Boyle
- B60 - VEHICLES IN GENERAL
Information Patent Application
IMPROVEMENTS IN AND RELATING TO GATHERING RANGE AND DIMENSIONAL INF...
- Publication number 20160198069
- Publication date Jul 7, 2016
- Cathx Research Ltd.
- Adrian Boyle
- G01 - MEASURING TESTING
Information Patent Application
PROCESSING SURVEY DATA OF AN UNDERWATER SCENE
- Publication number 20150363914
- Publication date Dec 17, 2015
- Adrian BOYLE
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAM
- Publication number 20140231393
- Publication date Aug 21, 2014
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAM
- Publication number 20120264238
- Publication date Oct 18, 2012
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DICING A SEMICONDUCTOR WAFER
- Publication number 20120064695
- Publication date Mar 15, 2012
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROCESSING OF MULTILAYER SEMICONDUCTOR WAFERS
- Publication number 20110177674
- Publication date Jul 21, 2011
- Electro Scientific Industries, Inc.
- Aleksej Rodin
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAM
- Publication number 20110029124
- Publication date Feb 3, 2011
- Electro Scientific Industries, Inc.
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Increasing Die Strength by Etching During or After Dicing
- Publication number 20090191690
- Publication date Jul 30, 2009
- XSIL TECHNOLOGY LIMITED
- Adrian Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Bonding
- Publication number 20070224733
- Publication date Sep 27, 2007
- Adrian Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser machining using an active assist gas
- Publication number 20060249480
- Publication date Nov 9, 2006
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining
- Publication number 20060163209
- Publication date Jul 27, 2006
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Program-controlled dicing of a substrate using a pulsed laser
- Publication number 20050236378
- Publication date Oct 27, 2005
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Machining substrates, particulary semiconductor wafers
- Publication number 20040259329
- Publication date Dec 23, 2004
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Circuit singulation system and method
- Publication number 20040020901
- Publication date Feb 5, 2004
- Peter Conlon
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining system and method
- Publication number 20020170891
- Publication date Nov 21, 2002
- Adrian Boyle
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Machine vision
- Publication number 20020114505
- Publication date Aug 22, 2002
- James Mahon
- G01 - MEASURING TESTING
Information Patent Application
Control of laser machining
- Publication number 20020088780
- Publication date Jul 11, 2002
- Adrian Boyle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Laser machining of semiconductor materials
- Publication number 20020086544
- Publication date Jul 4, 2002
- Adrian Boyle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Material inspection
- Publication number 20020053589
- Publication date May 9, 2002
- Mark D. Owen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Microvia inspection system
- Publication number 20020027654
- Publication date Mar 7, 2002
- Mark Douglas Owen
- G01 - MEASURING TESTING

Adrian Boyle

Person

Patents Grantslast 30 patents

Method and system for processing image data

Method and system for calibrating imaging system

3D point clouds

Processing survey data of an underwater scene

Gathering range and dimensional information for underwater surveys

Relation to underwater imaging for underwater surveys

Increasing die strength by etching during or after dicing

Dicing a semiconductor wafer

Methods and systems for laser machining a substrate

Die bonding

Laser machining system and method

Program-controlled dicing of a substrate using a pulsed laser

Machine vision

Laser machining of semiconductor materials

Circuit singulation system and method

Material inspection

Microvia inspection system

Measurement system having a camera with a lens and a separate sensor

Control of laser machining

Patents Applicationslast 30 patents

Method and System for Calibrating Imaging System

METHOD AND SYSTEM FOR PROCESSING IMAGE DATA

3D POINT CLOUDS

UNDERWATER SURVEYS

IMPROVEMENTS IN RELATION TO UNDERWATER IMAGING FOR UNDERWATER SURVEYS

IMPROVEMENTS IN AND RELATING TO GATHERING RANGE AND DIMENSIONAL INF...

PROCESSING SURVEY DATA OF AN UNDERWATER SCENE

PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAM

PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAM

DICING A SEMICONDUCTOR WAFER

PROCESSING OF MULTILAYER SEMICONDUCTOR WAFERS

PROGRAM CONTROLLED DICING OF A SUBSTRATE USING A PULSED LASER BEAM

Increasing Die Strength by Etching During or After Dicing

Die Bonding

Laser machining using an active assist gas

Laser machining

Program-controlled dicing of a substrate using a pulsed laser

Machining substrates, particulary semiconductor wafers

Circuit singulation system and method

Laser machining system and method

Machine vision

Control of laser machining

Laser machining of semiconductor materials

Material inspection

Microvia inspection system